DLA SMD-5962-89587 REV K-2012 MICROCIRCUIT LINEAR 1 0 A LOW DROPOUT 5 V VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline U. Add vendor CAGE 69210 for device type 01UX. Editorial changes throughout. 93-04-23 M. A. FRYE B Add footnote 2/ to VLT, VRIN, VRIT, and VONtests as specified under Table I. Add footnote 2/ under Table I which states; “If not t

2、ested, shall be guaranteed to the limits specified in table I herein.” Changes in accordance with NOR 5962-R088-96. 96-03-29 M. A. FRYE C Add case outline E. Update boilerplate. Redrawn. - rpp 97-09-15 R. MONNIN D Add case outline X. Make changes to 1.2.2, 1.3, 1.4, figure 1 and figure 2. - ro 98-12

3、-08 R. MONNIN E Make change to theta JC, theta JA under 1.3 and output impedance test as specified in table I. - ro 99-03-24 R. MONNIN F Make change to theta JC, theta JA for case Y under 1.3 and dropout voltage test as specified in table I. Correct terminal connection for case outline X. - rrp 99-0

4、8-06 R. MONNIN G Add case outlines M and N. - ro 02-03-29 R. MONNIN H Drawing updated to reflect current requirements. - rrp 09-04-22 J. RODENBECK J Add device type 02. Add Radiation Hardened enhanced low dose rate sensitivity (ELDRS) free requirements. Add 3.1.1. Add appendix A for microcircuit bar

5、e die. Add power dissipation limit under 1.3. Table I, output impedance test, under the condition column, delete “VIN= 0 V” and substitute “VIN= 10 V”. - ro 10-05-05 C. SAFFLE K Add device types 03 and 04. - ro 12-08-09 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET

6、REV K K K K K K SHEET 15 16 17 18 19 20 REV STATUS REV K K K K K K K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVA

7、ILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, 1.0 A, LOW DROPOUT 5 V VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-09-22 AMSC N/A REVISION LEVEL K SIZE A CAGE CODE 67268 5962

8、-89587 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E387-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89587 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1.

9、SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When availab

10、le, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 89587 01 X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead f

11、inish (see 1.2.5) / / Drawing number For device class V: 5962 R 89587 02 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classe

12、s Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA de

13、vice. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1/ LM2940-5.0 1.0 A, low dropout, 5 V regulator 02 1/ LM2940-5.0 Radiation hardened, 1.0 A, low dropout, 5 V regulator 03 1/ LM2940-5.0 1.0 A, low dropout, 5 V regu

14、lator 04 1/ LM2940-5.0 Radiation hardened, 1.0 A, low dropout, 5 V regulator _ 1/ For case outline X, package material for device types 01 and 02 are aluminum nitride and package material for device types 03 and 04 are aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permit

15、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89587 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as lis

16、ted below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirem

17、ents for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator

18、Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line M See figure 1 3 Flange mount, glass sealed with gull wing leads N CBCC1-N3 3 Bottom terminal chip carrier U See figure 1 3 TO-257, single row flange mount with isolated tab, glass sealed X 1/ GDFP1-G16 16 Flat pack with gull wing lead

19、s Y MBFM1-P2 2 Flange mounted 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Input voltage (VIN): Survival voltage ( 100 ms) . 60 V dc Operational voltage . 26 V dc Stora

20、ge temperature range . -65C to +150C Power dissipation (PD) with no heat sink (TA= +25C) . 1 W 3/ Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Device types 01 and 02: Case E . 3C/W Case M . 7.6C/W Case N . 5.9C/W Cases U

21、. 3.5C/W Cases X and Y . 5C/W Device types 03 and 04: Case X . 13C/W _ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ With heat sinking, the maximum power is 5 watts,

22、but then this will depend upon the temperature of the heat sink, the efficiency of the heat sink, and the efficiency of the heat flow between the package body and the heat sink. The manufacturer can not predict these values. Provided by IHSNot for ResaleNo reproduction or networking permitted withou

23、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89587 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings - continued. 2/ Thermal resistance, junction-to-ambient (JA): Device types 01 and 02: Case E . 73C/W Case

24、 M . 60C/W Case N . 80C/W Case U . 50C/W Case X . 122C/W Case Y . 40C/W Device types 03 and 04: Case X . 136C/W still air 87C/W 500 linear feet per minute (LFPM) 1.4 Recommended operating conditions. Input voltage (VIN) . 10 V dc Output voltage (IO) 1 A Ambient operating temperature range (TA) . -55

25、C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 10 mrads(Si)/s) . 100 krads(Si) 4/ The manufacturer supplying device types 02 and 04 on this drawing has performed a characterization test to demonstrate that the parts do not exhibit enhanced low dose rate sensitivity (ELD

26、RS) according to MIL-STD-883 Method 1019 paragraph 3.13.1.1. Therefore, device types 02 and 04 may be considered ELDRS free and distinguish them from device types 01 and 03 which are not RHA devices. 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif

27、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe

28、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings

29、. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 4/ For device types 02 and 04, these parts have been tested and do not demonstrate low dose rate s

30、ensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, method 1019, condition D. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89587 DLA

31、LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 5 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes ap

32、plicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Managem

33、ent (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die.

34、 For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for de

35、vice class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer

36、 under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation

37、parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking

38、. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA pro

39、duct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device cla

40、sses Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufact

41、urer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to D

42、LA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 C

43、ertificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device cla

44、ss M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s age

45、nt, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by

46、this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89587 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SH

47、EET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C VIN= 10 V, IO= 1 A, COUT= 22 F unless otherwise specified Group A subgroups Device type Limits 3/ Unit Min Max Output voltage VOUTVIN= 10 V, IO= 5 mA 1 01,02, 4.85 5.15 V 2,3 03,04

48、 4.75 5.25 VIN= 6 V, IO= 5 mA 1 4.85 5.15 2,3 4.75 5.25 VIN= 7 V, IO= 5 mA 1 4.85 5.15 2,3 4.75 5.25 VIN= 26 V, IO= 5 mA 1 4.85 5.15 2,3 4.75 5.25 VIN= 10 V, IO= 1 A 1 4.85 5.15 2,3 4.75 5.25 VIN= 6 V, IO= 1 A 1 4.85 5.15 2,3 4.75 5.25 VIN= 6 V, IO= 50 mA 1 4.85 5.15 2,3 4.75 5.25 VIN= 10 V, IO= 50 mA 1 4.85 5.15 2,3 4.75 5.25 Maximum line transient VLTVO 6 V, RO= 100 , 1,2,3 01,02, 40 V t = 20 ms 4/ 03,04 Reverse polarity input voltage dc VRINRO= 100 4/ 1,2,3 01,02,03,04 -15 V Reverse polarity input voltage transient VRITRO= 100 , t = 20 ms 4/ 1,2,3 01,02,