DLA SMD-5962-78017 REV G-2006 MICROCIRCUIT DIGITAL BIPOLAR MICROPROGRAM CONTROLLER MONOLITHIC SILICON《硅单片微程序控制器 双极数字微型电路》.pdf

《DLA SMD-5962-78017 REV G-2006 MICROCIRCUIT DIGITAL BIPOLAR MICROPROGRAM CONTROLLER MONOLITHIC SILICON《硅单片微程序控制器 双极数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-78017 REV G-2006 MICROCIRCUIT DIGITAL BIPOLAR MICROPROGRAM CONTROLLER MONOLITHIC SILICON《硅单片微程序控制器 双极数字微型电路》.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Convert to military drawing format. Add vendor CAGE number 50088 to drawing. Changed code identification number to 67268. 87-11-12 R. P. Evans E Add vendor CAGE code 3V146. Update boilerplate to MIL-PRF-38535 requirements. Add QD device type crit

2、eria. - LTG 03-08-26 Thomas M. Hess F Correct marking requirements in 3.5. Update boilerplate in accordance with MIL-PRF-38535 requirements. Editorial change throughout. - PHN 05-02-17 Thomas M. Hess G Correct terminal names for terminal number 17 and 18 in case outline Z. - PHN 06-08-16 Thomas M. H

3、ess THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G E F F E E E F G F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY James E. Jamison STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Di Cenzo DEFENSE SUPPLY

4、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Robert P. Evans AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-03-14 MICROCIRCUIT, DIGITAL, BIPOLAR, MICROPROGRAM CONTROLLER, MONOLITHIC SILICON SIZE

5、 A CAGE CODE 67268 78017 AMSC N/A REVISION LEVEL G SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E593-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE

6、VISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following

7、 example: 78017 01 Q A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 2910 Microprogram controller 02 2910A Microprogram controller

8、1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line Z See figure 2 42 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendi

9、x A. 1.3 Absolute maximum ratings. 1/ Supply voltage to ground potential -0.5 V dc to +7.0 V dc Input voltage range . -0.5 V dc to +5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD) 1/ . 1.9 W Thermal resistance, junction-to-case (JC): Case Q See MIL-STD-1835 Case Z 2

10、5C/W Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +200C Output current, into outputs . 30 mA dc Input current -30 mA dc to +5.0 mA dc 1.4 Recommended operating conditions. Supply voltage (VCC) 4.5 V dc minimum to 5.5 V dc maximum 1/ Must withstand the added PDdue to short

11、 circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1

12、Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECI

13、FICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Stand

14、ard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-50

15、94.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIR

16、EMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacture

17、r or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM

18、) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the Q

19、ML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, constructi

20、on, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Switching and tim

21、ing waveforms. The switching and timing waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. P

22、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test re

23、quirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may als

24、o be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify whe

25、n the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturers QM plan, the “QD” certification mark shall be used in place of the “Q” or “QML” certification mark. 3.6 Certificate of compliance. A certificate of compliance shall be re

26、quired from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535,

27、appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required fo

28、r any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provi

29、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test

30、 Symbol Conditions 1/ Device type Group A subgroups Min Max Unit High level output voltage VOHVCC= 4.5 V, IOH= -1.6 mA VIN= VIHor VILAll 1, 2, 3 2.4 V Y0 11, IOL= 12 mA All Low level output voltage VOLVCC= 4.5 V VIN= VIHor VILPL, VECT, MAP, FULL, IOL= 8 mA All 1, 2, 3 0.5 V Input clamp voltage VICVC

31、C= 4.5 V, IIN= -18 mA All 1, 2, 3 -1.5 V D0 11All -0.87 CI, CCEN All -0.54 I0 3, OE, RLD All -0.72 CC All -1.31 Low level input current IILVCC= 5.5 V VIN= 0.5 V CP All 1, 2, 3 -2.14 mA D0 11All 80 CI, CCEN All 30 I0 3, OE, RLD All 40 CC All 50 High level input current IIHVCC= 5.5 V VIN= 2.7 V CP All

32、 1, 2, 3 100 A Input current at maximum input voltage IIVCC= 5.5 V, VIN= 5.5 V All 1, 2, 3 1.0 mA Output short circuit current 2/ IOSVCC= 5.5 V All 1, 2, 3 -30 -85 mA Off-state output current, low level voltage applied IOZLVCC= 5.5 V, VOUT= 0.5 V OE = 2.4 V All 1, 2, 3 -50 A Off-state output current

