EN 61190-1-2-2014 en Attachment materials for electronic assembly - Part 1-2 Requirements for soldering pastes for high-quality interconnects in electronics assembly.pdf

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1、BSI Standards PublicationAttachment materials for electronic assemblyPart 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assemblyBS EN 61190-1-2:2014National forewordThis British Standard is the UK implementation of EN 61190-1-2:2014. It is identical to IEC 6119

2、0-1-2:2014. It supersedes BS EN 61190-1-2:2007 which is withdrawn.The UK participation in its preparation was entrusted to Technical Com-mittee EPL/501, Electronic assembly technology b) addition of the information of “Reflow condition and profile” in Annex B; c) addition of a new Annex C. Attention

3、 is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61190-1-2:2014 was approved by CE

4、NELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61189-5:2006 NOTE Harmonised as EN 61189-5:2006 (not modified). IEC 61189-6:2006 NOTE Harmonised as EN 61189-6:2006 (not modified).

5、BS EN 61190-1-2:2014- 3 - EN 61190-1-2:2014 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For

6、dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Ye

7、ar Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61189-5-3 - Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste EN 61189-5-3 - IEC

8、 61190-1-1 - Attachment materials for electronic assemblies - Part 1-1: Requirements for soldering fluxes - - IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering appl

9、ications EN 61190-1-3 - ISO 9454-2 - Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements EN ISO 9454-2 - BS EN 61190-1-2:2014 2 61190-1-2 IEC:2014 CONTENTS INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 Standardized description

10、for products 8 5 Test methods . 8 6 Requirements 9 6.1 General 9 6.2 Conflict 9 6.3 Alloy composition . 9 6.4 Flux characterization and inspection 9 General 9 6.4.1Shelf life . 10 6.4.26.5 Solder powder particle size 10 Powder size determination 10 6.5.1Powder size 10 6.5.2Solder powder particle sha

11、pe 11 6.5.36.6 Metal per cent 11 6.7 Viscosity 11 General 11 6.7.1Methods of determining viscosity 11 6.7.26.8 Slump and smear test 12 General 12 6.8.1Test with 0,2 mm thick stencil . 12 6.8.2Test with 0,1 mm thick stencil . 12 6.8.36.9 Solder ball test . 13 General 13 6.9.1Type 1-4 powder . 13 6.9.

12、2Type 5-7 powder . 13 6.9.36.10 Tack test 14 6.11 Wetting 14 6.12 Labelling 14 7 Quality assurance provisions . 15 7.1 Responsibility for inspection 15 General 15 7.1.1Responsibility for compliance . 16 7.1.2Test equipment and inspection facilities 16 7.1.3Inspection conditions 16 7.1.47.2 Classific

13、ation for inspections 16 7.3 Inspection report form 16 7.4 Qualification inspection 16 General 16 7.4.1Sample size 17 7.4.2Inspection routine . 17 7.4.37.5 Quality conformance 17 BS EN 61190-1-2:201461190-1-2 IEC:2014 3 General 17 7.5.1Sampling plan . 17 7.5.2Rejected lots 17 7.5.38 Preparation for

14、delivery . 17 9 Additional information Performance and shelf life extension inspections . 18 Annex A (normative) Test report on solder paste . 19 Annex B (informative) Reflow condition and profile 20 Annex C (informative) Typical comparison of particle size distributions between laser diffraction me

15、thod and screen method . 21 Bibliography 22 Figure 1 Slump test stencil thickness, 0,20 mm 12 Figure 2 Slump test stencil thickness, 0,10 mm 13 Figure 3 Solder ball test standards . 15 Figure C.1 Typical comparison between laser diffraction and sieving . 21 Table 1 Standardized solder paste descript

16、ion . 8 Table 2 Standard solder powders . 10 Table 3 Test methods for particle size distribution . 11 Table 4 Solder paste qualification inspection . 17 Table 5 User inspection for solder paste prior to use . 18 Table A.1 Solder paste inspection report form 19 BS EN 61190-1-2:2014 6 61190-1-2 IEC:20

17、14 INTRODUCTION This part of IEC 61190 defines the characteristics of solder paste through the definitions of properties and specification of test methods and inspection criteria. Materials include solder powder and solder paste flux blended to produce solder paste. Solder powders are classified acc

