SAE AIR 1277B-2005 Cooling of Military Avoinic Equipment《军用航空电子设备的冷却》.pdf
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1、 AEROSPACE INFORMATION REPORT (R) Cooling of Military Avionic Equipment Issued 1976-05 Revised 2005-02 Superseding AIR1277A AIR1277 REV.B TABLE OF CONTENTS 1. SCOPE 5 1.1 Purpose5 1.2 Field of Application.5 2. REFERENCES.5 2.1 Applicable Documents .5 2.1.1 SAE Publications5 2.1.2 U.S. Government Pub
2、lications .6 2.1.3 U.S. Army Publications 72.1.4 NATO Publications.7 2.2 Related Publications 82.3 Definitions 12 2.4 Abbreviations .14 3. INTRODUCTION154. DESIGN REQUIREMENTS .15 4.1 General Requirements.15 4.1.1 Contract Specification 154.1.2 Military or Government Specifications16 4.1.3 System De
3、sign Process.16 4.2 Avionic Thermal Design Considerations 16 4.2.1 Reliability16 4.2.2 Temperature Effect on Avionic Performance .21 4.2.3 Environmental Requirements.21 4.2.4 Avionic Thermal Control.23 4.2.5 Avionic Integrity Requirements 23 Reaffirmed 2010-05SAE Technical Standards Board Rules prov
4、ide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the us
5、er.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. Copyright 2010 SAE International All rights reserved. No part of this publication may be reproduced, stored in a retrieval sy
6、stem or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE. TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada) Tel: 724-776-4970 (outside USA) Fax: 724-776-0790 Email: CustomerServices
7、ae.org SAE WEB ADDRESS: http:/www.sae.orgSAE values your input. To provide feedbackon this Technical Report, please visit http:/www.sae.org/technical/standards/AIR1277BCopyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without lice
8、nse from IHS-,-,-SAE AIR1277 Revision B - 2 - 4.3 Airframe Systems.244.3.1 Thermal Control Requirements 24 4.3.2 Trade-off Studies24 4.3.3 Environmental Requirements.24 4.3.4 Moisture Condensation 24 5. INTERFACE BETWEEN AVIONICS, ECS, AND AIRCRAFT25 5.1 Interface Cooling Requirements.26 5.2 Life Cy
9、cle Cost.29 5.3 Ram and Compartment Cooling Air .30 5.4 Air and Liquid Cooled Systems30 5.4.1 Forced Air Cooling .305.4.2 Liquid Cooling Systems32 5.5 Fuel Heat Sink35 5.6 Installation36 5.7 Weight36 5.8 Commercial-off-the-shelf (COTS) Avionics 38 6. AVIONIC THERMAL CONTROL HARDWARE DESIGN/SELECTION
10、38 6.1 Line-Replaceable-Unit (Weapon Replaceable Assembly) Thermal Design.38 6.1.1 Passively Cooled (Natural Convection/Radiation) LRUs .40 6.1.2 Actively Cooled (Forced Convection) LRUs.44 6.1.3 Cold Wall-Cooled LRU Thermal Design.50 6.2 Cold Plate Design 556.2.1 Basic Cold Wall Configurations57 6.
11、3 Heat Exchanger Design .59 6.3.1 Plate Fin Heat Exchangers 59 6.3.2 Weight and Other Considerations62 6.4 Specialized Thermal Control Technologies62 6.4.1 Thermoelectric Coolers62 6.4.2 Heat Pipes64 6.4.3 Immersion Cooling .696.4.4 Expendable Liquid Coolants 70 6.4.5 Liquid Coolant Within Board.70
12、6.5 Thermal Analysis Methods.71 6.5.1 Thermal Modeling Techniques.71 6.5.2 Finite-Difference Modeling Techniques72 6.5.3 Finite-Element Modeling Techniques.73 6.5.4 Computational-Fluid-Dynamics (CFD) Simulation .74 6.5.5 ECS Simulation74 7. AIRFRAME THERMAL CONTROL HARDWARE74 7.1 Heat Sink Hardware.
