DLA SMD-5962-85508 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路》.pdf
《DLA SMD-5962-85508 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-85508 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路》.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 01295 for cases E, F, and 2. Convert to military drawing format. Remove vendor 04713. 87-04-01 N. A. Hauck B Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-01-31 Raymond Monnin
2、C Change 3.5 marking paragraph to remove “5962-“. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-17 Thomas M. Hess Current CAGE code is 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6
3、7 8 9 10 11 PMIC N/A PREPARED BY Joe Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCH
4、OTTKY, TTL, MULTIPLEXER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-02-27 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 85508 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E467-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without li
5、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accor
6、dance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 85508 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function
7、as follows: Device type Generic number Circuit function 01 54LS353 Dual 4-line to 1-line data selector/ multiplexer with 3-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16
8、or GDIP2-T16 16 Dual-in-line F GDFP2-F16 or GDFP3-F16 16 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range . -1.5 V dc at -
9、18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 1/. 77 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply volta
10、ge range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH). 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C Maximum high-level output current (IOH) . -1 mA Maximum low-level output current (IOL) . 4 mA _ 1
11、/ Must withstand the added PDdue to short circuit test (e.g. IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM
12、2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation
13、or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENS
14、E HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue
15、, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specifi
16、c exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (
17、QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as
18、documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-
19、38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2
20、 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking
21、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characte
22、ristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking s
23、hall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-P
24、RF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be l
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