ARMY MIL-C-47224 B-1993 COMPOUND MOLDING TRANSFER EPOXY RESIN SINGLE-COMPONENT《单成分环氧树脂传递模塑料》.pdf
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1、flIL-C-Y722YB W 999990b Lb3b4b3 846 W I INCH-POUND 1 MIL-C-47224B (MI ) 4 JANUARY 1993 SUPERSEDING MIL-C-47224A (MI) 20 February 1981 MILITARY SPECIFICATION COMPOUND, MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT This specification is approved for use by the U.S. Army Missile Command, Department
2、of the Army, and is available for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers one type of single- component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal c
3、onductivity. 2. APPLICABLE DOCUMENTS a 2.1 Government documents. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, U.S. Army Missile Command, ATTN: AMSMI-RD-SE-TD-ST, Redstone Arsenal,
4、AL 35898-5270 by using the Standardization Document Improvement Proposal 1426) appearing at the end of this document or by letter. (DD Form AMSC N/A FSC 9330 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking p
5、ermitted without license from IHS-,-,-7 MIL-C-47224B W 9999906 3636464 782 W MIL-C-47224B (MI) 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of
6、 these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATIONS FEDERAL PPP-B-601 - PPP-B-621 - PPP-B-636 - PPP-B-640 - PPP-C-96 - PPP-D-705 - MILITARY MIL-P-116 - M
7、IL-1-16923 - STANDARDS MILITARY MIL-STD-129 - Boxes, Wood, Cleated-Plywood Boxes, Wood, Nailed and Lock-Corner Boxes, Shipping Fiberboard Boxes, Fiberboard, Corrugated, Triple-Wall Cans, Metal, 28 Gauge and Lighter Drum, Shipping and Storage: Steal, 16 and 30 Gal. Capacity Drums, Shipping and Storag
8、e, Steel, 55-Gallon (208 Liter) Preservation, Methods of Insulating Compound, Electrical, Embedding Marking for Shipment and Storage (Unless otherwise indicated, copies of the federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, B
9、ldg. 4D, 700 Robbins Ave., Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cit
10、ed in the solicitation. Unless otherwise specified, the issues of 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-47224B (MI ) documents not listed in the DODISS are the issues of the documents cited in the solicitation (see 6.2). AMERICAN SO
11、CIETY ASTM D 149 ASTM D 150 ASTM D 256 ASTM D 257 ASTM D 570 ASTM D 635 ASTM D 648 ASTM D 696 ASTM D 790 ASTM D 792 ASTM D 955 ASTM D 2240 FOR TESTING AND MATERIALS Standard Test Methods for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial P
12、ower Frequencies Standard Test Methods for A-C Loss Characteristics and Permitivity (Dielectric Constant) of Solid Electrical Insulating Materials Standard Test Methods for Impact Resistance of Plastics and Electrical Insulating Materials Standard Test Methods for D-C Resistance or Conductance of In
13、sulating Materials Standard Test Methods for Water Absorption of Plastics Standard Test Method for Rate of Burning and/or Extent of Time of Burning and Self-supporting Plastics in a Horizontal Position Standard Test Methods for Deflection Temperature of Plastics Under Flexural Load Standard Test Met
14、hods for Coefficient of Linear Thermal Expansion of Plastics Between -30 Degrees and 30 Degrees C Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials Standard Test Methods for Specific Gravity (Relative Density) and Density of Pla
15、stics by Displacement Standard Test Methods of Measuring Shrinkage from Mold Dimensions of Molded Plastics Standard Test Methods for Indentation Hardness of Rubber Property Hardness 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-VIL-C-47224B = 999
16、990b 3b3b4bb 555 MIL-C-47224B (MI) ASTM D 3123 - Spiral Flow of Low-Pressure ASTM D 3951 - Commercial Packaging, Practice for Thermosetting Molding Compounds (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA 19103.) (Non
17、-Government standards arid other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text o
18、f this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 First article. Unless otherwise specified (6.2), a first artic
19、le sample of the molding compound shall meet the requirements of this specification (see 4.3.1). 3.2 Material. The molding compound shall be a thermosetting mineral-filled epoxy resin formulated in granular form for application by the transfer molding process. The color of the molding compound after
20、 cure shall be black. 3.3 Electrical properties. The cured molding compound shall conform to the electrical requirements specified in Table I (see 4.4.2). 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-47224B (MI) TABLE I. Electrical propert
21、ies of cured molding compound. Property Flexural Strength, lbf/in2, minimum Izod impact, foot pounds per inch of notch, min i mum Property Value 13,000 0.30 Dielectric strength, volts per mil at +20 Celsius (C), minimum Hardness, Shore D, minimum Deflection temperature, degrees C, minimum Dielectric
22、 constant from 100 Hertz (Hz) to 10 gigahertz (ghz), maximum 90 +127 Volume resistivity, ohm-centimeter at +25OC, minimum Coefficient of linear thermal expansion, inch per inch per 0.56OC, maximum: From +24 to +93OC From +93 to -149OC Dissipation factor from 100 Hz to 100 megahertz per second (mHz),
23、 maximum 1.8 10-5 3.3 10-5 Dissipation factor from 100 Hz to 10 gHz, maximum Value 320 6.5 1 1013 0.06 0.05 3.4 Mechanical properties. The cured molding compound shall conform to the physical and mechanical properties specified in Table II (see 4.4.3). TABLE II. Physical and mechanical properties of
24、 cured molding compound. 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-47224B = 7999906 1636468 328 Property Coefficient of thermal conductivity, British thermal units per hour per square foot per 0.56OC per inch, minimum Linear shrinkage o
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