BS IEC 60747-14-4-2011 Semiconductor devices Discrete devices Semiconductor accelerometers《半导体器件 分立器件 半导体加速器》.pdf

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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Discrete devicesPart 14-4: Semiconductor accelerometersBS IEC 60747-14-4:2011National forewordThis British Standard is the UK implementation of IEC 60747-14

2、-4:2011.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users ar

3、e responsible for its correct application. BSI 2011 ISBN 978 0 580 55665 4 ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 28 February 2011.Amendmen

4、ts issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS IEC 60747-14-4:2011IEC 60747-14-4 Edition 1.0 2011-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Discrete devices Part 14-4: Semiconductor accelerometers Dispositifs semiconducteurs Dispositifs discrets P

5、artie 14-4: Acclromtres semiconducteurs INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XD ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-323-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechniq

6、ue Internationale colourinsideBS IEC 60747-14-4:201160747-14-4 IEC:2011 CONTENTS INTRODUCTION . 7 1 Scope . 8 2 Normative references . 8 3 Terminology and letter symbols 9 3.1 Terms and definitions 9 3.2 Letter symbols . 15 4 Essential ratings and characteristics . 16 4.1 General . 16 4.1.1 Operatin

7、g principle 16 4.1.2 Single axis and multi-axis 16 4.1.3 Performance evaluation . 17 4.1.4 Sensitivity 17 4.1.5 Classification . 18 4.1.6 Symbol (g) . 19 4.1.7 Customer and supplier . 19 4.1.8 Linearity and nonlinearity . 19 4.1.9 Element materials 19 4.1.10 Handling precautions . 20 4.1.11 Accelero

8、meter mounting condition . 20 4.1.12 Specifications 20 4.2 Ratings (limiting values) 20 4.3 Recommended operating conditions 20 4.4 Characteristics 21 4.4.1 Measurement range . 21 4.4.2 Sensitivity and sensitivity error 21 4.4.3 Bias (offset) and bias (offset) error 21 4.4.4 Linearity 21 4.4.5 Misal

9、ignment . 22 4.4.6 Cross-axis sensitivity . 22 4.4.7 Cross-coupling coefficient 22 4.4.8 Temperature coefficient of sensitivity . 22 4.4.9 Temperature coefficient of bias 22 4.4.10 Frequency response 22 4.4.11 Supply current . 22 4.4.12 Output noise 22 4.4.13 Ratiometricity 22 4.4.14 Self test . 23

10、5 Measuring methods 23 5.1 General . 23 5.1.1 Standard test conditions 23 5.1.2 Applicable measurement methods for test and calibration method . 23 5.2 Testing methods for characteristics . 25 5.2.1 Measurement range . 25 5.2.2 Supply voltage range . 26 5.2.3 Sensitivity and sensitivity error 26 BS

11、IEC 60747-14-4:201160747-14-4 IEC:2011 5.2.4 Bias and bias error 26 5.2.5 Linearity 27 5.2.6 Misalignment . 29 5.2.7 Cross-axis sensitivity . 30 5.2.8 Cross-coupling coefficient 30 5.2.9 Temperature coefficient of sensitivity . 31 5.2.10 Temperature coefficient of bias 31 5.2.11 Frequency response 3

12、1 5.2.12 Supply current . 35 5.2.13 Output noise 35 6 Acceptance and reliability . 36 6.1 Environmental test 36 6.1.1 High temperature storage 36 6.1.2 Low-temperature storage . 36 6.1.3 Temperature humidity storage . 37 6.1.4 Temperature cycle . 37 6.1.5 Thermal shock . 37 6.1.6 Salt mist 37 6.1.7

13、Vibration 37 6.1.8 Mechanical shock 37 6.1.9 Electrical noise immunity . 37 6.1.10 Electro-static discharge immunity 37 6.1.11 Electro-magnetic field radiation immunity . 38 6.2 Reliability test 38 6.2.1 Steady-state life 38 6.2.2 Temperature humidity life 38 Annex A (informative) Definition of sens

14、itivity matrix of an accelerometer 39 Annex B (informative) Dynamic linearity measurement using an impact acceleration generator 79 Annex C (informative) Measurement of peak sensitivity . 88 Bibliography 97 Figure 1 Single axis accelerometer 17 Figure 2 Multi-axis accelerometer 17 Figure 3 Concept o

15、f the mathematical definition of accelerometers 18 Figure 4 Concept of dynamic linearity of an accelerometer on gain 28 Figure 5 Concept of dynamic linearity of an accelerometer on phase . 29 Figure 6 The semiconductor accelerometer as a system 33 Figure 7 Example of the structure of assembled semic

16、onductor accelerometer system for the concept of accelerometer frequency response . 34 Figure 8 Schematic diagram of frequency response measurement by electrical input . 35 Figure A.1 Example of direction cosine 46 Figure A.2 Accelerometers or pick-offs assembled in a normal co-ordinate system (top

17、figure) and the acceleration component projection to the three co-ordinate axis plains, XY, YZ and ZX (bottom figure) . 53 Figure B.1 Set-up for dynamic linearity measurement 86 Figure C.1 Peak sensitivity as a function of each frequency bandwidth from DC to fn. 88 Figure C.2 Set-up for the control

18、of frequency bandwidth of shock acceleration . 96 BS IEC 60747-14-4:201160747-14-4 IEC:2011 Table 1 List of letter symbols . 15 Table 2 Level of accelerometers and the definition . 18 Table 3 Test items and the recommended corresponding measurement methods 24 Table 4 Relation between recommended app

19、licable calibration methods and type of accelerometers . 25 Table A.1 Symbols for the relationship between input acceleration and the output signal from an accelerometer using one-dimensional vibration table . 46 Table A.2 Symbols for input acceleration and output signals from an accelerometer 47 Ta

20、ble A.3 Definition of symbols for describing the input acceleration, output signal from the target accelerometer and the direction cosine repeated three times 47 Table A.4 Relationship between the expression of transfer function in a matrix form and the number of axis of the target accelerometers .

