EN 62047-1-2006 en Semiconductor devices - Micro-electromechanical devices Part 1 Terms and definitions《半导体器件 微电机设备 第1部分 术语和定义 IEC 62047-1 2005》.pdf

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1、BRITISH STANDARDBS EN 62047-1:2006Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitionsThe European Standard EN 62047-1:2006 has the status of a British StandardICS 31.080.99g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g

2、3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 62047-1:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 29 September 2006 BSI 2006ISBN 0 580 49123 4National forewordThis Britis

3、h Standard was published by BSI. It is the UK implementation of EN 62047-1:2006. It is identical with IEC 62047-1:2005.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on EPL/47 can be obtained on request to its s

4、ecretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STAND

5、ARD EN 62047-1 NORME EUROPENNE EUROPISCHE NORM June 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All righ

6、ts of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62047-1:2006 E ICS 31.080.99 English version Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitions (IEC 62047-1:2005) Dispositifs semiconducteurs - Dispositifs microlec

7、tromcaniques Partie 1: Termes et dfinitions (CEI 62047-1:2005) Halbleiterbauelemente - Bauteile der Mikrosystemtechnik Teil 1: Begriffe und Definitionen (IEC 62047-1:2005) This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal

8、Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member

9、. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC m

10、embers are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spa

11、in, Sweden, Switzerland and the United Kingdom. Foreword The text of the International Standard IEC 62047-1:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 62047-1 on 2006-06-01 without any modification. The follo

12、wing dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-06-01 _ Endorsement notic

13、e The text of the International Standard IEC 62047-1:2005 was approved by CENELEC as a European Standard without any modification. _ 2 EN 62047-1:2006CONTENTS 1 Scope 4 2 Terms and definitions .4 2.1 General terms4 2.2 Terms relating to science and engineering .5 2.3 Terms relating to material scien

14、ce6 2.4 Terms relating to functional element.7 2.5 Terms relating to machining technology .12 2.6 Terms relating to bonding and assembling technology 18 2.7 Terms relating to evaluation technology .20 2.8 Terms relating to application technology 21 Annex A (informative) Standpoint and criteria in ed

15、iting this glossary 24 3 EN 62047-1:2006SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 1: Terms and definitions 1 Scope This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices. 2 Terms and definitions For the purposes o

16、f this document, the following definitions apply. 2.1 General terms 2.1.1 micro-electromechanical device microsized device, in which sensors, actuators, mechanical components and/or electric circuits are integrated 2.1.2 MEMS microsized electromechanical systems, in which sensors, actuators and/or e

17、lectric circuits are integrated on a chip using a semiconductor process NOTE MEMS is an acronym standing for “micro-electromechanical systems“. The term MEMS is mostly used in the United States. In general, this term means technologies to realize microstructures, sensors, and actuators by using sili

18、con process technology, though it is occasionally used in some other meanings. 2.1.3 MST technologies to realize microelectrical, optical and machinery systems and even their components by using micromachining NOTE MST is an acronym standing for microsystem technologies. The term MST is mostly used

19、in Europe. 2.1.4 micromachine miniaturized devices the components of which are several millimeters or smaller in size, or a microsystem that consists of an integration of such devices NOTE The term micromachine has a broad sense from a functional device such as sensor that utilizes the micromachine

20、technology to a completed system. A molecular machine called a nanomachine is also included. Such industrial applications are expected as inspection and repair systems for piping or confined spaces, and micro-factories, which consume less energy. In the medical field, micromachines are expected to r

21、eplace ordinary surgery by less invasive treatment from the inside of the body. Research and development for the realization of micromachines is divided into two approaches: micro-electromechanical systems (MEMS) using semiconductor manufacturing processes, and miniaturization of the existing machin

22、e technologies. 4 EN 62047-1:20062.1.5 micromachine technology technology relating to micromachines NOTE Micromachine-related technologies are extremely diversified. In the fundamental technology field, micromachine technologies include: design, material, processing, functional element, system contr

23、ol, energy supply, bonding and assembly, electrical circuit, and evaluation as well as micro-science and engineering such as thermodynamics and tribology in a microscale. Micromachine technologies have two aspects: technologies required to realize micromachines, and technologies required to apply su

24、ch technical seeds to other industrial fields. 2.2 Terms relating to science and engineering 2.2.1 micro-science and engineering science and engineering for the microscopic world of micromachines NOTE When mechanical systems are miniaturized, various physical parameters change. Two cases prevail: 1)

25、 these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity of the microscopic world becomes apparent and extrapolation is not possible. In the latter case, it is necessary to establish new theoretical and empirical equations for the explanation of phenome

26、na in the microscopic world. Moreover, new methods of analyses and syntheses to deal with engineering problems must be developed. Material science, fluid dynamics, thermodynamics, tribology, control engineering, and kinematics can be systematized as micro-sciences and engineering supporting micromec

27、hatronics. 2.2.2 scale effect changes of various effects on the objects behaviour or the properties caused by the change of the objects dimension NOTE The volume of an object is proportional to the third power of its dimension, while the surface area is proportional to the second power. As a result,

28、 effect of surface force becomes larger than that of the body force in the microscopic world. For example, the dominant force in the motion of microscopic object is not the inertial force but the electrostatic force or viscous force. Material properties of microscopic objects are also affected by th

