DLA SMD-5962-80012 REV J-2010 MICROCIRCUITS MEMORY DIGITAL NMOS 4K X 8 UV ERASABLE PROM MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED F Add margin test. Delete vendor, CAGE 01295. Delete reprogrammability of EPROMS. Add device types 07, 08, 09, 10, and 11. Add program method C and characteristics. Minor changes to table I, table II, and table III. Change to military drawing format. 87 May 1

2、2 M. A. Frye G Make changes to parameters in table IIIC. Delete vendor CAGE 34335, for devices 03 and 04. Editorial changes throughout. Changes in notes under Table I. 88 May 23 M. A. Frye H Updated boiler plate paragraphs. Added D certification paragraphs. ksr 05 Feb 10 Raymond Monnin J Update body

3、 of drawing to reflect current requirements. - glg 10 Nov 09 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV J J J J J J J SHEET 15 16 17 18 19 20 21 REV STATUS REV J J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12

4、13 14 PMIC N/A PREPARED BY Joan Fisher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY C.R. Jackson THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Darrell Hill MICROCIRCUITS, MEMORY, DIGITAL, NMOS 4K X 8 UV ERASABLE PR

5、OM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 80 JUL 14 AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 14933 80012 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E042-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

6、TANDARD MICROCIRCUIT DRAWING SIZE A 80012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, app

7、endix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 80012 01 J X | | | | | | | | | | | | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit

8、 function as follows: Device type Generic number Circuit Access time Temperature range 01 (see 6.4) 4K x 8-bit UV EPROM 450 ns -55C to 100C 02 (see 6.4) 4K x 8-bit UV EPROM 450 ns -55C to 100C 03 (see 6.4) 4K x 8-bit UV EPROM 250 ns -55C to 125C 04 (see 6.4) 4K x 8-bit UV EPROM 450 ns -55C to 125C 0

9、5 (see 6.4) 4K x 8-bit UV EPROM 350 ns -55C to 125C 06 (see 6.4) 4K x 8-bit UV EPROM 450 ns -55C to 125C 07 (see 6.4) 4K x 8-bit UV EPROM 150 ns -55C to 125C 08 (see 6.4) 4K x 8-bit UV EPROM 200 ns -55C to 125C 09 (see 6.4) 4K x 8-bit UV EPROM 250 ns -55C to 125C 10 (see 6.4) 4K x 8-bit UV EPROM 300

10、 ns -55C to 125C 11 (see 6.4) 4K x 8-bit UV EPROM 450 ns -55C to 125C 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package 1/ 1.2.3 Lead finish

11、. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage, VCC- - -0.3 V dc to +6 V dc 2/ Storage temperature range - -65C to +150C Maximum power dissipation, PD- 1.0 W Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, junction-to

12、-case (JC): - (See MIL-STD-1835) Junction temperature (TJ) - +160C All input or output voltages with respect to ground - - -0.3 V dc to +6.0 V dc Vppsupply voltage with respect to ground during program: Devices 01, 02, 05, 06 - -0.3 V dc to +26.5 V dc Devices 03, 04 - -0.3 V dc to +22.0 V dc Devices

13、 07, 08, 09, 10, 11 - -0.3 V dc to +13.3 V dc 1/ Lid shall be transparent to permit ultraviolet light erasure. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990

14、REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Case operating temperature range(TC): Devices 01, 02 - -55C to +100C Devices 03 - 11 - -55C to +125C Input low voltage, VIL- -0.1 V dc to +0.8 V dc Input high voltage, VIH- 2.0 V dc to 6.5 V dc Supply voltage, VCC-

15、+4.5 V dc to +5.5 V dc High level program input voltage, VIH(PR), Devices 01, 02, 05, 06 - - 24 V dc to 26 V dc Devices 03, 04 - - 20.5 V dc to 21.5 V dc Devices 07, 08, 09 10, 11 - 12.0 V dc to 13.3 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following s

16、pecification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Genera

17、l Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Dra

18、wings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and t

19、he references cited herein, the text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with

