NAVY MIL-STD-2198-1990 DESIGN REQUIREMENTS FOR METAL ELECTRICAL BACKPLANE ASSEMBLIES《金属电子底版装置设计需求》.pdf
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1、La I INCH-POUND I MIL-STD-2198 2LEmwum MILITARY STANDARD DESIGN REQUIREMENTS FOR META1 ELECTRICAL BACKPLANE ASSEMBLIES MSC N/A FSC 5998 DISTRIBUTION STATEMENT A. Approved for pub1 IC release: distributlon is unlimited. a : Licensed by Information Handling ServicesMIL-STD-2LSB 53 77737LL O087334 T MI
2、 L-STD- 2 198 FOREWORD le This military standard is approved for use by all Departments and Agencies of the Department of Defense. 2, Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: of the Navy,
3、 Washington, DC 20362-5101, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. Commander, Naval Sea Systems Command (SEA 5523), Department li Licensed by Information Handling ServicesI E MIL-STD-2198 57 7797733
4、 OO7135 3 W - . . I 2% *- 3 . DEFINITIONS 5 3.1 Metal electrical backplane assembly . 5 3.2 Solderless wrapped electrical connection . 5 3.3 Ground plane . 5 3.4 Voltage plane 5 3.5 Backplane 5 3.6 Keying pegs . 5 . MIL-STD- 2198 CONTENTS PARAGRAPH . PAGE 1 . SCOPE . 1 1.1 Scope 1 1.1.1 Applicabilit
5、y 1 1.2 Classification 1 2 . APPLICABLE DOCUMENTS 2 2.1 Government documents . 2 2.1.1 Specifications and standards . 2 2.2 Non-Government publications . 3 2.3 Order of precedence 4 4 . GENERAL REQUIREMENTS 6 4.1 Design requirements 6 4.1 . 1 Metal electrical backplane assembly design requirements .
6、 . . . . o . . . . o . o o 6 4.2 Metal electrical backplane assembly drawing 6 4.2.1 Conflict . 7 5 . DETAILED REQUIREMENTS . 8 5.1 Purpose . 8 5.2 Backplane assembly construction. 8 5.2.1 Material 8 5.2.1.1 Components . 8 5.2.1.2 Backplane. type 1 . 8 5.2.1.3 Backplane. type 2 e . . e . . + I 8 5.2
7、.1.4 Material finish 9 5.2.1.4.1 Backplane. type 1- 9 5.2.1.4.2 Backplane. type 2 9 5.2.2 Hole pattern 9 5.2.2.1 Hole pattern accuracy . 9 iii Licensed by Information Handling ServicesMIL- STD-2198 CONTENTS . Continued e PARAGRAPH . PAGE 5.3 Assembly . 10 5.3.1 Components . io 5.3.1.1 Wrappost tail
8、tip position . 10 5.3.1.2 Replacement . 10 5.3.2.1 Insulation resistance . 10 5.3.2.2 Dielectric withstanding voltage 10 5.3.2.4 Capacitance between layers (type 2) 10 5.3.3 Mechanical requirements 11 5.3.3.1 Bow and twist . 11 5.3.3.2 Contact and bushing retention . 11 5.3.3.3 Contact torque . 11 5
9、.3.3.4 Keying peg retention 11 5.3.3.5 Engaging and separating forces . 11 5.3.3.5.1 Standard contacts 11 5,3,3.5.2 Low Insertion Force (LIF) contacts 11 . 5.3.3.6 LIF normal force 11 5.3.4 Environmental requirements . 12 5.3.4.1 Durability . 12 5.3.4.2 Salt spray . 12 5.3.4,3 Shock . 12 5.3.4.4 Hum
10、idity 12 5.3.4.5 Temperature cycling 12 .5.3. 4.6 Vibration . 12 5.4 Marking 12 5.4.1 Marking ink 12 5.3.2 Electrical requirements . e . . . . e 10 5.3.2.3 Backplane to contact resistance (type 2) . 10 6 . NOTES. 13 6.1 Intended use . 13- 6. 2 Issue of DoOISS . 13 6.3 Data requirements 13 6.3.1 Data
11、 for program managers 13 6.4 Subject term (keyword) listing 14 IV Licensed by Information Handling ServicesMIL- STD- 2 198 CONTENTS - Continued. FIGURE - PAGE 1. Cross sectional view of a metal backplane assembly . . . 15 2. Two layer backplane showing mounting holes . . . . . . . 18 3. Typical hole
12、 pattern . . . , . . . . . . I . . . o 19 V Licensed by Information Handling Services-. c t MI L- STD - 2 198 1. SCOPE 1.1 Scope, The purpose of this document is to establish general design requirements for metal electrical backplane assemblies of al uminum sheet or sheets on which separately manufa
