EN 60749-42-2014 en Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage.pdf
《EN 60749-42-2014 en Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage.pdf》由会员分享,可在线阅读,更多相关《EN 60749-42-2014 en Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、BSI Standards PublicationSemiconductor devices mechanical and climatic test methodsPart 42: Temperature humidity storageBS EN 60749-42:2014National forewordThis British Standard is the UK implementation of EN 60749-42:2014. It isidentical to IEC 60749-42:2014.The UK participation in its preparation
2、was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The B
3、ritish Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 79091 1ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 Octo
4、ber 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60749-42:2014EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-42 October 2014 ICS 31.080.01 English Version Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and
5、 humidity storage (IEC 60749-42:2014) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 42: Stockage de temprature et dhumidit (CEI 60749-42:2014) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 42: Lagerung bei Wrme und Feuchte (IEC 60749-42:201
6、4) This European Standard was approved by CENELEC on 2014-09-16. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographic
7、al references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibil
8、ity of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Fo
9、rmer Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechn
10、ical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No.
11、 EN 60749-42:2014 E BS EN 60749-42:2014EN 60749-42:2014 - 2 - Foreword The text of document 47/2200/FDIS, future edition 1 of IEC 60749-42, prepared by IEC/TC 47 “Semiconductor devices.“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-42:2014. The following dates a
12、re fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-06-16 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2017-09-16 Attention is drawn t
13、o the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-42:2014 was approved by CENELEC as a E
14、uropean Standard without any modification. BS EN 60749-42:2014- 3 - EN 62056-9-7:2014 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and a
15、re indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod)
16、, the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60749-20 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of
17、plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 - BS EN 60749-42:2014 2 IEC 60749-42:2014 IEC 2014 CONTENTS 1 Scope 5 2 Normative references 5 3 Test equipment 5 3.1 Capacity of the equipment 5 3.2 Materials and construction of the thermostatic/humidistati
18、c chamber 5 3.3 Water to be used in the test 5 4 Procedure 5 4.1 Preconditioning . 5 4.2 Initial measurements . 6 4.3 Tests 6 Inserting and removing specimens . 6 4.3.1Test conditions 6 4.3.2Test duration . 6 4.3.3Post treatment . 7 4.3.4End-point measurement . 7 4.3.55 Failure criteria . 7 6 Inform
19、ation to be given in applicable procurement document . 8 Figure 1 Unsaturated pressurized vapour test conditions profile. 7 Table 1 Temperature and humidity storage test conditions . 6 BS EN 60749-42:2014IEC 60749-42:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 42:
20、 Temperature and humidity storage 1 Scope This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of
21、chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests. 2 Normative references The foll
22、owing documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-20, S
23、emiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 3 Test equipment 3.1 Capacity of the equipment The chamber to be used in this test shall be capable of maintaining the test temperature and
24、 humidity conditions specified in 4.3 throughout the test duration. 3.2 Materials and construction of the thermostatic/humidistatic chamber The chamber shall be made of materials that do not deteriorate under high humidity conditions. The design of the chamber shall prevent water condensed on the ce
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- EN60749422014ENSEMICONDUCTORDEVICESMECHANICALANDCLIMATICTESTMETHODSPART42TEMPERATUREANDHUMIDITYSTORAGEPDF
链接地址:http://www.mydoc123.com/p-718830.html