20、MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be

21、 processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not aff

22、ect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the

23、 alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FO

24、RM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ Group A subgroups Device type Limits Unit Min Max High level output voltage VOHIOH= -400 A VIL= 0.8 V, VIH= 2.0 V 1, 2, 3 ALL 2.4 V Low level output voltage VOLIOL= 2.1 mA VIL= 0.8 V, VIH= 2.0 V 1, 2, 3 ALL

25、0.45 V Output leakage current IOLVOUT= 5.5 CE = VIH or PD/ PGM = VIH1, 2, 3 ALL 10 A Supply current (standby) 3/ ISBOE = VILCE = VIH or PD/ PGM = VIH1, 2, 3 01 02,03, 04,05,06 45 mA 07,08,09, 10,11 40 Supply current (active) 3/ ICCOE = CE = VILor PD/ PGM = VIH1, 2, 3 01, 03, 04 150 mA 02, 05, 06 160

26、 07,08,09, 10,11 100 Input capacitance 4 CINVIN= 0V TC= +25C f = 1 MHz See 4.3.1c 4 All 6 pF Address to output delay tACCOE = CE = VIL 5/ or PD/ PGM = VIL9, 10, 11 07 150 ns 08 200 03, 09 250 10 300 05 350 01,02,04,06,11 450 CE to output delay tCEOE = VIL 5/ or PD/ PGM = VIL9, 10, 11 07 150 ns 08 20

27、0 03, 09 250 10 300 05 350 01,02,04,06,11 450 Output enable to output delay tOECE = VIL 5/ or PD/ PGM = VIL9, 10, 11 07, 08 75 ns 03, 05, 09 100 10 110 01,02,04,06,11 150 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

28、STANDARD MICROCIRCUIT DRAWING SIZE A 80012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ Group A subgroups Device type Limits Unit Min Max Output enable high to

29、output float 6/ tDFCE = VIL 5/ or PD/ PGM = VIL9, 10, 11 07,08,09,10 60 ns 03 70 11 80 05 110 01,02,04,06 130 Address to output hold tOHOE = CE = VIL 5/ or PD/ PGM = VIL9, 10, 11 ALL 0 1/ For device types 01 and 02; TC= -55C to 100C, GND = 0 V, VCC= 5 V, and for device type 02 only, VPP= VCC. For de

30、vice types 03, 04,05, and 06; TC= -55C to 125C, GND = 0 V, VCC= 5 V, and for device type 05 and 06, VPP= VCC. For device types 07, 08, 09, 10, and 11; TC= -55C to 125C, GND = 0 V, VCC= 5 V. 2/ For device types 02, 05, 06, 07, 08, 09, 10, and 11 only; VCCmust be applied simultaneously or before VPP,a

31、nd removed simultaneously or after VPP. 3/ For device types 02, 05, 06, 07, 08, 09, 10, and 11 only; VPPmay be connected directly to VCCexcept during programming. The supply current would then be the sum of ICCand IPP1.4/ For device types 01, 03, and 04, the input capacitance on pin 20 shall be 20 p

32、F maximum. 5/ Output load: See figures 4 and 5; trand tf20 ns. Input pulse levels: device types 01, 02, 05, and 06 = 0.8 V to 2.2 V; device types 03, 04, 07, 08, 09, 10, 11 = .45 V to 2.4 V Input timing reference level: device types 01, 02, 05, 06, 07, 08, 09, 10, and 11 = 1.0 V and 2.0 V; device ty

33、pes 03 and 04 = 0.8 V and 2.0 V. 6/ If not tested, shall be guaranteed to the limits specified in table I. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. T

34、he terminal connections shall be as specified on figure 1. 3.2.2 Truth tables. The truth tables shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2 herein. When req

35、uired, in screening (see 4.2 herein), or quality conformance inspection groups A, B, C, or D (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test in a checkerboard or similar pattern (a minimum of 50 percent of the total number of bits programmed). 3.2.2.2 Programmed d

36、evices. The requirements for supplying programmed devices are not part of this document. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. Provided by IHSNot for ResaleNo reproduction or networki

37、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 6 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristic

38、s are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall b

39、e in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-385

40、35, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535 the “D” certification mark shall be used in place of the

41、“C“ certification mark. 3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified i

42、n 4.4. 3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.5. 3.6.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed to the sp

43、ecified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot. 3.7 Certificate of

44、 compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawin