DLA SMD-5962-89463 REV D-2005 MICROCIRCUIT DIGITAL HIGH SPEED CMOS FLOATING POINT COPROCESSOR MONOLITHIC SILICON《硅单片浮点运算的协处理器高速互补型金属氧化物半导体数字微电路》.pdf
《DLA SMD-5962-89463 REV D-2005 MICROCIRCUIT DIGITAL HIGH SPEED CMOS FLOATING POINT COPROCESSOR MONOLITHIC SILICON《硅单片浮点运算的协处理器高速互补型金属氧化物半导体数字微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89463 REV D-2005 MICROCIRCUIT DIGITAL HIGH SPEED CMOS FLOATING POINT COPROCESSOR MONOLITHIC SILICON《硅单片浮点运算的协处理器高速互补型金属氧化物半导体数字微电路》.pdf(25页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R060-93. 93-01-06 Monica L. Poelking B Changes in accordance with NOR 5962-R139-93. 93-04-20 Monica L. Poelking C Incorporated revisions A and B. Tehcnical changes to table I. Updated boilerplate and editorial
2、changes throughout. - LTG 00-07-14 Monica L. Poelking D Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-10-04 Thomas M. Hess REV SHEET REV D D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 24 REV D D D D D D D D D D D D D D REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PM
3、IC N/A PREPARED BY Chris Rauch CHECKED BY Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 92-08-03 MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, FLOATING POINT COPROCESSOR, MONOLITHIC SILICON SIZE A CAGE CO
4、DE 67268 5962-89463 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL D SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E432-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
5、ense from IHS-,-,-SIZE A 5962-89463 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in a
6、ccordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89463 01 X X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit
7、function as follows: Device type Generic number Circuit function 01 68882-16 HCMOS floating point coprocessor 02 68882-20 HCMOS floating point coprocessor 03 68882-25 HCMOS floating point coprocessor 04 68882-33 HCMOS floating point coprocessor 1.2.2 Case outline(s). The case outline(s) are as desig
8、nated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CMGA2-P68 68 Pin grid array Y See figure 1. 68 Leaded chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range
9、 (VCC) -0.3 V dc to +7 V dc Storage temperature range (TSTG) -65C to +150C Case operating temperature range (TC) . -55C to +125C Maximum power dissipation (PD) 0.75 W 1/ Lead temperature (soldering, 5 seconds). +270C Junction temperature (TJ). +150C Thermal resistance, junction-to-case (JC): Case X
10、See MIL-STD-1835 Case Y 10C/W 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc High level input voltage (logic inputs) (VIH). +2.0 V dc to VCCLow level input voltage (logic inputs) (VIL) GND - 0.3 V dc to 0.8 V dc Minimum high level output voltage (VOH) +2.4 V
11、dc Maximum low level output voltage (VOL). +0.5 V dc Frequency of operation: Device type 01 12.5 to 16.67 MHz Device type 02 12.5 to 20.0 MHz Device type 03 12.5 to 25 MHz Device type 04 16.67 to 33.33 MHz _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for R
12、esaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-89463 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handb
13、ooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,
14、Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Stan
15、dard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of
16、a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual i
17、tem requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted trans
18、itional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requireme
19、nts herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constructi
20、on, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and on figure 1. 3.2.2 Terminal connections. The terminal connections shall be
21、 as specified on figure 2. 3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 3. 3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherw
22、ise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
23、subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-89463 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Ma
24、rking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the o
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