DLA MIL-PRF-19500 343 K-2012 SEMICONDUCTOR DEVICE TRANSISTOR NPN SILICON LOW POWER TYPES 2N2857 AND 2N2857UB JAN JANTX JANTXV AND JANS JANSM JANSD JANSP JANSL JANSR JANHCF JANHCG J.pdf
《DLA MIL-PRF-19500 343 K-2012 SEMICONDUCTOR DEVICE TRANSISTOR NPN SILICON LOW POWER TYPES 2N2857 AND 2N2857UB JAN JANTX JANTXV AND JANS JANSM JANSD JANSP JANSL JANSR JANHCF JANHCG J.pdf》由会员分享,可在线阅读,更多相关《DLA MIL-PRF-19500 343 K-2012 SEMICONDUCTOR DEVICE TRANSISTOR NPN SILICON LOW POWER TYPES 2N2857 AND 2N2857UB JAN JANTX JANTXV AND JANS JANSM JANSD JANSP JANSL JANSR JANHCF JANHCG J.pdf(22页珍藏版)》请在麦多课文档分享上搜索。
1、 MIL-PRF-19500/343K 1 MAY 2012 SUPERSEDING MIL-PRF-19500/343J 2 April 2010 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW POWER, TYPES 2N2857 AND 2N2857UB, JAN, JANTX, JANTXV, AND JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANHCF, JANHCG, JANSH, JANHC, AND JANKC Th
2、is specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for N
3、PN, silicon, low power, ultra-high frequency transistors. Four levels of product assurance are provided for each device type. Two levels of product assurance are provided for unencapsulated devices as specified in MIL-PRF-19500. RHA level designators “M”, “D”, “P“, “L”, “R”, “F”, “G”, and “H” are ap
4、pended to the device prefix to identify devices, which have passed RHA requirements. 1.2 Physical dimensions. See figure 1 (TO-72), figure 2 (UB surface mount), and figure 3 (JANHC, JANKC die). * 1.3 Maximum ratings at TA= +25C unless otherwise specified. PTTA= +25C PT(1) TC= +25C ICVCBOVCEOVEBORJA(
5、2) RJSP(2) RJC(2) TJand TSTGmW mW mA dc V dc V dc V dc C/W 550 350 C/W 210 C/W 300 130 C TO-72 UB 200 200 300 300 40 40 30 30 15 15 3 3 -65 to +200 (1) Derate linearly 1.71 mW/C for TC +25C. * (2) For thermal impedance curves, see figures 4, 5, and 6. AMSC N/A FSC 5961INCH-POUND * Comments, suggesti
6、ons, or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online databa
7、se at https:/assist.daps.dla.mil . The documentation and process conversion measures necessary to comply with this document shall be completed by 1 August 2012. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/343K 2 1.4 Primary electric
8、al characteristics at TA= +25C. hFE1| hfe| Ccb F Gpe rb Cc VCE= 1 V dc IC= 3 mA dc VCE= 6 V dc IC= 5 mA dc f = 100 MHz VCB= 10 V dc IE= 0 f = 100 kHz f 1 MHz VCE= 6 V dc IC= 1.5 mA dc f = 450 MHz Rg= 50 VCE= 6 V dc IC= 1.5 mA dc f = 450 MHz VCB= 6 V dc IE= 2 mA dc f = 31.9 MHz Min Max 30 150 10 21 p
9、f 1.0 db 4.5 db 12.5 21 ps 4 15 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as
10、examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specificati
11、ons, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-1
12、9500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch or https:/assist.daps.dla.mil or from the Standardization Document
13、Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in t
14、his document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification
15、shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall b
16、e as specified in MIL-PRF-19500. 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500, and on figures 1, 2, and 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/343K 3 NOTES:
17、1. Dimension are in inches. 2. Millimeters are given for general information only. 3. Beyond r (radius) maximum, TH shall be held for a minimum length of .011 (0.28 mm). 4. Dimension TL measured from maximum HD. 5. Body contour optional within zone defined by HD, CD, and Q. 6. Leads at gauge plane .
18、054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by direct methods or by the gauge and gauging procedure shown in figure 2. 7. Dimensio
19、n LU applies between L1and L2. Dimension LD applies between L2and LL minimum. Diameter is uncontrolled in L1and beyond LL minimum. 8. All four leads. 9. Dimension r (radius) applies to both inside corners of tab. 10. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 11. Lead 1
20、 = emitter, lead 2 = base, lead 3 = collector, lead 4 = case (electrically connected). FIGURE 1. Physical dimensions for 2N2857, (TO-72). Symbol Dimensions Notes Inches Millimeters Min Max Min Max CD .178 .195 4.52 4.95 5 CH .170 .210 4.32 5.33 HD .209 .230 5.31 5.84 5 LC .100 TP 2.54 TP 7,8 LD .016
21、 .021 .410 .533 7,8 LL .500 .750 12.70 19.05 7,8 LU .016 .019 .41 .48 L1.050 1 .27 L2.250 6.35 P .100 2.54 Q .040 1.02 5 TL .028 .048 .71 1.22 TW .036 .046 .91 1.17 r .007 .18 45 TP Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/343K 4
22、 Symbol Dimensions Note Symbol Dimensions Note Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max BH .046 .056 1.17 1.42 LS1 .035 .040 0.89 1.02 BL .115 .128 2.92 3.25 LS2 .071 .079 1.80 2.01 BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61 CL .128 3.25 r .008 0.20 CW .108 2.74 r1 .0
23、12 0.31 LL1 .022 .038 0.56 0.96 r2 .022 0.56 LL2 .017 .035 0.43 0.89 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metallized areas. 4. Lid material: Kovar. 5. Pad 1 = base, Pad 2 = emitter, Pad 3 = collector, Pad 4 = sh
24、ielding connected to the lid. 6. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 2. Physical dimensions, surface mount (UB version). UB Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/343K 5 Die size -.01
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