BS EN 62326-4-1-1997 Printed boards - Rigid multilayer printed boards with interlayer connections - Sectional specification - Capability detail specification - Performance levels A.pdf

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1、BRITISH STANDARD BS EN 62326-4-1:1997 IEC2326-4-1: 1996 QC230401: 1996 Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification Section 1: Capability detail specification Performance levels A, B and C The European Standard EN62326-4-1:1997 has the st

2、atus of a British Standard ICS31.180BSEN62326-4-1:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector board, was published underthe authority of the Standards Board and comes intoeffect on 15June1997 BSI 09-1999 ISBN 0 580 27479 9 National foreword This

3、 British Standard is the English language version of EN62326-4-1:1997. It is identical with IEC2326-4-1:1996. This Section of BS EN62326 forms the capability detail specification in the IEC quality assessment system for electronic components (IECQ) for rigid multilayer printed boards with interlayer

4、 connections with performance levels A, B and C. In the IECQ system, this specification is numbered QC230401. The UK participation in its preparation was entrusted to Technical Committee EPL/52, Printed circuits, which has the responsibility to: aid enquirers to understand the text; present to the r

5、esponsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained o

6、n request to its secretary. Cross-references Attention is drawn to the fact that Annex ZA lists normative references to international publications with their corresponding European publications. The British Standards which implement these international or European publications may be found in the BS

7、I Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsib

8、le for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theEN title page, pages2 to62, an inside back cover and a back cover. This stan

9、dard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN62326-4-1:1997 BSI 09-1999 i Contents Page National foreword Inside front cover

10、Foreword 2 Text of EN 62326-4-1 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62326-4-1 January 1997 ICS 31.180 Descriptors: Printed boards, rigid multilayer, interlayer connections, capability approval, capability detail specification, performance levels A, B and C, capability testi

11、ng English version Printed boards Part4: Rigid multilayer printed boards with interlayer connections Sectional specification Section1: Capability Detail Specification Performance levels A, B and C (IEC2326-4-1:1996) Cartes imprimes Partie4: Cartes imprimes multicouches rigides avec connexions interc

12、ouches Spcification intermdiaire Section1: Spcification particulire dagrment Niveaux de performance A, B et C (CEI2326-4-1:1996) Leiterplatten Teil 4: Starre Mehrlagen-Leiterplatten mitDurchverbindungen Rahmenspezifikation Hauptabschnitt1: Bauartspezifikation zumNachweis der Befhigung Anforderungsst

13、ufen A, B und C (IEC2326-4-1:1996) This European Standard was approved by CENELEC on1996-12-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-

14、to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

15、under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Ital

16、y, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-105

17、0 Brussels 1997 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN62326-4-1:1997 EEN62326-4-1:1997 BSI 09-1999 2 Foreword The text of document 52/656/FDIS, future edition1 of IEC2326-4-1, prepared by IEC TC52, Printed circuits, was sub

18、mitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN62326-4-1 on1996-12-09. The following dates were fixed: This section1 of part4 is to be used in conjunction with EN62326-1:1997 and EN62326-4:1997 Annexes designated “normative” are part of the body of the standard. Annexes des

19、ignated “informative” are given for information only. In this standard, Annex ZA is normative and Annex A, Annex B and Annex C are informative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC2326-4-1:1996 was approved by CENELEC as a European Standar

20、d without any modification. Contents Page Foreword 2 1 Scope 3 2 Normative references 3 3 Capability qualifying component (CQC) 3 4 Capability approval 7 5 Capability testing 8 6 Capability test board (CTB) descriptions 23 Annex A (informative) Acronyms related to IECQ and their explanations 57 Anne

21、x B (informative) Conversion table 58 Annex C (informative) Bibliography 62 Page Annex ZA (normative) Normative references to international publications with their corresponding European publications Inside back cover Figure 1a Test specimens A and B 28 Figure 1b Test specimen D 29 Figure 1c Test sp

22、ecimen D 30 Figure 1d Test specimen E 31 Figure 1e Test specimen F and G 32 Figure 1f Test specimen H 33 Figure 1g Test specimen H 34 Figure 1h Specimen H1 35 Figure 1i Test specimens H2 and H3 36 Figure 1j Test specimen H1, H2 and H3 37 Figure 1k Test specimen H1 38 Figure 1l Test specimens H2 and

