FORD WSS-M1P83-E1-2015 ELECTROPLATING BRIGHT OR LOW GLOSS DECORATIVE FINISH OVER ABS PC ABS OR FILLED NYLON C INTERIOR TO BE USED WITH FORD WSS-M99P1111-A .pdf
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1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev. 2 2015 01 22 Editorial See Summary of Revisions S. Draheim, NA 2015 01 07 Editorial See Summary of Revisions S. Draheim, NA 2014 11 05 Released S.Draheim , NA Controlled document at www.MATS Copyright 2015, Ford Global Technologies, LLC
2、Page 1 of 6 ELECTROPLATING, BRIGHT OR LOW GLOSS DECORATIVE FINISH WSS-M1P83-E1 OVER ABS, PC/ABS OR FILLED NYLON INTERIOR 1. SCOPE This specification defines the performance requirements for finished coatings of mechanically or chemically deposited electrical conductor coat and electrodeposited coppe
3、r, nickel, and chromium for the decoration and protection of acrylonitrile butadiene styrene (ABS) or polycarbonate/acrylonitrile butadiene styrene (PC/ABS) or filled nylon (PA) parts. 2. APPLICATION This specification was released originally where a bright or low gloss decorative and/or protective
4、finish is required for interior parts. Unless otherwise specified on the engineering drawing, all parts shall be finished with a final coating of chromium. 3. REQUIREMENTS All requirements identified for each specification must be met to achieve acceptable field durability. No one requirement, exclu
5、sive of others, is capable of insuring satisfactory performance. Any deviations to the requirements of these specifications may be subject to additional performance requirements. All part testing requirements apply to those areas of the part identified as a significant surface (per paragraph 4.3) un
6、less otherwise specified on the engineering drawing. Test specimens must be aged for at least 72 hours prior to testing. 3.1 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-
7、A). 3.2 FINISHED PARTS Testing must be done on actual production parts or a section of the part whenever possible. Where part dimensions limit equipment access, representative panels or plaques may be substituted for production parts with approval from responsible Design Engineer. The use of re-grin
8、d or recycled substrate material is prohibited. Testing to be conducted at Design Verification (DV) or Process Validation (PV) per Table 1 Section 4.6, unless otherwise agreed to by responsible Design Engineer. 3.3 APPEARANCE The plated parts shall be free from surface imperfections. Parts shall mat
9、ch the approved Styling Master sample for appearance from Color & Trim and the Approved Boundary Sample. ENGINEERING PERFORMANCE SPECIFICATION WSS-M1P83-E1 Copyright 2015, Ford Global Technologies, LLC Page 2 of 6 3.4 PLATING ADHESION Acceptance criteria for sections 3.4.2, 3.4.3, 3.4.4, 3.4.5: No p
10、eeling, flaking, or lifting of the electroplate from the substrate or between the layers. Residual stress in part substrates are areas of potential weak adhesion. Performing the residual stress test below will identify the molded in stresses of the part. Parts not requiring the residual stress test
11、should be tested in the location of the largest area of significant surface. 3.4.1 Residual Stress Test (ABS Substrate only) Report should include (Not required for PC+ABS or PA substrates) photos of tested part (Only for parts with significant surfaces 20 sq. cm and control part or greater) Test Me
12、thod: Totally immerse the un-plated part in Glacial Acetic Acid, 99% purity at 24C +/-3 (75F +/-5F), for 30 seconds Immediately rinse the part in IPA water to remove the Acetic Acid and allow to dry at room temperature. Any color change from the control indicates concentration of residual or molded-
13、in- stresses. These areas should be circled and photographed for the test report. Adhesion tests should be carried out as specified in table 2. 3.4.2 Grind-Saw (ASTM B 571, The saw blade shall have 16 to 18 teeth/inch.) The number of tests and locations should be carried out as specified in table 2.
14、 No peeling, flaking, or lifting of the electroplate from the substrate or between plating layers. 3.4.3 Bend Test (ASTM B 571 paragraphs 3.1 or 3.2 permissible) The number of tests and locations should be carried out as specified in table 2. No peeling, flaking, or lifting of the electroplate from
15、the substrate or between plating layers. 3.4.4 Scribe-Grid Test (ASTM B 571, except as modified below) The number of tests and locations should be carried out as specified in table 2. This test is not required for parts too small to scribe 1 (0.5cm X 0.5cm) square stated below. Use the following mod
16、ifications to the method: ENGINEERING PERFORMANCE SPECIFICATION WSS-M1P83-E1 Copyright 2015, Ford Global Technologies, LLC Page 3 of 6 Lightly hand sand plated surface (10 double rubs, moderate pressure) with P600 paper until dull. Clean area with Isopropyl Alcohol. With a hardened steel, 30 tip bla
17、de, scribe eight lines in a square grid in 0.5 cm increments or smaller. If part surface area does not allow room for the 9 squares, scribe as many 0.5cm squares that can fit. Use 3M No. 898 pressure sensitive tape. An equivalent tape can be used if agreed upon by Materials Engineering as long as th
18、e Adhesion Strength is greater or equal to the 3M 898 tape (80N/mm per ASTM D 3330). No peeling, flaking, or lifting of the electroplate from the substrate or between plating layers. 3.4.5 Thermal Shock Rating 20 min (FLTM BI 107-05) The number of tests and locations should be carried out as specifi
19、ed in table 2. No peeling, flaking, or lifting of the electroplate from the substrate or between plating layers. 3.5 PLATING THICKNESS (ASTM B 487, ASTM B 504, ASTM B 568) It is the suppliers responsibility to identify the plating thickness distribution for each unique part design and rack design by
20、 mapping the plating racks and plated parts. Areas of low and high current density are to be documented on a part map indicating locations that plating measurements will be taken. Plating thickness to be determined by Microscopic Examination (ASTM B 487), Coulometric Method (ASTM B 504), or X-Ray Sp
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