13、75 7.1.1 Ram Air 75 7.1.2 Fuel 75 7.1.3 Expendable Liquid Heat Sinks .76 Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR1277 Revision B - 3 - 7.1.4 Thermal Storage 767.2 ECS Hardware .777.2.1
14、 Transport Loops.77 7.2.2 Fluid Refrigeration78 7.3 Thermal Analysis Methods.80 8. THERMAL TESTING .81 8.1 Thermal Testing of Avionics.82 8.2 Thermal Testing of Cooling Systems and ECS82 9. AVIONIC THERMAL MANAGEMENT CASE STUDIES 83 9.1 FLIR Turret Thermal Control 83 9.1.1 Design for Operation at Hi
15、gh Altitude.85 9.1.2 Design Verification Testing 87 9.1.3 Problems Associated With Forced Convection Cooled Avionics .87 9.2 Liquid-Cooled, Phased Array Radar System .88 9.2.1 Critical Design Issues.899.2.2 Temperature Gradient from Module-to-Module Across the Array 89 9.2.3 Absolute Temperature of
16、Module Components .90 9.2.4 Temperature Cycling909.2.5 Module/Cold Plate Thermal Resistance.91 10. NOTES.91 FIGURE 1 Integrated Circuit Failure Rate as a Function of Junction Temperature.19 FIGURE 2 Relative Performance of CMOS Devices as a Function of Temperature .22 FIGURE 3 Direct Liquid Cooling
17、with Integral Cold Plate 33 FIGURE 4 Indirect Liquid Cooling with Integral Cold Plate34 FIGURE 5 Difference Between Integrated Circuit Junction Temperature and Cooling Air Supply Temperature as a Function of Dissipated Power.39 FIGURE 6 Values of Heat Transfer Coefficient for Different Modes of Heat
18、 Transfer.43 FIGURE 7 Direct Air-Cooled Chassis (PWB Card Rack).45 FIGURE 8 Combined Direct and Indirect Cooled System .45 FIGURE 9 Cold Wall/Thermal Plane Interface for Edge-Cooled PWB 47 FIGURE 10 PWB Chassis with PWBs Edge-Cooled by Conduction to Air-Cooled Cold Wall 47 FIGURE 11 PWB Populated wi
19、th Dual-In-Line (DIP) Packages Mounted in Thermal Plane Card Rail with Interface to Cold Wall .48 FIGURE 12 Leadless Ceramic Chip Carrier (LCCC) and Metal Core Substrate .48 FIGURE 13 Chassis Populated with Air-Cooled Flow-Through Modules 49 FIGURE 14 Cross Section of Flow-Through Module .50 FIGURE
20、15 Three Common Cold Wall Configurations51 FIGURE 16 Liquid-Cooled Cold Wall with Machined, Rectangular-Section Channels 53 FIGURE 17 Isometric Cross Section of Plate Fin Heat Exchanger Construction 60 FIGURE 18 Thermoelectric Cooler 64 FIGURE 19 Basic Construction of Heat Pipes.65 FIGURE 20 Operati
21、ng Temperature Ranges for Various Heat Pipe Working Fluids.66 Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR1277 Revision B - 4 - FIGURE 21 Basic Heat Pipe Configurations66 FIGURE 22 ISEM-2A
22、 Heat Pipe Module .68 FIGURE 23 Heat Pipe Application to Standard Electronics Module (SEM).68 FIGURE 24 SEM-E Temperature Profile With and Without Heat Pipe 69 TABLE 1 Failure Mechanisms Accelerated by Increased Temperature 17 TABLE 2 Temperature Effects on Military Electronic Equipment Reliability
23、21 TABLE 3 Cabin, Avionics and Total ECS Heat Load Trends 27 TABLE 4 Typical Coolant Temperatures .28 TABLE 5 Typical Avionic Mass/Weight37 TABLE 6 Helicopter Cooling Capacities and ECS Mass/Weight .37 TABLE 7 Comparison of Methods of Cooling Electronic Modules.40 TABLE 8 Typical Card Guide Thermal
24、Resistance Values55 TABLE 9 Thermal Testing for Avionic Systems and Aircraft ECS and Cooling Systems 81 Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR1277 Revision B - 5 - 1. SCOPE: This SAE
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