23、H3 39 Figure 1m Test specimen L and M 40 Figure 1n Test specimen N and R 41 Figure 1o Test specimen S 42 Figure 2 Typical arrangement one CTP per production panel 43 Figure 3a CTP (Layer1) 46 Figure 3b CTP (Layer2) 47 Figure 3c CTP (Layer3) 48 Figure 3d CTP (Layer4) 49 Figure 3e CTP (Layer5) 50 Figu

24、re 3f CTP (Layer6) 51 Figure 3g CTP (Layer7) 52 Figure 3h CTP (Layer8) 53 Figure 3i CTP (Layer9) 54 Figure 3j CTP (Layer10) 55 Figure 4 Typical arrangement three CTPs per production panel 56 Table 1 Materials 4 Table 2 Product capability 5 Table 3 Tooling and processes 6 Table 4 Performance requirem

25、ents for level A, B or C qualification 9 Table 5 Individual test specimens and tests 23 Table 6 Structure of test boards 24 Table 7 Hole requirements including minimum annular width (ring) 25 Table 8 Conductor width requirements 26 Table 9 Positioning ITP on the CQC 27 latest date by which the ENhas

26、 to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1997-09-01 latest date by which the national standards conflicting with the EN haveto be withdrawn (dow) EN62326-4-1:1997 BSI 09-1999 3 1 Scope This Capability Detail Specification (Cap DS)

27、is based on IEC2326-4. It relates to rigid multilayer printed boards with interlayer connections manufactured with materials specified in3.1. It specifies the capability qualifying component (CQC), the characteristics to be tested, the test methods and conditions to be applied and the requirements t

28、o be fulfilled for testing capability for performance level A, B or C. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of IEC2326-4. At the time of publication, the editions indicated were valid. All standards a

29、re subject to revision, and parties to agreements based on this section of IEC2326-4 are encouraged to investigate the possibility of applying the most recent editions of the standards indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC68-2-3:19

30、69, Environmental testing Part2: Tests Test Ca: Damp heat, steady state. IEC68-2-20:1979, Environmental testing Part2: Tests Test T: Soldering. IEC68-2-38:1974, Environmental testing Part2: Tests Test Z/AD: Composite temperature/humidity cyclic test. IEC249-3-3:1991, Base materials for printed circu

31、its Part3: Special materials used in connection with printed circuits Specification No.3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards. IEC/FDIS1189-3, Test methods for electrical materials, interconnection structures and assemblies Part3: Test met

32、hods for interconnection structures 1) . IEC2326-1:1996, Printed boards Part1: Generic specification. IEC2326-4:1996, Printed boards Part4: Rigid multilayer printed boards with interlayer connections Sectional specifications. 3 Capability qualifying component (CQC) Test specimens to be used as CQCs

33、are described in clause6 and shall: be made of one of the copper clad base materials and one of the bonding sheet materials specified in3.1; have a construction that has one set of characteristics identified in Table 2; bear the required portions of the capability test board specified in6.1; as an a

34、lternative a production panel may be used. Portions of the production panel may be used as test specimens provided that they are similar to those shown in Figure 1. 1) At present at the stage of Final Draft International Standard.EN62326-4-1:1997 4 BSI 09-1999 3.1 Materials Table 1 Materials 3.2 Pro

35、duct capability The individual test specimens (ITS) containing the CQC for capability testing shall represent the grade of capability. This grade may be described by an alphanumeric codification developed from Table 2. To each codification letter from Table 2 representing three or one properties (th

36、ree for the characteristics A, B, C, D and one for E) belong three or one of the figures (digit)1 to9 representing the grade of the relevant property. The sequence of these figures corresponds to the sequence of the properties stated in Table 2. For example: A356B435C456D334E6. Material group code B

37、ase material IEC Type M1 1249-2-7 1249-4-1 Part2: Sectional specification set for reinforced base materials, clad and unclad Section7: Epoxide woven glass laminate Part4: Sectional specification set for prepreg materials, unclad Section1:Epoxide woven glass prepregs M2 1249-2-11 1249-4-1 Part2: Sect

