DLA SMD-5962-77034 REV X-2006 MICROCIRCUIT LINEAR ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON《硅单片可调稳压器 氧化物半导体线性微型电路》.pdf

《DLA SMD-5962-77034 REV X-2006 MICROCIRCUIT LINEAR ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON《硅单片可调稳压器 氧化物半导体线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-77034 REV X-2006 MICROCIRCUIT LINEAR ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON《硅单片可调稳压器 氧化物半导体线性微型电路》.pdf（50页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED P Add case outline M. Technical changes and corrections to table I. Editorial changes throughout. 93-10-02 M. A. FRYE R Add class V level devices. Update boilerplate. - ro 99-06-08 R. MONNIN T Add case outline N. Make changes to 1.2.4, PD, theta JC

2、, IMAXas specified in 1.3, table I, and figure 1. - ro 99-09-23 R. MONNIN U Add radiation hardened requirements to device types 02 and 07 for case outline U. Add terminal assignment table for case outline N as specified in figure 1. Add case outline 4 for device type 07. - ro 00-10-11 R. MONNIN V Ad

3、d case outlines 5 and 6. Make changes to 1.2.4, PD, theta JC, IMAXas specified in 1.3, table I, and figure 1. Update boilerplate to reflect current requirements. - rrp 03-12-10 R. MONNIN W Add a footnote to the case outline U, TO-257 package as specified under 1.2.4 and figure 1. - ro 05-02-07 R. MO

4、NNIN X For case outline “T” only, add a footnote 1/ under 1.2.4 and make change to note 3 under figure 1. For device types 02, 04, 07, and 08 add pin outs under case outline 2 in figure 1. -rrp 06-01-30 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV X X X X X X X X X X X S

5、HEET 35 36 37 38 39 40 41 42 43 44 45 REV X X X X X X X X X X X X X X X X X X X X SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV X X X X X X X X X X X X X X OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY WILLIAM E. SHOUP DEFENSE SUPPLY CENTER

6、COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C.R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, ADJUSTABLE VOLTAGE REGULATOR, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENS

7、E DRAWING APPROVAL DATE 77-09-15 AMSC N/A REVISION LEVEL X SIZE A CAGE CODE 67268 77034 SHEET 1 OF 45 DSCC FORM 2233 APR 97 5962-E015-06 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENTER

8、 COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes

9、 are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 77034 01 M X Drawing number Device type (see 1

10、.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 77034 01 V X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number For device classes M,

11、Q, and V radiation hardened devices: 5962 R 77034 02 M U X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked d

12、evices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device typ

13、e(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM117 Positive adjustable voltage regulator 02 LM117HV Positive adjustable voltage regulator, high voltage 03 LM137 Negative adjustable voltage regulator 04 LM137HV Negative adjustable v

14、oltage regulator, high voltage 05 LT117A Positive adjustable voltage regulator 06 LT137A Negative adjustable voltage regulator 07 LT117AHV Positive adjustable voltage regulator, high voltage 08 LT137AHV Negative adjustable voltage regulator, high voltage Provided by IHSNot for ResaleNo reproduction

15、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 3 DSCC FORM 2234 APR 97 1.2.3 Device class designator. The device class designator is a single letter identifying the produc

16、t assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device except for those devices that use a RHA designator Device class Dev

17、ice requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designa

18、ted in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style M See figure 1 3 Power surface mount N See figure 1 3 Surface mount T 1/ See figure 1 3 TO-257 flange mount, glass sealed U 1/ See figure 1 3 TO-257 flange mount with isolated tab, glass sealed X See fi

19、gure 1 3 TO-39 can Y MBFM1-P2 2 Flange mount Z MBFM4-P2 2 Flange mount 2 CQCC1-N20 20 Square leadless chip carrier 4 See figure 1 3 SMD-257-A flange mount, glass sealed 5 See figure 1 18 Rectangular leadless chip carrier 6 See figure 1 18 Rectangular leadless chip carrier 1.2.5 Lead finish. The lead

20、 finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Power dissipation (PD): Case X . 2 W Cases M, N, T, U, Y, Z and 4 (internally limited) . 20 W Case 2: At TA= +25C . 1.1 W At TC= +25C 6.2 W Cases 5 an

21、d 6 at TC= +25C . 10 W Input-output voltage differential: Device types 01, 03, 05, 06 . 40 V dc Device types 02, 07 . 60 V dc Device types 04, 08 . 50 V dc Operating junction temperature range . -55C to +150C Storage temperature . -65C to +150C Lead temperature (soldering, 10 seconds) . 300C Thermal

22、 resistance, junction to case (JC): Cases M, N, and T . 3.5C/W Cases U and 4 4.2C/W Case X 15C/W Case Y 3C/W Case Z 5C/W Case 2 . See MIL-STD-1835 Cases 5 and 6 . 13C/W 1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal. 2/ Stresses above the absolute maxim

23、um rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENT

24、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 4 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings Continued. 2/ Maximum output current (IMAX): Cases X, 2, 5, and 6 0.5 A Cases M, N, T, U, Y, Z, and 4 . 1.5 A 1.4 Recommended operating conditions. Output voltage range: Device types 01,

25、 05 . 1.2 to 37 V dc Device types 02, 07 . 1.2 to 57 V dc Device types 03, 06 . -1.2 to -37 V dc Device types 04, 08 . -1.2 to -47 V dc Ambient operating temperature range (TA) . -55C to +125C Input voltage range: Device types 01, 05 . 4.25 V dc to 41.25 V dc Device types 03, 06 . -4.25 V dc to -41.

26、25 V dc Device types 02, 07 . 4.25 V dc to 61.25 V dc Device types 04, 08 . -4.25 V dc to -51.25 V dc 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s): 3/ Device types 02 and 07 . 100 Krads(Si) 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and h

27、andbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circui

28、ts, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 -

29、Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 3/ These parts may be dose rate sensi

30、tive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without

31、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 5 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of th

32、is drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and a

33、s specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for n

34、on-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Ca

35、se outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revisi

36、on level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are a

37、s specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be ma

38、rked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option

39、, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be

40、a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to suppl

41、y to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listin

42、g as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificat

43、e of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change

44、 of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and a

45、pplicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Prov

46、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbo

47、l Conditions -55C TA +125C IL= 8 mA Group A subgroups Device type Limits Unit unless otherwise specified Min Max Cases X, 2, 5 and 6 Reference voltage VREFVDIFF= 3.0 V 1 01 1.20 1.30 V VDIFF= 3.3 V 2,3 1.20 1.30 VDIFF= 40 V 1,2,3 1.20 1.30 Line regulation RLINE3.0 VDIFF 40 V, VOUT= VREF1 01 9 mV 3.3

48、 VDIFF 40 V, VOUT= VREF2,3 23 Load regulation 1/ RLOADVDIFF= 3 V, 10 mA IL 500 mA 1 01 15 mV VDIFF= 3.3 V, 10 mA IL 500 mA 2,3 15 VDIFF= 40V, 10 mA IL 150 mA 1 15 VDIFF= 40 V, 10 mA IL 100 mA 2,3 15 Thermal regulation VRTHVIN= +14.6 V, IL= 300 mA, t = 20 ms, PD= 4 W, TA=+25C 1 01 3.1 mV Ripple rejection RNf = 120 Hz, CADJ= 10 F, VOUT= VREF2/ 4,5,6 01 66 dB Adjustment pin current IADJVDIFF= 3.0 V 1 01 100 A VDIFF= 3.3 V 2,3 100 VDIFF= 40 V 1,2,3 100 Adjust