DLA SMD-5962-89951 REV A-2011 MICROCIRCUITS MEMORY DIGITAL NMOS 512 X 8 BIT NONVOLATILE STATIC RAM MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated body of drawing to reflect current requirements. - glg. 11-07-06 Charles F. Saffle The original first page of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 1
2、0 11 12 13 14 PMIC N/A PREPARED BY Charles Reusing DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUITS, MEMORY, DIGITA
3、L, NMOS, 512 X 8 BIT NONVOLATILE STATIC RAM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-12-21 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89951 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E411-11 .Provided by IHSNot for ResaleNo reproduction or netwo
4、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89951 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B
5、microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89951 01 V A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) ide
6、ntify the circuit function as follows: Endurance Device type 01 02 03 Generic number 2212 2212 2212 Circuit function 256 x 4 bit, nonvolatile static RAM 256 x 4 bit, nonvolatile static RAM 256 x 4 bit, nonvolatile static RAM Access time 300 ns 300 ns 300 ns Store cycles 10,000 50,000 100,000 Data ch
7、anges per bit 1,000 5,000 10,000 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style V GDIP1-T18 and CDIP2-T18 18 dual-in-line package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-
8、38535, appendix A. 1.3 Absolute maximum ratings. Temperature under bias- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -65C to +135C Storage temperature (TSTG) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -65C to +150C Voltage on any pin with respect to ground -
9、- - - - - - - - - - - - - - - - - - - - -1.0 V to +7.0 V dc DC output current - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5.0 mA Lead temperature (soldering, 10 seconds) (TSOL)- - - - - - - - - - - - - - - - 300C Power dissipation (PD) - - - - - - - - - - - - - - - -
10、- - - - - - - - - - - - - - - - - - 0.50 W Thermal resistance, junction-to-case (JC)- - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 150C 1.4 Recommended operating conditions. Supply voltage (VCC) - -
11、 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Minimum high level input voltage (VIH)- - - - - - - - - - - - - - - - - - - - - - - - +2.0 V dc Maximum high level input voltage (VIH) - - - - - - - - - - - - - - - - - - - - - - - +VCC+ 1.0 V dc Minimum low le
12、vel input voltage (VIL) - - - - - - - - - - - - - - - - - - - - - - - - -1.0 V dc Maximum low level input voltage (VIL) - - - - - - - - - - - - - - - - - - - - - - - - +0.8 V dc Case operating temperature range (TC) - - - - - - - - - - - - - - - - - - - - - - - -55C to +125C Provided by IHSNot for R
13、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89951 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The
14、 following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufactu
15、ring, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Micr
16、ocircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this d
17、rawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordan
18、ce with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-3853
19、5 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall
20、 not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The desi
21、gn, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The tru
22、th table shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ca
23、se operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall
24、 be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/complia
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