DLA DSCC-DWG-99005 REV D-2007 RESISTOR CHIP FIXED FILM 8 PIN ARRAY STYLE 2012《固定薄膜片状8插针组2012型电阻器》.pdf

《DLA DSCC-DWG-99005 REV D-2007 RESISTOR CHIP FIXED FILM 8 PIN ARRAY STYLE 2012《固定薄膜片状8插针组2012型电阻器》.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-99005 REV D-2007 RESISTOR CHIP FIXED FILM 8 PIN ARRAY STYLE 2012《固定薄膜片状8插针组2012型电阻器》.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、NOTICE OF REVISION (NOR) (See MIL-STD-480 for instructions) This revision described below has been authorized for the document listed. DATE (YYMMDD) 07/02/15 Form Approved OMB No. 0704-0188 Public reporting burden for this collection is estimated to average 1 hour per response, including the time fo

2、r reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing thi

3、s burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Information and Regulatory Affairs, Office of Management and Budget, Washington, DC 20503. 2. CAGE CODE 037Z3 3.

4、 NOR NO. 5905-E648 1. ORIGINATOR NAME AND ADDRESS DEFENSE SUPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 4. CAGE CODE: 037Z3 5. DOCUMENT NO. 99005 7. REVISION LETTER (Current) C (New) D 6. TITLE OF DOCUMENT RESISTOR, CHIP, FIXED, FILM, 8 PIN ARRAY, STYLE 2012 8. ECP NO. NONE 9. CONFIGURATION ITEM

5、(OR SYSTEM) TO WHICH ECP APPLIES 10. DESCRIPTION OF REVISION Sheet 1: Revisions letter column; add “D“ Revisions description column; add “Changes in accordance with NOR 5905-E648.“ Revisions date column; add “15 February 2007“. Sheet 2: 6.2d, delete and substitute: “ d. Whether the manufacturer perf

6、orms the group B inspection or provides a certificate of compliance (see 4.2.3).“ 11. THIS SECTION FOR GOVERNMENT USE ONLY a. CHECK ONE X EXISTING DOCUMENT SUPPLEMENTED BY THIS NOR MAY BE USED IN MANUFACTURE. REVISED DOCUMENT MUST BE RECEIVED BEFORE MANUFACTURER MAY INCORPORATE THIS CHANGE. CUSTODIA

7、N OF MASTER DOCUMENT SHALL MAKE ABOVE REVISION AND FURNISH REVISED DOCUMENT TO: B. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DSCC-VAT SIGNATURE AND TITLE Michael A. Radecki Chief, Electronics Components Team DATE (YYMMDD) 2007 February 15 12. ACTIVITY ACCOMPLISHING REVISION DSCC-VAT REVIS

8、ION COMPLETED (Signature) Jesus V. Garcia III DATE (YYMMDD) 2007 February 15 DD Form 1695, JUL 88 Previous editions are obsolete. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-REVISIONS LTR DESCRIPTION DATE APPROVED A Add new vendor. Editorial chan

9、ges throughout. 8 JUN 00 K. Cottongim B Removal of manufacturer. Editorial changes throughout. 13 JAN 04 K. Cottongim C Inactivation for new design for configuration A and B. Removal of manufacturer. Add pure tin prohibition paragraph. Add 3 new screening levels. Editorial changes throughout. 2 NOV

10、06 M. Radecki Prepared in accordance with ASME Y14.100 Selected item drawing REV C C C C C C C REV STATUS OF PAGES PAGES 1 2 3 4 5 6 7 PMIC N/A PREPARED BY Andrew R. Ernst DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH CHECKED BY Andrew R. Ernst APPROVED BY Kendall A. Cottongim TITLE RESISTOR, CHIP, F

11、IXED, FILM, 8 PIN ARRAY, STYLE 2012 SIZE A CODE IDENT. NO. 037Z3 DWG NO. 99005 Original date of drawing 6 March 2000 REV C PAGE 1 OF 7 AMSC N/A 5905-E628 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO S

12、IZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a multi resistive function in a single chip package. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 99005 X XXXX X X X X X Drawing number Characteristic (see 3

13、.3.1) Resistance (see 3.3.2) Tolerance (see 3.3.3) Schematic (see 3.3.4) Termination (see 3.3.5) Screening level (see 3.3.6) Configuration (see 3.3.7) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbo

14、oks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistor, Chip, Fixed, Film, Nonestablished Reliability, Established Reliab

15、ility, Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization

16、Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applica

17、ble laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 and as specified herein. 3.2 Interface, and physical dimensions. The resistor shall meet the interface, and physic

18、al dimensions as specified in MIL-PRF-55342 and herein (see figure 2). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 3 3.3 Electrical characteristic

19、s. 3.3.1 Resistance temperature characteristic. The resistance temperature characteristic shall be available in characteristics K (100 ppm), L (200 ppm) and M (300 ppm). 3.3.2 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent signific

20、ant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 1,000 ohms, or when fractional values of an ohm are required, the “R” shall be substituted for one of the significant figures. The resistance value designations are shown in table I. App