18、ording to both shape and size distribution of the particles. It is not the intention of this standard to exclude those particle sizes or distributions not specifically listed. For flux properties of solder paste, including classification and testing, see IEC 61190-1-1. The requirements for solder pa

19、ste are defined in general terms. In practice, where more stringent requirements are necessary, additional requirements may be defined by mutual agreement between the user and supplier. Users are cautioned to perform tests (beyond the scope of this specification) to determine the acceptability of th

20、e solder paste for specific processes. This standard is intended to be applicable to all types of solder paste used for soldering in general, as well as for soldering in electronics assembly. The solder pastes involved relate to all aspects of application. Generic specifications for soldering pastes

21、 are given in ISO 9454-2. BS EN 61190-1-2:201461190-1-2 IEC:2014 7 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly 1 Scope This part of IEC 61190 specifies general requirements for the characterization an

22、d testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the materials performance in the manufacturing process. Related information on flux characterization,

23、 quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references,

24、 only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61189-5-31, Test methods for electrical materials, interconnection structures

25、 and assemblies Part 5-3: Test methods for printed board assemblies: Soldering paste IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronics assembly IEC 61190-1-3, Attachment materials for electronic as

26、sembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications ISO 9454-2, Soft soldering fluxes classification and requirements Part 2: Performance requirements 3 Terms and definitions For the purposes of this document,

27、 the terms and definitions given in IEC 60194, as well as the following apply. 3.1 drying ambient or heating process to evaporate volatile components from solder paste which may, or may not, result in melting of rosin/resin 3.2 rheology _ 1To be published. BS EN 61190-1-2:2014 8 61190-1-2 IEC:2014 s

28、tudy of the change in form and the flow of matter, generally characterized by elasticity, viscosity, and plasticity 3.3 lead free solder solder alloy which lead content is equal to, or less than 0,10 % by mass 3.4 thinner thinner paste solvent or paste system with, or without, activator which is add

29、ed to solder paste to replace evaporated solvents, adjust viscosity, or reduce solids content 3.5 viscosity internal friction of a fluid, caused by molecular attraction, which makes it resist a tendency to flow, expressed in pascal-seconds (Pas) 4 Standardized description for products The solder pas

30、te product shall be described as outlined in Table 1. Table 1 Standardized solder paste description Alloy designation Flux classificationaPowder size type Nominal metal content Viscosity Designation from IEC 61190-1-3 Classification from IEC 61190-1-1 or ISO 9454-2 Type no. bWeight per cent Pas aAs

31、defined and determined in IEC 61190-1-1 for low (L), moderate (M), and high (H) activity of the flux residues. b See Table 2. 5 Test methods The test methods used in this standard are taken from IEC 61189-5-3: Test methods for electrical materials, interconnection structures and assemblies Part 5-3:

32、Test methods for printed board assemblies: Soldering paste: 5-3X01 Paste flux viscosity T-Bar spindle method (5X02)25-3X02 Spread test, liquid or extracted solder flux and solder paste (5X03)25-3X03 Solder paste viscosity t-bar spin spindle method (applicable for 300 Pa-s to 1 600 Pa-s) (5X04)25-3X0

33、4 Solder paste viscosity t-bar spindle method (applicable at less than 300 Pa-s) (5X05)25-3X05 Solder paste viscosity spiral pump method (for 300 Pa-s to 1 600 Pa-s) (5X06)25-3X06 Solder paste viscosity spiral pump method (applicable at less than 300 Pa-s) (5X07)25-3X07 Solder paste slump test (5X08

34、)2_ 2(5X0x ) ; Test number in IEC 61189-5:2006, see Bibliography. BS EN 61190-1-2:201461190-1-2 IEC:2014 9 5-3X08 Solder paste solder ball test (5X09)25-3X09 Solder paste tack test (5X10)25-3X10 Solder paste wetting test (5X11)25-3X11 Solder powder particle size distribution screen method (6X01)35-3

35、X12 Solder powder particle size distribution measuring microscope method (6X02)35-3X13 Solder powder particle size distribution optical image analyzer method (6X03)35-3X14 Solder powder particle size distribution Measuring laser diffraction method (6X04)35-3X15 Determination of maximum solder powder