29、e internal material structure and surface, and, as a result, characteristic values are sometimes different from those of bulks. Frictional properties in the microscopic world also differ from that in the macroscopic world. Therefore, those effects must be considered cautiously while designing a micr

30、omachine. 2.2.3 mesotribology tribology applying to the intermediate mesoscopic area between the microscopic world and the macroscopic world NOTE Tribology deals with friction and wear in the macroscopic world. On the other hand, two major topics of microtribology research are the investigation of t

31、ribology phenomena on an atomic or molecular scale, and the quantification of characteristics in friction or wear. If the macro-characteristics generated on both surfaces undergoing relative motion are traced to where they originate, the minimum unit of the atomic or molecule cluster causing those c

32、haracteristics is reached. Observation on a finer scale reaches a boundary at which these characteristics disappear. Mesotribology pursues new developments on the micro-macro boundary by bringing together atoms on a subnanometer scale to create a mesoscopic scale and investigating the tribological p

33、henomena on this scale. 5 EN 62047-1:20062.2.4 microtribology tribology for the microscopic world of micromachines NOTE Tribology deals with friction and wear in the macroscopic world. On the other hand,when the dimensions of components such as those in micromachines become extremely small, surface

34、force and viscous force become dominant instead of gravity and inertial force. According to Coulombs law of friction, frictional force is proportional to the normal load. In the micromachine environment, because of the reaction between surface forces, a large frictional force occurs that would be in

35、conceivable in an ordinary scale environment. And very small quantity of abrasion that would not become a problem in an ordinary scale environment can fatally damage a micromachine. Microtribology research seeks to reduce frictional forces or to discover conditions that are free of friction, even on

36、 an atomic level. In this research, phenomena that occur with friction surfaces or solid surfaces at from angstrom to nanometer resolution are observed, or analysis of interaction on an atomic level is performed. These approaches are expected to be applied in solving problems in tribology for the or

37、dinary scale environment as well as for the micromachine environment. 2.2.5 biomimetics creating functions that imitate the motions or the mechanisms of organisms NOTE In devising microscopic mechanisms suitable for the micromachines, the mechanisms and structures of organisms that have survived sev

38、ere natural selection may serve as good examples to imitate. One example is the microscopic three-dimensional structures that were modelled after the exoskeletons and elastic coupling systems of insects. In exoskeletons, hard epidermis is coupled with an elastic body, and all movable parts use the d

39、eformation of the elastic body to move. The use of elastic deformation would be advantageous in the microscopic world to avoid the friction. Also, the exoskeleton structure equates to a closed link mechanism in kinematics and has the characteristic that some actuator movement can be transmitted to m

40、ultiple links. 2.2.6 ciliary motion coordinated motion of multiple cilia NOTE Progressive waves are generated by coordinated motion of multiple cilia, which is used to transfer fluid or tiny particles, or are used to propel a microscopic organism itself. An example of the former is the ejection of m

41、icroscopic waste from human tracheae, and of the latter is the swimming of unicellular organisms, such as paramecium. By imitating these ciliary motions, actuators with many artificial cilia have been fabricated by micromachining. 2.2.7 self-organization organization of a system without any external

42、 manipulation or control, where nonequilibrium structure emerges spontaneously due to the collective interactions among a number of simple microscopic objects or phenomena 2.3 Terms relating to material science 2.3.1 shape memory polymer resin that can recover its primary shape after being deformed

43、when it is heated or receives any other stimuli NOTE To have the shape memory property, a resin has to have mixed domains of the bridged or partially crystallized fixed phase and the reversible phase. Memorizing and restoring a shape takes the following steps. The resin is kept above a specific temp

44、erature to soften both the fixed and reversible phases. Then, holding the resin in one shape (primary shape), temperature is lowered to freeze the fixed phase while the reversible phase is kept soft, thereby storing memory of the primary shape. Then the resin is deformed to another shape (secondary

45、shape) by external force, and cooled further to freeze the reversible phase and keep the secondary shape. In this state, the secondary shape is retained even if the external force is removed. The stored primary shape is restored if the resin is heated to the temperature at which only the reversible

46、phase softens. Since restoration shape is enabled by softening by heat, the generated force is limited. Some resins recover shape not by heat but by changes in pH, electrical stimuli, or light stimuli. Shape memory resins are made of polyester, polyurethane, styrene butadiene, polynorbornane, transp

47、olyisoprene, and so on. 6 EN 62047-1:20062.3.2 modification processing technology that modifies physical or chemical properties of the material NOTE Modification processes include local doping by a focused ion beam, laser doping inducing phase transition such as single crystal formation, ion implant

48、ation, and ion mixing. 2.4 Terms relating to functional element 2.4.1 actuator mechanical device that converts various types of energies such as electric energy, chemical energy into kinematic energy to perform mechanical work NOTE For a micromachine to perform mechanical work, the microactuator is

49、indispensable as a basic component. Major examples are the electrostatic actuator prepared by silicon process, piezoelectric actuator that utilizes functional materials like lead zirconate titanate, PZT, pneumatic rubber-actuator, and so on. Many other actuators based on various energy conversion principles have been investigated and developed. However, all these actuators deteriorate their energy conversion efficiency as their size is reduced. Therefore, motion mechanisms of organisms such as deformation of protein molecules, flagel