21、ropriate values not listed in the “10 to 100” decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to the specification. TABLE I. Resistance value designations. Designation Resistance ohms 10R0 to 97R6 inclusive 1000 to 9760 inclusive 1001 to 9

22、761 inclusive 1002 to 9762 inclusive 1003 to 9763 inclusive 1004 10.0 to 97.6 inclusive 100 to 976 inclusive 1,000 to 9,760 inclusive 10,000 to 97,600 inclusive 100,000 to 976,000 inclusive 1,000,000 3.3.2.1 Resistance range. The resistance range shall be 10 ohms to 1.0 megohms. 3.3.3 Resistance tol

23、erance. The resistance tolerance shall be available in F (1 percent), G (2 percent), and J (5 percent) tolerance. 3.3.4 Schematic. The schematic of the chip array shall be identified by a single letter in accordance with figure 1. FIGURE 1. Schematic chip resistor array. Provided by IHSNot for Resal

24、eNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 4 3.3.5 Termination. Termination shall be in accordance with MIL-PRF-55342. 3.3.5.1 Pure tin. The use of pure tin, as an underplat

25、e or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.3.6 Screening level. The screening level shall consist of five levels; Level

26、 A shall be the thermal shock of MIL-PRF-55342, group A, subgroup 2 followed by the short time overload described in 3.3.6.1, followed by the dc resistance test of MIL-PRF-55342. Level B shall be only the short time overload test as described in 3.3.6.1, followed by the dc resistance of MIL-PRF-5534

27、2. Level C shall be the non-ER (C level) test as described in MIL-PRF-55342. Level D shall be the ER test as described in MIL-PRF-55342. Level E shall be the space level test as described in MIL-PRF-55342. 3.3.6.1 Short time overload. The short time overload test shall consist of 2.5 times rated vol

28、tage for 5 seconds at room temperature, not to exceed twice the maximum continuous working voltage. 3.3.7 Configuration. Configuration C shall be in accordance with figure 2. Configuration A and B are inactive for new design. 3.3.8 Power rating. The power rating for schematic A shall be as specified

29、 in table II. TABLE II. Power rating Characteristics K, L and M SchematicsElement (watts) Network (watts) A 0.063 0.500 3.3.9 Voltage rating. The maximum continuous working voltage shall not exceed 50 volts dc. 3.4 Marking. Marking is not required on the resistor; however each unit package shall be

30、marked with the PIN assigned (see 1.2), manufacturers identification code, and date and lot codes. 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material m

31、eets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be un

32、iform in quality and free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not applicable to this document. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for deli

33、very for levels A and B shall consist of subgroups 1, 2, and 3 (as modified in 3.3.6) of group A and group B inspection of MIL-PRF-55342. Levels C, D, E shall consist of group A and group B inspection of MIL-PRF-55342. 4.2.2 Mounting integrity. Mounting integrity shall be performed in accordance wit

34、h MIL-PRF-55342, except the applied force shall be 2Kg. 4.2.3 Certification. The procuring activity may accept a certificate of compliance in lieu of group B inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS

35、COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 5 Configuration A B1 B2 C L P T W A (Inactive for new design) .020 .012 (0.5 0.3) .031 .008 (0.8 0.20) .039 .008 (1.0 0.20) .030 max (0.762 max).205 .015 (5.2 0.40) .050 .008 (1.27 0.20) .022 .004(0.55 0.10).122 .008 (3.10 0.20)B (I

36、nactive for new design) .020 .012 (0.5 0.3) .031 .008 (0.8 0.20) N/A .030 max (0.762 max).205 .015 (5.2 0.40) .050 .008 (1.27 0.20) .022 .004(0.55 0.10).122 .008 (3.10 0.20)FIGURE 2. Chip resistor array. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

37、,-DRAFT DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 6 CONFIGURATION C Configuration A B C L P T W C .021 .008 (0.53 0.2) .020 .005 (0.51 0.13) .030 max (0.762 max).205 .008 (5.2 0.20) .050 (1.27) .025 +.005, -.000 (0.64 +0.127, -0.0) .122 .008

38、(3.10 0.20) NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The picturization of the resistor above is a given representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do no

39、t alter the functional aspects of the device are acceptable. 4. As a minimum the coating shall cover the total element of the resistor. FIGURE 2. Chip resistor array. Continued. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

40、order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity wit

41、hin the Military Department or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (T

42、his section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistor arrays are intended for use in thick or thin film circuits where microcircuitry is intended. Chip resistor arrays can also be used in surface mount applicat

43、ions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DRAFT DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 99005 REV C PAGE 7 6.2 Ordering data. The contract or purchase order should specify the following: a. Compl

44、ete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certification of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacturer performs

45、 the group B inspection or provides a certificate of compliance (see 4.2.2). 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture an

46、d can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional in

47、formation on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.3.1 Configuration A or B. Configuration A and B are inactive for new design due to the manufactures going to a pure tin termination to meet Restriction of Hazardous Substances (RoHS) directi

48、ves. 6.4 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 which specifies a preventive packaging procedure. 6.5 User of record. Coordination of this document for future revisions is coordinated only with the suggested source of supply and the users of record