36、 particle size ( 6X05)35-3X16 Solder paste metal content by weight (6X06)26 Requirements 6.1 General Except when otherwise specified in the design or assembly drawings, or instructions by the user, the soldering pastes covered by this standard shall conform with 6.2 to 6.12. 6.2 Conflict In the even

37、t of conflict between the requirements of this standard and other requirements of the applicable acquisition documents, the precedence in which documents shall govern in descending order is as follows: a) the applicable acquisition document; b) the applicable specification sheet/drawing; c) this sta

38、ndard; d) applicable normative references. 6.3 Alloy composition The alloy composition of the solder pastes shall be characterized by the supplier in accordance with the alloy characterization requirements specified in IEC 61190-1-3 and shall be inspected in accordance with the alloy inspection requ

39、irements of IEC 61190-1-3. The results of these inspections should be recorded on the report form included in IEC 61190-1-3 and the alloy type shall be recorded on the solder paste report form (see Table A.1). The percentage of each element in an alloy shall be determined by any standard analytical

40、procedure. Wet chemistry shall be used as the reference procedure. 6.4 Flux characterization and inspection General 6.4.1The fluxes in solder pastes shall be characterized by the supplier in accordance with the flux characterization requirements specified in IEC 61190-1-1 and shall be inspected in a

41、ccordance with the flux inspection requirements of IEC 61190-1-1. The results of these inspections should be recorded on the report form included in IEC 61190-1-1 and the flux type shall be recorded on the solder paste report form (see Table A.1). If the reflow temperature is unsuitable for inspecti

42、on, a different reflow temperature should be agreed upon by user and supplier. _ 3(6X0x ) ; Test number in IEC 61189-6:2006, see Bibliography. BS EN 61190-1-2:2014 10 61190-1-2 IEC:2014 Shelf life 6.4.2If the shelf life of the solder paste has expired, but the paste still meets performance testing,

43、then it may be used. Paste which has been re-qualified can only be used directly after re-qualification. 6.5 Solder powder particle size Powder size determination 6.5.1Powder size determination shall be made using this standard. Alternate test procedures may be agreed upon by user and supplier. Powd

44、er size 6.5.26.5.2.1 General When tested in accordance with 6.5.2.2, the powder size shall be classified by type as per a standard sieve size or the nearest sieve size shown which matches the values of Table 2. Table 2 Standard solder powders TypeaLess than 0,5 % larger than m 10 % Maximum between m

45、 80 % Minimum between m 10 % Maximum less Than m 1 160 150 to 160 75 to 150 75 2 80 75 to 80 45 to 75 45 3 60 45 to 60 25 to 45 25 4 50 38 to 50 20 to 38 20 5 40 25 to 40 15 to 25 15 6 25 15 to 25 5 to 15 5 7 15 11 to 15 2 to 11 2 aBasic powder size symbol for each powder size type. 6.5.2.2 Maximum

46、powder size (fineness of grind) The maximum powder size shall be determined in accordance with IEC 61189-5-3, Test method 5-3X15 (6X05)2. 6.5.2.3 Solder powder Powder particle size distribution shall be determined by a suitable test method using IEC 61189-5-3, Test methods 5-3X11 (6X01)2, 5-3X12 (6X

47、02)2, 5-3X13 (6X03)2or 5-3X14(6X04)2for minimum particle size, as shown in Table 3. BS EN 61190-1-2:201461190-1-2 IEC:2014 11 Table 3 Test methods for particle size distribution Type of weight per cent nominal size Test methods 1, 2 1, 2, 3, 4 3, 4 2, 3, 4 5, 6, 7 3, 4 1 Sieve method 2Microscopic me

48、thod 3Optical image analyzer 4 Laser scattering reflectometry4Solder powder particle shape 6.5.36.5.3.1 Powder shape Solder powder shape shall be spherical with maximum length-to-width ratio of 1,2 when tested in accordance with 6.5.3.2. Other shapes shall be acceptable if agreed upon by user and su

49、pplier. 6.5.3.2 Determination of solder powder particle shape Solder powder particle shape shall be determined by visual observation of the powder with a binocular microscope at a magnification sufficient to determine the percentage that are spherical or elliptical (length-to-width ratio of less than 2). Alternatively determine the percentage of particles with aspect ratio of 1,2 or less using image analysis. Powder with 9