NEMA ICS 12 1-1997 Profiles of Networked Industrial Devices - Part 1 General Rules《连网工业设备设置文件 第1部分 通用规则》.pdf
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1、NEMA Standards PublicationNational Electrical Manufacturers AssociationNEMA ICS 12.1-1997Profiles of Networked Industrial DevicesPart 1: General RulesNEMA Standards Publication ICs 12.1 Profiles of networked industrial devices-Part 1 : General rules Published by National Electrical Manufacturers Ass
2、ociation 1300 N. 17th Street Rosslyn, Virginia 22209 O Copyright 1998 by the National Electrical Manufacturers Association. All rights including translation into other languages, reserved under the Universal Copyright Convention, the Berne Convention for the Protection of Literary and Artistic Works
3、, and the International and Pan American Copyright Conventions. Contents . Foreword III Introduction 1 1 Scope 2 2 Normative references 2 3 Definitions 3 4 Model architecture . 3 4.1 introduction . 3 4.2 Device information presentation . 4 4.3 Minimal information 5 4.4 Optional information . 5 4.5 C
4、onfiguration information ; 5 4.6 Template definition . 5 4.6.1 Template header 6 4.6.2 Template parameters . 10 4.6.3 Template state model . 13 4.6.4 Template assemblies . 16 Rules of use 20 4.7.1 Common state models . 20 4.7.2 Inheritance 22 Profile information exchange language . 24 General format
5、ting rules . 24 5.1.1 Sentence 25 5.1.2 Field delimiters . 25 5.1.3 Strings in fields . 25 5.1.4 Special characters and long lines . 25 5.1.5 Number fields . 25 5.1.6 In-line comments 25 5.1.7 Profile information exchange example . 26 Parameter and assembly information . 26 5.2.1 cH profile header i
6、nformation . 26 5.2.2 comments . 27 4.7 5 5.1 5.2 . 5.2.3 cP parameter information 27 5.2.4 5.2.5 5.2.6 cb parameter value description . 27 assembly information 28 assembly mapping . 28 ICs 12.1 -1 997 Page ii 5.3 State information 29 state names . 29 state transitions 29 state identification 29 sta
7、te transition command . 30 5.4 Option definitions 30 5.3.1 5.3.2 5.3.3 5.3.4 5.4.1 5.4.2 5.4.3 option header definition 30 parameter supported 31 Memory mapped network binding 32 assembly supported . 31 6 Binding architecture . 32 6.1 6.2 6.3 6.4 Message based network models 34 Buffer based network
8、model . 35 Additional restrictions and requirements in binding models . 35 Annex A (informative) Profile and state model examples 37 A.l Simple sensing device 37 A.2 Breaker device 38 A.3 Intelligent device with self test and external reset 40 A.4 Keypad device profile . 43 A.5 Simple sensor with al
9、arm and control . 43 A.6 AC drive profile . 45 ICs 12.1-1997 Page iii Foreword This Standards Publication provides general rules and definitions for the development of profiles for networked industrial devices. This Standards Publication was prepared by the Industrial Device Communications Task Forc
10、e of the NEMA Industrial Control and Systems Section. User needs and safety considerations were addressed during the preparation of this Standard. At the time of publication of this Standard, ICs 12.1, Profiles of networked industrial devices, is envisioned to be published in multiple parts, as foll
11、ows: ICs 12.1 ICs 12.2 ICs 12.3 ICs 12.4 ICs 12.5 ICs 12.6 ICs 12.7 ICs 12.8 ICs 12.9 ICs 12.10 General rules Device Profiles Profile Bindings to Actuator Sensor Interface Profile Bindings to SDSm Smart Distributed System Profile Bindings to DeviceNeP Profile Bindings to InterBus-S Profile Bindings
12、to LonTalkB Profile Bindings to Profibus-DP Profile Bindings to The Serial MuItMlexed Control Bus (SMCB) Profile Bindings to WorldFIP Profile 1 To facilitate consideration by the International Electrotechnical Commission (specifically, IEC/SC 7B), all parts of ICs 12.1 are being written according to
13、 the IEC Directives for the drafting and presentation of international standards. In this Standards Publication, clauses 1 to 6 are normative; Annex A is informative. The NEMA Industrial Control and Systems Section will periodically review this Standard and revise it as necessary to reflect advancin
14、g technology. Proposed or recommended revisions should be sent to: Vice President, Engineering National Electrical Manufacturers Association 1300 North 17th Street, Suite 1847 Rosslyn, Virginia 22209 This Standards Publication was approved by the NEMA Industrial Automation Control Products and Syste
15、ms Section. Section approval of the standard, however, does not necessarily imply that all section members voted for its approval or participated in its development. At the time this Standard was approved, the Industrial Automation Control Products and Systems Section consisted of the following memb
16、ers: ABB Control, Inc. -Wichita Falls, TX AEG Automation Systems Corporation - Pittsburgh, PA Allen-Bradley Company - Milwaukee, W I Amerace Electronics Components - Punta Gorda, FL AMP Inc. - Harrisburg, PA Automatic Switch Company - Florham Park, NJ Baldor Electric - Fort Smith, AR Balluff, Inc. -
17、 Florence, KY USD Products, Bussman Division, Cooper Industries - Chicago, IL CEGELEC Automation - Macon, GA Control Concepts - Beaver, PA ICs 12.1-1997 Page iv Cyberex - Mentor, OH Danaher Controls - Gurnee, IL Eaton Corporation, Cutler-Hammer Products - Milwaukee, W I Echelon - Palo Alto, CA Elect
18、rical Power Systems, Inc. - Tulsa, OK Electro Switch Corporation - Weymouth, MA Elliott Control Company - Hollister, CA Emerson Electric Company - Grand Island, NY Entrelec, Inc. - Irving, TX Firetrol, Inc. - Cary, NC Fisher-Rosemount - Marshalltown, IA General Electric - Plainville, CT I Gerber Sci
19、entific - South Windsor, CT Gettys Corporation - Racine, WI Harland Simon Control Systems - Baldwinsville, NY Harnischfeger Corporation - Milwaukee, W I Honeywell, Inc. - Fort Washington, PA Hubbell Incorporated - Madison, OH Joslyn Clark Control, Inc. - Lancaster, SC Kiliark-Stahl, Inc. - St. Louis
20、, MO Klockner-Moeller Corporation - Franklin, MA Lexington Switch Presentation Layer (6) Session Layer Transport Layer (41 4.2 Device information presentation Standard Device profiles may be viewed as the formal definition of the presentation of data in the application layer in the OS1 communication
21、s reference model, as shown in Figure 1, The profiles define the format in which the data is presented, in particular how the individual elements of information are collected and formatted, and how the device is commanded. Standard . Ap p I i cati0 n Layer t Definition . 5 Network I binding model Da
22、ta Link Layer Physical Layer Interface is the network Network Layer (3) Data Link Laver (2) I Physical Layer (11 Figure 1 - OS1 reference model and scope of standard Many industrial networks use a collapsed version of the OS1 model. The collapsed model has only layers 1,2, and 7 as distinct layers.
23、Any functionality normally defined in one of the missing layers is incorporated into one of the defined layers. The device presentation in the collapsed model, as defined by the device profile, would be part of the application layer, as shown in Figure 2. “Collapsed” Network Model on Connected Devic
24、e I User Layer Scope of Figure 2 - Scope in a collapsed network model ICs 12.1-1997 Page 5 4.3 Minimal information In this standard, the device profile specifies the minimal information which can be exchanged with the device. The minimal information shall be the infomation shared at run time to moni
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