21、49 Table A.5 Definition of vector space related to the generalization of the transverse sensitivity using the vector space concept 57 Table A.6 Relation between input acceleration and output signal for the calibration, using the six-dimensional vibration table . 59 Table A.7 Normal sensitivities, ex

22、plicit cross-sensitivities and implicit cross-sensitivities obtained by the calibration carried out in the application acceleration vector space with three dimensions 75 Table A.8 Normal sensitivities, explicit cross-sensitivities and implicit cross-sensitivities obtained by the calibration carried

23、out in the application acceleration vector space with six dimensions 76 Table A.9 List of symbols in terms of measurement uncertainty using an accelerometer with M output axis assuming that N is larger than M . 77 Table B.1 Dynamic linearity when both input and output are vector quantities 79 Table

24、B.2 Relations between the direction cosine of the input acceleration to one-axis accelerometers and the signal from the output axis . 80 Table B.3 Relationship between the direction cosine of the input acceleration to one-axis accelerometers and the signal from the output axis . 81 Table B.4 Conditi

25、ons on the direction cosine for dynamic linearity measurement . 82 Table B.5 Relations between the direction cosine of the input acceleration to two-axis accelerometers and the signal from the output axis . 82 Table B.6 Relations between the direction cosine of the input acceleration to two-axis acc

26、elerometers and the signal from the output axis . 83 Table B.7 Conditions on the direction cosine for the dynamic linearity measurement . 83 Table B.8 Relationship between the direction cosine of the input acceleration to three-axis accelerometers and the signal from the output axis 84 Table B.9 Rel

27、ations between the direction cosine of the input acceleration to three-axis accelerometers and the signal from the output axis . 85 Table B.10 Conditions on the direction cosine for dynamic linearity measurement . 85 Table C.1 Definition of elements in one-axis accelerometer peak sensitivity 88 Tabl

28、e C.2 Peak sensitivity of one-axis accelerometer . 89 Table C.3 Relationship of direction cosine and the co-ordinate system of the target accelerometer . 89 Table C.4 Definition of elements in two-axis accelerometer peak sensitivity . 91 Table C.5 Definition of elements in three-axis accelerometer p

29、eak sensitivity 93 BS IEC 60747-14-4:201160747-14-4 IEC:2011 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES DISCRETE DEVICES Part 14-4: Semiconductor accelerometers FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co

30、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St

31、andards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this pr

32、eparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two orga

33、nizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form

34、 of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretat

35、ion by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or reg

36、ional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out

37、 by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees

38、 for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the

39、Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. International Standard IEC 60747-14-4 has been prepared by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconduct

40、or devices. This part of IEC 60747 should be read in conjunction with IEC 60747-1:2006. It provides basic information on semiconductor terminology; letter symbols; essential ratings and characteristics; measuring methods; acceptance and reliability. BS IEC 60747-14-4:2011 6 60747-14-4 IEC:2011 The t

41、ext of this standard is based on the following documents: FDIS Report on voting 47E/405/FDIS 47E/409/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IE

42、C Directives, Part 2. A list of all the parts in the IEC 60747 series, under the general title Semiconductor devices Discrete devices, can be found on the IEC website. Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be

43、 updated at the time of the next edition. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be

44、reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document usi

45、ng a colour printer. BS IEC 60747-14-4:201160747-14-4 IEC:2011 7 INTRODUCTION The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance with this document may involve the use of a patent concerning following items. a) Measurement technique and

46、 apparatus for matrix sensitivity in “definition of sensitivity matrix of an accelerometer” given in Subclause 4.1.5 and Annex A. b) Measurement technique and apparatus for the dynamic linearity measurement of AC accelerometers in “dynamic linearity measurement using an impact acceleration generator

47、” given in Annex B. c) Measurement technique and apparatus for the frequency response measurement of accelerometers under the frequency bandwidth control in “method of controlling the frequency bandwidth of the shock acceleration” given in Clause C.5. d) Measurement technique and apparatus for the d

48、ynamic response and peak sensitivity measurement of accelerometers in the form of matrix using elastic pulse in “definition of sensitivity matrix of an accelerometer” given in Annex A. e) Projectiles for frequency bandwidth control in “method of controlling the frequency bandwidth of the shock accel

49、eration” given in Clause C.5 and for the dynamic response and peak sensitivity measurement of accelerometers in the form of matrix using elastic pulse in “definition of sensitivity matrix of an accelerometer” given in Annex A. IEC takes no position concerning the evidence, validity and scope of this patent right. The holder of these patent rights has assured the IEC that he/she is willing to negotiate licenc