IEC 60191-6-4-2003 Mechanical standardization of semiconductor devices - Part 6-4 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf

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1、 IEC 60191-6-4 Edition 1.0 2003-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid ar

2、ray (BGA) Normalisation mcanique des dispositifs semiconducteurs Partie 6-4: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiers matriciels billes (BGA) IEC 60191-6-4:2003 THIS PUBLICATION IS

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17、E Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA) Normalisation mcanique des dispositifs semiconducteurs Partie 6-4:

18、Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les dimensions des botiers matriciels billes (BGA) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.080.01 PRICE CODE CODE

19、 PRIX ISBN 978-2-83220-521-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu

20、 cette publication via un distributeur agr. 2 60191-6-4 IEC:2003 CONTENTS FOREWORD . 3 1 Scope . 4 2 Normative references . 4 3 Terms and definitions . 4 4 Reference character and drawings . 5 4.1 Ball grid array package (BGA) Type 1 Ball datum . 5 4.2 Ball grid array package (BGA) Type 2 Body datum

21、 . 6 5 Measuring method 7 5.1 Datum S as pertaining to ball coplanarity. 7 5.2 Datum A, B 7 5.3 Definition of specified dimensions and measuring method . 9 5.4 Profile of a package edge surface v . 11 5.5 Mounting height A . 12 5.6 First stand-off A1 12 5.7 Second stand-off A4 13 5.8 Ball diameter b

22、 14 5.9 Ball centre position X 14 5.10 Ball coplanarity y . 16 5.11 Package top flatness y1 16 Figure 1 BGA package Type 1 Ball datum . 5 Figure 2 BGA package Type 2 Body datum . 6 Figure 3 Datum S . 7 Figure 4 Datum A, B Type 1 8 Figure 5 Centre of ball centres (for an even number) . 8 Figure 6 Cen

23、tre of ball centres (for an odd number) . 8 Figure 7 Datum A Type 2 9 Figure 8 Datum B Type 2 9 Figure 9 Tolerance w . 10 Figure 10 Measuring method of tolerance w . 10 Figure 11 Profile of a package edge surface v . 11 Figure 12 Measuring method of package edge surface v 11 Figure 13 Mounting heigh

24、t A 12 Figure 14 First stand-off A1 . 12 Figure 15 Measuring method of stand-off A1 13 Figure 16 Second stand-off A4 . 13 Figure 17 Measuring method of stand-off A4 14 Figure 18 Ball diameter b . 14 Figure 19 Ball centre position X 15 Figure 20 Theoretically correct ball centre . 15 Figure 21 Measur

25、ing method of ball centre position X 15 Figure 22 Ball coplanarity y 16 Figure 23 Package top flatness y1 . 16 60191-6-4 IEC:2003 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-4: General rules for the preparation of outline drawings of surfa

26、ce mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA) FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). Th

27、e object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IE

28、C National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standard

29、ization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has r

30、epresentation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4)

31、 In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard sh

32、all be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this Internatio

33、nal Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-4 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semic

34、onductor devices. This bilingual version (2012-12) corresponds to the monolingual English version, published in 2003-06. The text of this standard is based on the following documents: FDIS Report on voting 47D/531/FDIS 47D/546/RVD Full information on the voting for the approval of this standard can

35、be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until

36、 2006. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 4 60191-6-4 IEC:2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Me

37、asuring methods for package dimensions of ball grid array (BGA) 1 Scope This part of IEC 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. 2 Normative references The following referenced documents are indispensable for the application of this document. For

38、dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-6:1990, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface m

39、ounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the definitions of IEC 60191-6 apply. The measuring method in this standard is defined for dimension values guaranteed to users on the basis of the following items. 1) In general, measurement may be made

40、either by hand or automatically. 2) If a dimension is difficult to measure, the best alternative measuring method will be defined as the preferred measuring method. 60191-6-4 IEC:2003 5 4 Reference character and drawings 4.1 Ball grid array package (BGA) Type 1 Ball datum A B C 1 2 3 SD A3 A4 SE B2

41、B1 ZD e A1 A A2 v S X4 w S A D Even type b x S B4 B3 B A1 Odd type A1 A2 A2 A e y S A1 E S y1 B S w ZE M IEC 1424/03Figure 1 BGA package Type 1 Ball datum 6 60191-6-4 IEC:2003 4.2 Ball grid array package (BGA) Type 2 Body datum 1 2 3 A B C S A SE B v S y1 S D E v S A2 y2 S e SD x S A B x1 S bp e A3

42、A1 A4 y S ZD ZE A M M IEC 1425/03Figure 2 BGA package Type 2 Body datum 60191-6-4 IEC:2003 7 5 Measuring method 5.1 Datum S as pertaining to ball coplanarity The datum S (seating plane) can be determined by either of the following: a) Datum S formed from the triangulation of the tallest three balls.

43、 The tallest three balls defining the seating plane must fully encompass the projection of the centre of gravity (COG) in order to constitute a valid seating plane. b) Datum S calculated from the LSM (least squares method) plane applies to stand-off A2, stand-off A1, the ball centre point and coplan

44、arity. Calculate a plane from each lowest point of all balls based on LSM. Datum S shall be the LSM plane shifted to bottom of the lowest ball. (b) S Lowest ball (a) Centre of gravity (COG) Least squares method (LSM) plane IEC 1426/03Figure 3 Datum S 5.2 Datum A, B a) Type 1 Centres of opposite side

45、s of a package, which are defined below, shall be connected together. An angle subtended by the two crossing lines shall be obtained. A difference | 90 | of the angle from 90 shall be equally distributed to the sides to obtain orthogonal axes. These datum A and B should be the perpendicular planes t

46、o the datum S. 8 60191-6-4 IEC:2003 Figure 3 B A = 90 2 Definition of the centre of sides IEC 1427/03Figure 4 Datum A, B Type 1 = = = = Ball centre Ball centre Centre of ball centres Centre of ball centres IEC 1429/03 IEC 1428/03Figure 5 Centre of ball centres (for an even number) Figure 6 Centre of

47、 ball centres (for an odd number) b) Type 2 On the E sides of the package (see Figure 2), a minimum of 4 points shall be selected (points 1-4) (see Figure 7). The lines shall be drawn from these points (1-2 and 3-4). The lines that pass through the midpoints of these two lines (5 and 6) will hereaft

48、er be referred to as datum A. On the D sides of the package (see Figure 2) coinciding with datum A, 2 points shall be selected (7 and 8) (see Figure 8). The line perpendicular to datum A passing through the midpoint of this line (7-8) will hereafter be referred to as datum B. 60191-6-4 IEC:2003 9 2 4 (Datum A) 3 5 6 1 IEC 1430/03Figure 7 Datum A Type 2 2 4 (Datum B) 7 8 3 5 6 1 IEC 1431/03Figure 8 Datum B Type 2 5.3 Definition of specified dimensions and measuring method a) Tolerance w of the centre position of package length and width The package width and length should be de