EN 61192-2-2003 en Workmanship requirements for soldered electronic assemblies Part 2 Surface-mount assemblies《钎焊电子组件的工艺要求 第2部分 表面安装组件 IEC 61192 2003》.pdf

《EN 61192-2-2003 en Workmanship requirements for soldered electronic assemblies Part 2 Surface-mount assemblies《钎焊电子组件的工艺要求 第2部分 表面安装组件 IEC 61192 2003》.pdf》由会员分享，可在线阅读，更多相关《EN 61192-2-2003 en Workmanship requirements for soldered electronic assemblies Part 2 Surface-mount assemblies《钎焊电子组件的工艺要求 第2部分 表面安装组件 IEC 61192 2003》.pdf（68页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies The European Standard EN 61192-2:2003 has the status of a British Standard ICS 31.190 BS EN 61192-2:2003 This British Standard was published under the authority of the Sta

2、ndards Policy and Strategy Committee on 25 June 2003 BSI 25 June 2003 ISBN 0 580 42113 9 National foreword This British Standard is the official English language version of EN 61192-2:2003. It is identical with IEC 61192-2:2003. The UK participation in its preparation was entrusted to Technical Comm

3、ittee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this documen

4、t may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Us

5、ers are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for chang

6、e, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 65 and a back cover. The BSI copyright date displayed in this doc

7、ument indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 61192-2 NORME EUROPENNE EUROPISCHE NORM April 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europis

8、ches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-2:2003 E ICS 31.190 English version Workmanship requirements for solde

9、red electronic assemblies Part 2: Surface-mount assemblies (IEC 61192-2:2003) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 2: Assemblage par montage en surface (CEI 61192-2:2003) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 2: Baugruppen in Oberfl

10、chenmontage (IEC 61192-2:2003) This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-

11、date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation und

12、er the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary,

13、Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 91/357/FDIS, future edition 1 of IEC 61192-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC par

14、allel vote and was approved by CENELEC as EN 61192-2 on 2003-04-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-01-01 latest date by which the national standards conf

15、licting with the EN have to be withdrawn (dow) 2006-04-01 This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount assemblies Part 4: Terminal assemblie

16、s Annexes designated “normative“ are part of the body of the standard. In this standard, annexes A and ZA are normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-2:2003 was approved by CENELEC as a European Standard without any modific

17、ation. _ Page2 EN611922:200361192-2 IEC:2003 3 CONTENTS INTRODUCTION.7 1 Scope.8 2 Normative references8 3 Terms and definitions .9 4 General requirements .9 4.1 Classification.9 4.2 Conflict9 4.3 Interpretation of requirements10 4.4 Antistatic precautions 10 5 Component preparation processes10 6 So

18、lder paste deposition process qualification 10 6.1 Solder paste characteristics.10 6.2 Assessment of the process10 6.3 Solder paste deposition Screen and stencil printing methods Process control limits.11 7 Non-conductive adhesive deposition process 13 7.1 Pot life.13 7.2 Inter-stage storage and han

19、dling13 7.3 Adhesive tackiness14 7.4 Assessment of the adhesive attachment process .14 7.5 Adhesive deposition Syringe dispensing method Small components Process control limits.14 8 Temporary masking processes .17 9 Component placement processes .17 9.1 Assessment of the process17 9.2 Discrete compo

20、nents with gull-wing leads 19 9.3 IC components with flat-ribbon, L- or gull-wing leads on two sides22 9.4 IC components with flat-ribbon, L- or gull-wing leads on four sides, for example, quad flat packs .25 9.5 Components with round or flattened (coined) leads 28 9.6 IC component packages with J-l

21、eads on two and four sides, for example, SOJ, PLCC29 9.7 Leadless rectangular components with metallized terminations 32 9.8 Components with cylindrical endcap terminations.35 9.9 Bottom-only terminations on leadless components .37 9.10 Leadless chip carriers with castellated terminations .39 9.11 C

22、omponents with butt leads.41 9.12 Components with inward L-shaped ribbon leads.44 9.13 Flat-lug leads on power dissipating components.45 Page3 EN611922:200361192-2 IEC:2003 4 10 Post-placement rework.46 10.1 Rework of components placed on solder paste.47 10.2 Rework of components placed on non-condu

23、ctive adhesive47 11 Adhesive curing 47 12 Soldering processes .48 13 Cleaning processes 49 14 Hand placement and hand soldering, including hand rework/repair 49 15 Electrical test49 Annex A (normative) .50 A.1 Introduction50 A.2 Example solder fillets and alignment: flat-ribbon, L- and gull-wing lea

24、ds.50 A.3 Example solder fillets and alignment: round or flattened (coined) leads52 A.4 Example solder fillets and alignment: J-leads.53 A.5 Example solder fillets and alignment: rectangular or square end leadless components .54 A.6 Example solder fillets and alignment: cylindrical end cap terminati

25、ons, for example, MELFs.55 A.7 Example solder fillets and alignment: bottom-only terminations on leadless components 57 A.8 Example solder fillets and alignment: leadless chip carriers with castellated terminations.59 A.9 Example solder fillets and alignment: butt joints.61 A.10 Example solder fille

26、ts and alignment: inward L-shaped flat ribbon leads.62 A.11 Example solder fillets and alignment: flat-lug leads on power dissipating components 63 Annex ZA (normative) Normative references to international publications with their corresponding European publications .64 Figure 1 Solder paste contour

27、 and cross-section Target.11 Figure 2 Solder paste contour and cross-section Acceptable12 Figure 3 Solder paste contour and cross-section Nonconforming .12 Figure 4 Insufficient paste quantity Nonconforming 13 Figure 5 Smudged paste Nonconforming .13 Figure 6 Adhesive contour and quantity Target 15

28、Figure 7 Adhesive placement Acceptable.16 Figure 8 Adhesive placement Nonconforming 17 Figure 9 Discrete component placement Target .19 Figure 10 Discrete component placement Acceptable 20 Figure 11 Discrete component placement Nonconforming21 Figure 12 IC gull-wing component, 2 sides Target22 Figur

29、e 13 IC gull-wing component, 2 sides Acceptable.23 Figure 14 IC gull-wing component, 2 sides Nonconforming.24 Page4 EN611922:200361192-2 IEC:2003 5 Figure 15 IC gull-wing component, 4 sides Target25 Figure 16 IC gull-wing component, 4 sides Acceptable.26 Figure 17 IC gull-wing component, 4 sides Non

30、conforming.27 Figure 18 Flattened lead target centered on land 28 Figure 19 Flattened lead offset on land Acceptable28 Figure 20 Flattened lead excessively offset on land Nonconforming .28 Figure 21 IC component, J-leads on two or four sides Target.29 Figure 22 IC component, J-leads on two or four s

31、ides Acceptable30 Figure 23 IC component, J-leads on two or four sides Nonconforming31 Figure 24 Rectangular component with metallized terminations Target.32 Figure 25 Rectangular component with metallized terminations Acceptable33 Figure 26 Rectangular component with metallized terminations Nonconf

32、orming34 Figure 27 Cylindrical endcap component Target.35 Figure 28 Cylindrical endcap component Acceptable36 Figure 29 Cylindrical endcap component Nonconforming .37 Figure 30 Bottom-only leadless component Target.37 Figure 31 Bottom-only leadless component Acceptable38 Figure 32 Bottom-only leadle

33、ss component Nonconforming38 Figure 33 Leadless chip carrier Target.39 Figure 34 Leadless chip carrier Acceptable40 Figure 35 Leadless chip carrier Nonconforming .40 Figure 36 Butt lead component mounting Target 41 Figure 37 Butt-lead component mounting Acceptable.42 Figure 38 Butt-lead component mo

34、unting Nonconforming.43 Figure 39 Inward L-shaped ribbon leaded component Target .44 Figure 40 Inward L-shaped ribbon leaded component Acceptable 44 Figure 41 Inward L-shaped ribbon leaded component Nonconforming 45 Figure 42 Flat-lug component Target .45 Figure 43 Flat-lug component Acceptable 46 F

35、igure 44 Flat-lug component Nonconforming46 Figure A.1 Target solder fillet, levels A, B, C50 Figure A.2 Target alignment, levels A, B, C50 Figure A.3 Solder fillet, level B51 Figure A.4 Alignment, level B51 Figure A.5 Target solder fillet, levels A, B, C52 Figure A.6 Target alignment, levels A, B,

36、C52 Figure A.7 Solder fillet, level B52 Figure A.8 Alignment, level B52 Figure A.9 Target solder fillet, levels A, B, C53 Figure A.10 Target alignment, levels A, B, C53 Figure A.11 Solder fillet, level B53 Figure A.12 Alignment, level B53 Figure A.13 Target solder fillet, levels A, B, C54 Page5 EN61

37、1922:200361192-2 IEC:2003 6 Figure A.14 Target alignment, levels A, B, C54 Figure A.15 Solder fillet, level B54 Figure A.16 Alignment, level B54 Figure A.17 Target solder fillet, levels A, B, C55 Figure A.18 Target alignment, levels A, B, C55 Figure A.19 Solder fillet, level B56 Figure A.20 Alignmen

38、t, level B56 Figure A.21 Target solder fillet, levels A, B, C57 Figure A.22 Target alignment, levels A, B, C57 Figure A.23 Solder fillet, level B58 Figure A.24 Alignment, level B58 Figure A.25 Target solder fillet, levels A, B, C59 Figure A.26 Target alignment, levels A, B, C59 Figure A.27 Solder fi

39、llet, level B60 Figure A.28 Alignment, level B60 Figure A.29 Target solder fillet, levels A, B, C61 Figure A.30 Target alignment, levels A, B, C61 Figure A.31 Solder fillet, level B61 Figure A.32 Alignment, level B61 Figure A.33 Target solder fillet, levels A, B, C62 Figure A.34 Target alignment, le

40、vels A, B, C62 Figure A.35 Solder fillet, level B62 Figure A.36 Alignment, level B62 Figure A.37 Target solder fillet, levels A, B, C63 Figure A.38 Target alignment, levels A, B, C63 Figure A.39 Solder fillet, level B63 Figure A.40 Alignment, level B63 Page6 EN611922:200361192-2 IEC:2003 7 INTRODUCT

41、ION This part of IEC 61192, combined with IEC 61192-1, is used to meet the end-product requirements defined in IEC 61191-1 and IEC 61191-2. This standard may be used to enable the suppliers and users of surface-mount electronic assemblies to specify good manufacturing practices as part of a contract

42、. The respective requirements for through-hole assemblies, terminal attachment and the mounting of bare semiconductor die and carrier-mounted die, are included in separate but related standards. Page7 EN611922:200361192-2 IEC:2003 8 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 2:

43、 Surface-mount assemblies 1 Scope This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to

44、 assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on

45、a ceramic substrate or onto a ceramic-coated metal substrate. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document

46、(including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

47、 IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectio

48、nal specification Requirements for terminal soldered assemblies IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61192-3, Workmanship requirements for soldered electronic assemblies Part 3: Through- hole mount assemblies IEC 61192-4, Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies IEC 61193-1: Quality assessment systems Part 1: Registration and an