13、ctured component parts, qual ified in accordance with MIL-C-28754, have been added. 1.1.1 Appl icabil i ty, The metal backpl anes of these assembl les are used to provide physical support and location for electronic contacts. The two layer metal electrical backplane assembly may also be used to dist
14、ribute power or ground throughout the backplane. The electronic module blade contacts engage the tuning fork receptacles in the backplane and are interconnected to other electronic modules vi a the solder1 ess wrap wire located on the side opposite the contacts on the backplane. 1.2 Classification.
15、Metal electrical backplane assembl les shall be of the following types: (a) Type 1: one layer. (b) Type 2: two layer. e 1 .i . Licensed by Information Handling Services- _ MIL-STD-2198 59 9999933 0087134 4 M I L - STD- 2 198 2. APPLICABLE DOCUMENTS 2.1 Government document s. 2.1.1 Specifications and
16、 standards. The following specifications and standards form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those 1 isted in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement ther
17、eto, cited in the solicitation (see 6.2). SPEC IF ICATIONS FEDERAL L - P-509 Plastic Sheet, Rod and Tube, Laminated, QQ-A-250/8 QQ-A-250/11 Thermosetting , Al uminum Al 1 oy 5052, P1 ate and Sheet. Al uminum Alloy 6061, P1 ate and Sheet. MILITARY MIL-C-5541 MI L-A-8625 MIL-P-13949/12 Plastic Sheet,
18、Laminated, Materials (For Printed Chemi cal Convers i on Coat i ngs on Al umi num and Al umi num Al 1 oys Anodic Coatings, for Aluminum and Aluminum Alloys. Wiring Boards), GF Base Material, Glass Fabric, Woven, Majority Difunctional Epoxy Resin Preimpregnated (8-Stage) o Layer, General Speci fi cat
19、 i on for. General Specification for. Keying Pegs. MIL-A-24741 Assemblies, Metal Electrical Backplane, One and Two MIL-C-28754 Connectors, Electrical Modul ar, and Component Parts, MIL-C-28754/39 Connectors , Electrical , Modul ar, Connector, Type I I I , MIL-1-43553 Ink, Marking, Epoxy Base. 2 Lice
20、nsed by Information Handling ServicesMI L - STD- 2 198 STANDARDS MI L I TARY DOD-STD-100 Engineering Drawing Practices. MIL-STD-1130 Connections, Electrical , Solderless Wrapped. (Unless atherwise indicated, copies of federal and military specifications and standards are available from the Naval Pub
21、1 ications and Forms Center, (ATTN: NPODS), 5801 Tabor Avenue, Philadelphia, PA 19120-5099.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. specified, the issues of the documents which are DoD adopted are those listed in the issu
22、e of the DoDISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the documents cited in the solicitation (see 6.2). Unless otherwise AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI Y14.5 ANSI Y32.16 Standard Reference Designa
23、tions for Electrical and Dimensi oni ng and To1 eranci ng Electronics Parts and Equipments. (Application for copies should be addressed to the American National Standards Institute, Inc, 1430 Broadway, New York, New York 10018.) AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM B209 Standard Sp
24、ecification for Aluminum and Aluminum- Alloy Sheet and Plate. (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, Pennsylvania 19103.) (Non-Government standards and other pub1 ications are normally available from the organiza
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