33、, high level voltage applied IOZHVCC= 5.5 V, OE = VOUT= 2.4 V All 1, 2, 3 50 A TC= +25C All 340 TC= -55C All 340 Supply current ICCVCC= 5.5 V TC= +125C All 1, 2, 3 280 mA Functional test See 4.3.1c All 7, 8 01 28 Direct input to register/ counter setup time tDR02 9, 10, 11 16 ns 01 62 Direct input t

34、o microprogram address counter setup time tDPC 02 9, 10, 11 30 ns 01 110 Instruction setup time tI02 9, 10, 11 38 ns 01 86 Condition code setup time tCCICL= pF 3/ 02 9, 10, 11 35 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

35、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Unit Test Symbol Conditions 1/ Device type Group A subgroups Min Max 01 86

36、 Condition code enable setup time t1CCEN 02 9, 10, 11 35 ns 01 58 Carry-in setup time tCI02 9, 10, 11 18 ns 01 42 Register load to setup time tRLD02 9, 10, 11 20 ns Direct input to address output tDYAll 9, 10, 11 25 ns 01 75 Instruction input to address output tIY02 9, 10, 11 40 ns 01 48 Condition c

37、ode to any output t2CC02 9, 10, 11 36 ns 01 50 Condition code enable to any output t2CCENCL= 50 pF 3/ 02 9, 10, 11 36 ns 01 130 106 I = 8, 9, 15 4/ 02 46 01 61 Clock pulse to any output tCPAll other I 02 9, 10, 11 46 ns 01 40 Enable 02 25 01 30 Enable/disable input to any output 5/ tOEDisable 02 9,

38、10, 11 30 ns 01 58 Clock LOW time tCLKL CL= 50 pF 6/ 02 9, 10, 11 25 ns 01 42 Clock HIGH time tCLKHCL= 50 pF 6/ 02 9, 10, 11 25 ns 01 58 Instruction input to PL, VECT, MAP outputs tIPVM02 9, 10, 11 35 ns 01 67 Clock pulse to FULL for all instructions tCPF02 9, 10, 11 35 ns 01 6 Register load to hold

39、 time 7/ tHRLD 02 9, 10, 11 0 ns 01 6 Direct input to register/ counter hold time 7/ tHDR02 9, 10, 11 0 ns 01 4 Direct input to microprogram address counter hold time 7/ tHDPCCL= 50 pF 3/ 02 9, 10, 11 0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking perm

40、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions Device type Group A subgroups Limi

41、ts Unit Min Max01 0 Instruction hold time 7/ tHI02 9, 10, 11 0 ns 01 0 Condition code hold time 7/ tHCCI02 9, 10, 11 0 ns 01 0 Condition code enable hold time 7/ t1HCCEN 02 9, 10, 11 0 ns 01 5 Carry-in hold time 7/ tHCICL= 50 pF 3/ 02 9, 10, 11 0 ns 1/ Unless otherwise specified, TC= -55C to +125C a

42、nd VCC= 4.5 V dc to 5.5 V dc. 2/ Not more than one output should be shorted at a time. Duration of the short circuit test should not exceed one second. 3/ See figure 3. 4/ For device type 01 only, these instructions are conditional on the counter. Use the shorter specified delay time if the previous

43、 instruction could produce no change in the counter or could only decrement the counter. Use the longer delays from CP to outputs if the instruction prior to the clock was 4 or 12 or RLD was low. 5/ Enable/disable: Disable times measured to 0.5 V change on the output voltage level with CL= 5.0 pF 6/

44、 Clock periods for other instructions are determined by external conditions. 7/ Guaranteed by design, if not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

45、HIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 Case Z Millimeters Inches Symbol Min Max Min Max Notes A 1.78 2.92 .070 .115 b 0.43 0.58 .017 .023 5 c 0.15 0.30 .006 .012 5 D 26.16 27.69 1.030 1.090 E 15.24 16.76 .600 .660 E117.53 .690 3 e 1.14 1.40 .045 .055 4, 6 L 6.35 9.40 .250 .370

46、 L133.02 34.80 1.280 1.370 R 0.51 1.14 .020 .060 2 S 1.02 .005 7 NOTES: 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one and shall be within the shaded area shown. The manufacturers identification shall not be used as a pin one identification mark. 2. Dime

47、nsion R shall be measured at the point of exit of the lead from the body. 3. This dimension allows for off-center lid, meniscus and glass overrun. 4. The basic pin spacing is .050 (1.27 mm) between centerlines. Each pin centerline shall be located within .005 (0.13 mm) of its exact logitudinal posit

48、ion relative to pins 1 and 42. 5. All leads increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A is applied. 6. Forty spaces. 7. Applies to all four corners (leads number 1, 21, 22, and 42). 8. Optional configuration. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,