38、ional specification set for reinforced base materials, clad and unclad Section11: Polyimide woven glass laminate Part4: Sectional specification set for prepreg materials, unclad Section1:Epoxide woven glass prepregs M3 1249-2-9 1249-4-1 Part2: Sectional specification set for reinforced base material

39、s, clad and unclad Section9: Bismaleimide/Triazine modified epoxide woven glass laminate Part4: Sectional specification set for prepreg materials, unclad Section1:Epoxide woven glass prepregsEN62326-4-1:1997 BSI 09-1999 5 Table 2 Product capability Criteria Code indication 1 2 3 4 5 6 7 8 9 B O A R

40、D Board size (diagonal) mm k 150 250 350 450 550 650 750 850 850 Total board thickness mm A k0,5 1,0 1,6 2,0 2,5 3,5 5,0 6,5 6,5 Number of conductive layers 3-4 5-6 7-8 9-12 13-16 17-20 21-24 25-28 28 H O L E S Diameter of as-drilled holes mm U0,6 0,5 0,4 0,35 0,30 0,25 0,20 0,15 0,15 Total toleranc

41、e of drilled holes (min.-max.) mm B U0,300 0,250 0,200 0,150 0,125 0,100 0,075 0,050 0,050 Location of hole. Positionaltolerance b mm U0,60 0,50 0,40 0,30 0,25 0,20 0,15 0,10 0,10 C O N D U C T O R S a Unplated (inner layers) Minimum electrical clearance mm U0,500 0,350 0,250 0,200 0,150 0,125 0,100

42、 0,075 0,075 Minimum conductor width mm C U0,300 0,250 0,200 0,150 0,125 0,100 0,075 0,050 0,050 Conductor process allowance (min.-max.) mm U0,150 0,100 0,075 0,050 0,040 0,030 0,025 0,020 0,020 Plated (outer layers) Minimum electrical clearance mm U0,500 0,350 0,250 0,200 0,150 0,125 0,100 0,075 0,

43、075 Minimum conductor width mm D U0,300 0,250 0,200 0,150 0,125 0,100 0,075 0,050 0,050 Conductor process allowance (min.-max.) mm U0,150 0,100 0,075 0,050 0,040 0,030 0,025 0,020 0,020 P O SI TI O N A L Location of features (conductive and non-conductive pattern) Positional tolerance b mm E U0,60 0

44、,50 0,40 0,30 0,25 0,20 0,15 0,10 0,10 a The grid (or pitch) can be calculated as follows: minimum electrical clearance+conductor process allowance+minimum conductor width b Positional tolerance: EN62326-4-1:1997 6 BSI 09-1999 3.3 Process capability The CQC shall be produced with one or more of the

45、processes given in Table 3. The descriptions of the processes given in Table 3 identify the total processes used in the facility to produce printed board products. These processes include toolings and primary imagings (W), plating processes (X), coatings (Y) and testing(Z). Not all processes need to

46、 be used on a single product CQC; however, to obtain process capability approval all processes claimed must be available for review. Table 3 Tooling and processes The codification of the process capability shall be developed from Table 3. The process code is a series of significant letters (W, X, Y

47、and Z, each corresponding to a group of processes), each followed by one, three or four figures representing the columns within the group of processes. According to Table 3 the figures are 1, 2 or 4. If the manufacturer uses none, two or three of the referred facilities within a column, the followin

48、g figure shall be used: 0=no capability approval for that particular process of W, X, Y or Z 1=only1 2=only2 3=1and2 4=only4 5=1 and4 6=2 and4 7=1,2 and4 Example: The code W416X2732Y150Z3 is used when a manufacturer has claimed the following facilities: Code indication W Toolings and primary imaging

49、s X Plating processes Y Coatings Z Testing Photo tooling Electronic data Image transfer Initial plated holes Conductive Standard overplate Precious overplate Metallic Permanent polymer Organic 1 Glass image reduction and manipulation (photographic) CAD data acceptance (electrical) Screen imaging Electroless initial through- hole interconnection Electrolytic copper plating Tin-lead plating Gold and gold on nickel (contact areas) Solder (roll