BS EN 62326-1-2002 Printed boards - Generic specification《印制电路板 总规范》.pdf

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1、BRITISH STANDARD BS EN 62326-1:2002 Printed boards Part 1: Generic specification The European Standard EN 62326-1:2002 has the status of a British Standard ICS 31.180 BS EN 62326-1:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy

2、 Committee, was published under the authority of the Standards Policy and Strategy Committee on 16 August 2002 BSI 16 August 2002 ISBN 0 580 40265 7 National foreword This British Standard is the official English language version of EN 62326-1:2002. It is identical with IEC 62326-1:2002. It supersed

3、es BS EN 62326-1:1997 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 J

4、anuary 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The

5、 British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standard

6、s Online This publication does not purport to include all the necessary provisions of a contract. Users are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the re

7、sponsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front

8、cover, the EN title page, pages 2 to 53 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 62326-1 NORME EUROPENNE EUROPISCHE NORM June 2002 CENELEC European C

9、ommittee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENE

10、LEC members. Ref. No. EN 62326-1:2002 E ICS 31.180 Supersedes EN 62326-1:1997 English version Printed boards Part 1: Generic specification (IEC 62326-1:2002) Cartes imprimes Partie 1: Spcification gnrique (CEI 62326-1:2002) Leiterplatten Teil 1: Fachgrundspezifikation (IEC 62326-1:2002) This Europea

11、n Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references c

12、oncerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member i

13、nto its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,

14、 Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 91/274/FDIS, future edition 2 of IEC 62326-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN

15、 62326-1 on 2002-06-01. This European Standard supersedes EN 62326-1:1997. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-03-01 latest date by which the national standar

16、ds conflicting with the EN have to be withdrawn (dow) 2005-06-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annexes M and ZA are normative and annexes A, B, C, D, E, F, G, H, I, J, K and L ar

17、e informative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62326-1:2002 was approved by CENELEC as a European Standard without any modification. _ Page2 EN623261:2002CONTENTS INTRODUCTION.6 1 Scope.7 2 Normative references7 3 General 8 3.1 Gene

18、ral considerations8 3.2 Structure of the specification series .9 4 Particular stipulations12 4.1 Primary stage of manufacture 12 4.2 Structurally similar printed boards 12 4.3 Certified records of released lots (CRRL).12 4.4 Delayed delivery 12 4.5 Release for delivery before the completion of all t

19、ests 13 4.6 Re-submission of rejected lots.13 4.7 Marking of printed boards and package13 4.7.1 Printed boards .13 4.7.2 Package 13 4.8 Ordering information13 5 Capability approval and maintenance of capability approval.13 5.1 General .13 5.2 Capability approval requirements .14 5.3 Description of c

20、apability.14 5.4 Register of firms, products and services information (RFPS) 14 5.5 Demonstration of IECQ capability.15 5.5.1 Test programme 15 5.5.2 Product capability 15 5.5.3 Process capability16 5.6 Capability approval test report17 5.7 Range of capability approval17 5.7.1 Range of product capab

21、ility17 5.7.2 Range of process capability .17 5.7.3 Extended range of approval of product/process capability.17 5.7.4 Significant changes18 5.7.5 Amendment procedures .18 5.8 Maintenance of capability approval 18 5.9 Suspension and withdrawal of capability approval 19 5.10 Capability approval testin

22、g.19 5.11 Inspection information in the Cap DS .19 6 Quality assessment.19 6.1 Quality conformance inspection .19 6.2 Groupings of tests .20 Page3 EN623261:20026.2.1 Category V inspection (visual)21 6.2.2 Category D inspection (dimensional) 21 6.2.3 Category S inspection (surface condition).21 6.2.4

23、 Category E inspection (electrical).22 6.2.5 Category P inspection (physical) 22 6.2.6 Category Y inspection (structure integrity) 22 6.2.7 Category Z inspection 22 6.3 Inspection information in the CDS22 6.4 IECQ technology approval .23 6.5 Indirect measuring methods.23 7 Rules for the preparation

24、of detail specifications .23 7.1 Capability detail specification (Cap DS)23 7.1.1 Requirements for the preparation of the Cap DS 23 7.1.2 Numbering and content23 7.1.3 Drawing information.24 7.2 Customer detail specification (CDS).24 7.2.1 General .24 7.2.2 Numbering and content25 7.2.3 Drawing info

25、rmation.25 7.2.4 Electronic manufacturing data26 7.2.5 Marking .26 7.2.6 Performance requirements.26 Annex A (informative) Example of a CDS check-list.27 Annex B (informative) Future structure of the specification series 28 Annex C (informative) Structure of the capability qualifying component (CQC)

26、 .29 Annex D (informative) Abbreviations and acronyms related to IECQ and their explanations .30 Annex E (informative) Guide to the form and content of a capability manual.31 E.1 General requirements 31 E.2 Scope of capability approval.33 E.3 Technology (process description) .33 E.4 Subcontracting.3

27、4 E.5 Limits of capability .34 E.6 Description of capability .35 E.7 Manufacturer to customer interface 36 E.8 Design rules.36 E.9 Materials list 36 E.10 Manufacture.36 E.11 Procedure in the event of CQC or product failure37 E.12 Test programme for capability approval37 E.13 Maintenance of approval

