FORD ESB-M4D195-B-2009 POLYVINYL CHLORIDE DIELECTRIC BONDING GRADE TO BE USED WITH FORD WSS-M99P1111-A 《高频焊接级聚氯乙烯 与标准FORD WSS-M99P1111-A一起使用 》.pdf
《FORD ESB-M4D195-B-2009 POLYVINYL CHLORIDE DIELECTRIC BONDING GRADE TO BE USED WITH FORD WSS-M99P1111-A 《高频焊接级聚氯乙烯 与标准FORD WSS-M99P1111-A一起使用 》.pdf》由会员分享,可在线阅读,更多相关《FORD ESB-M4D195-B-2009 POLYVINYL CHLORIDE DIELECTRIC BONDING GRADE TO BE USED WITH FORD WSS-M99P1111-A 《高频焊接级聚氯乙烯 与标准FORD WSS-M99P1111-A一起使用 》.pdf(4页珍藏版)》请在麦多课文档分享上搜索。
1、 ENGINEERING MATERIAL SPECIFICATION Material Name Specification Number Date Action Revisions 2009 07 28 N-STATUS No Replacement Named Y. Bankowski, NA 1978 08 10 Metricated, Renumbered and retyped CAHI-RD572066-76 1971 06 21 Released ab1-302-3 Page 1 of 3 POLYVINYL CHLORIDE, DIELECTRIC BONDING GRADE
2、 ESB-M4D195-B NOT TO BE USED FOR NEW DESIGN 1. SCOPE: The material defined by this specification is an extrusion or calendared grade vinyl copolymer or homopolymer, suitable for dielectric bonding. 2. APPLICATION: This specification was released originally for material used to manufacture dielectric
3、ally bonded heelpads on formed carpet assemblies. 3. REQUIREMENTS: 3.1 CONDITIONING All test values indicated herein are based on materials conditioned in a controlled atmosphere of 23 +/- 2 C and 50 +/- 5% relative humidity for 24 h prior to testing and tested under the same controlled conditions.
4、3.2 APPEARANCE (FLTM BI 9-1) The color, pattern, and finish shall match the approved Design Center master sample, or shall be as specified on the engineering drawing. 3.3 CONSTRUCTION May be either pretextured and embossed or textured and embossed during the bonding operation. It shall bond to the c
5、arpet or fabric base in such a manner as to provide full adhesion in all contact areas and shall have a minimum functional thickness above the pile or fabric base of 0.030 in (0.76 mm). 3.4 HARDNESS - DUROMETER “D“ (ASTM D 2240, 15 s interval) Shall be as specified on the engineering drawings and th
6、e vinyl shall meet the physical requirements as specified in ESB-M1G6. 3.5 DIELECTRIC HEATING Shall not blister, boil, burn or char during the dielectric process in either with or across machine direction. Decorative embossing shall not become shiny or be removed during this processing. Engineering
7、Material Specification ESB-M4D195-B Page 2 of 4 3.6 ASSEMBLY 3.6.1 Cold Flexibility (FLTM BN 2-1) Shall remain flexible and not crack when bent 180 deg around a 1/2 in (12.7 mm) diameter mandrel at -29 C. 3.6.2 Adhesion, peel strength, min 10 lb/in (1.8 kN/m) width (Before or after 7 days aging at 1
8、02 C, 12 in (300 mm)/min) Shall not separate from the pile or fabric base without internal tearing or pulling out of the pile yarns, and shall show no more color change than the master sample, (as approved for production by the Textile Laboratory, Body Materials Engineering Department) on file in th
9、e Testing Laboratories. 3.6.3 H2S STAINING (FLTM AN 2-1) Shall correspond to a rating of 5 when compared to the AATCC Chart for measuring the transference of color. Production materials shall exhibit H2S staining qualities equal to or better than the master sample (as approved for production by the
10、Textile Laboratory, Body Materials Engineering Department) on file in the Testing Laboratories. 3.6.4 Fade (FLTM BN 1-1) Shall not stain, exhibit color tone change or change in hue, in accordance with rating 5 of the AATCC Chart for measuring transference of color after 120 SFH exposure. Production
11、materials shall exhibit lightfastness qualities equal to or better than the master sample (as approved for production by the Textile Laboratory, Body Materials Engineering Department), on file in the Testing Laboratories. 3.6.5 Scuffing Resistance, min 10 cycles (FLTM BN 8-4, 2 lb (907 g) load, “A“
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