28、39 E.14 Modifications to the capability approval.39 Page4 EN623261:2002Annex F (informative) Example of process description.41 F.1 Base materials.41 F.2 Basic processing method .41 F.3 Method of pattern or image definition .41 F.4 Method of producing holes .41 F.5 Method of producing board shape 41

29、F.6 Method of construction.41 F.7 Metallic and organic finishes 41 F.8 Types of interconnections 41 Annex G (informative) Example of limits of approval42 Annex H (informative) Example of description of capability 43 Annex I (informative) Example of manufacturer-to-customer interface .44 Annex J (inf

30、ormative) Example of CQC detail specification45 Annex K (informative) Example of test programme matrix48 Annex L (informative) Example of test programme schedule49 Annex M (normative) Requirements for capability approval test reports50 Annex ZA (normative) Normative references to international publi

31、cations with their corresponding European publications52 Table 1 Sample size selection 20 Table C.1 Capability qualifying component (CQC).29 Table E.1 Content of a capability manual33 Page5 EN623261:2002INTRODUCTION IEC 62326 is applicable to printed boards, irrespective of their method of manufactu

32、re, when they are ready for the mounting of components. IEC 62326 is composed of separate parts covering information for the designer, manufacturer, and user generic, sectional and capability detail specifications for the IECQ and requirements for the various types of printed boards. IECQ is the IEC

33、 quality assessment system for electronic components. It is a third-party certification system. Its rules (including a description of the role of the inspectorates) are published in the following: IEC QC 001001: Basic Rules; IEC QC 001002: Rules of Procedure (several parts). This part of IEC 62326 c

34、omprises the generic specification for printed boards of assessed quality and forms part of the sectional specifications and capability detail specifications circulated to the National Committees. EXAMPLE For rigid multilayer printed board the following standards apply: IEC 62326-1, IEC 62326-4 and

35、IEC 62326-4-1. All three standards should be considered jointly. For further information regarding specification structure and inter-relationship between the specifications, see annex B. Page6 EN623261:2002PRINTED BOARDS Part 1: Generic specification 1 Scope This part of IEC 62326 defines capability

36、 approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval procedures of IEC 001002 should be used. In addition, a technology approval (TA) schedule may also be provided as an alternative for manufacturers employing a system of process control for establ

37、ishing product conformity. Both CA and TA procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components. The information and requirements may also be used for second-party approvals or for self-declaration by a manu- facturer of p

38、roducts covered by these specifications. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendm

39、ents) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61182-1:1994, Printed boards Electronic data description and transfer Part 1: Printed board description in digital form IEC 61189-3:1997, Test methods for electrical materials, interconnection structur

40、es and assemblies Part 3: Test methods for interconnection structures (printed boards) IEC 61249-2-4, Materials for printed boards and other interconnecting structures Part 2-4: Reinforced base materials, clad and unclad Polyester non-woven/woven fiberglass laminated sheet of defined flammability (v

41、ertical burning test), copper-clad IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61249-2-12, Materials for pr

42、inted boards and other interconnecting structures Part 2-12: Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad IEC 62326 (all parts), Printed boards IEC 62326-4, Printed boards Part 4: Rigid multilayer pr

43、inted boards with interlayer connections Sectional specification IEC 62326-4-1, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification Section 1: Capability Detail Specification Performance levels A, B and C Page7 EN623261:2002IEC QC 001001, IEC Qu

44、ality Assessment System for Electronic Components (IECQ) Basic Rules IEC 001002-1, IEC Quality Assessment System for Electronic Components (IECQ) Rules of procedure Part 1: Administration IEC QC 001002-2, IEC Quality Assessment System for Electronic Components (IECQ) Rules of procedure Part 2: Docum

45、entation IEC QC 001002-3, IEC Quality Assessment System for Electronic Components (IECQ) Rules of procedure Part 3: Approval procedures IEC QC 001005, Register of Firms, Products and Services approved under the IECQ System, including ISO 9000 ISO 9001:2000, Quality management systems Requirements 3

46、General 3.1 General considerations Printed boards differ from most other electronic components in important factors, such as: there are no standard boards with standard patterns and dimensions but an infinite variety of shapes and circuit configurations; they are “custom tailored“, i.e. all details

47、for a particular board are agreed between manufacturer and customer; although they are made in considerable total quantities, the production quantity of a parti- cular printed board may be small. The qualification approval procedures detailed in clause 3 of IEC QC 001002-3 are not considered suitabl

48、e for the approval of printed board manufacturers, and the capability approval procedures of clause 4 of IEC QC 001002-3 shall be applied. Additionally, the manufacturer shall demonstrate that the quality management system complies with ISO 9001, as appropriate. Manufacturers seeking IECQ capability

49、 approval shall hold IECQ organization approval in accordance with clause 2 of IEC QC 001002-3 as a prerequisite. In the case of printed boards, capability approval is based on the use of capability test board (CTB) or suitable production printed board (PPB) as capability qualifying components with an appropriate selection of test methods and requirements for each type of printed board, for example: rigid