DLA SMD-5962-76034 REV F-2006 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76034 REV F-2006 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76034 REV F-2006 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Delete min limits from IILand all prop delays. Change max limits for tPHL2and tPLH2. Add vendor FSCM 04713. Editorial changes throughout. 86-01-25 N. A. HAUCK C Change maximum clock frequency (fMAX), group A subgroups 10 and 11 at 15 pF from 20 M

2、Hz to 15 MHz and at 50 pF from 15 MHz to 13 MHz. Subgroups 10 and 11, tPHL2at 15 pF from 35 ns to 38 ns max and tPLH2at 15 pF from 31 ns to 34 ns max. Change to military drawing format. Editorial changes throughout. Add LCC package. Remove vendors 27014, 07263, and 34335. 87-06-16 N. A. HAUCK D Upda

3、te to reflect latest changes in format and requirements. Editorial changes throughout. - les 03-05-07 R. MONNIN E Correct circuit function Para. 1.2.1. Editorial changes throughout. - les 03-06-20 R. MONNIN F Make correction to the 3.5 Marking paragraph to remove the 5962- option. - ro 06-04-10 R. M

4、ONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY T. E. GORDON DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY ROBERT R. GONZA

5、LAS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, COUNTER, MONOLITHIC SILICON AMSC N/A REVISION LEVE

6、L F SIZE A CAGE CODE 14933 76034 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E288-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHE

7、ET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76034 01

8、 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS163 Synchronous 4-bit binary counter with synchronous clear 1.2.2 Case outli

9、ne(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is

10、as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) . 175 mW 1/ Lead temperature (soldering, 10 seconds) +3

11、00C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC): Cases E and F See MIL-STD-1835 Case 2 . 80C/W 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input v

12、oltage (VIL) . 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUP

13、PLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherw

14、ise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1

15、835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist

16、.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in th

17、is document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Pro

18、duct built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and

19、 qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN a

20、s described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and

21、 herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as s

22、pecified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requiremen

23、ts shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

24、 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA, VIN= 0.7 V or 2.0 V 1, 2

25、, 3 01 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4.0 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 01 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 01 -1.5 V High level input current at data or enable P IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 01 20 A IIH2VCC= 5.5 V, VIN= 5.5 V 100 High leve

26、l input current at load, clock, enable T, or IIH3VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 01 40 A clear IIH4VCC= 5.5 V, VIN= 5.5 V 200 Low level input current at A or B IIL1VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 01 -0.4 mA Low level input current at select or strobe IIL2VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 01 -0.8 mA Low l

27、evel input current at clock IIL3VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 01 -1.2 mA Short circuit output current IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 01 -15 -130 mA Supply current ICCHVCC= 5.5 V 1, 2, 3 01 31 mA ICCLVCC= 5.5 V 32 Functional tests See 4.3.1c 7 01 9 01 25 MHz Maximum clock frequency fMAX VCC=

28、5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 15 9 20 CL= 50 pF 10% 10, 11 13 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

29、REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL19 01 35 ns Propagation delay time, high-to-low level output from clock to

30、ripple carry VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 49 9 40 2/ CL= 50 pF 10% 10, 11 56 tPLH19 01 35 ns Propagation delay time, low-to-high level output from clock to ripple carry CL= 15 pF 10% 10, 11 49 9 40 CL= 50 pF 10% 10, 11 56 tPHL29 01 27 ns Propagation delay time, high-to-low level outpu

31、t from clock (load input CL= 15 pF 10% 10, 11 38 9 32 high) to any Q CL= 50 pF 10% 10, 11 42 tPLH29 01 24 ns Propagation delay time, low-to-high level output from clock (load input CL= 15 pF 10% 10, 11 34 9 29 high) to any Q CL= 50 pF 10% 10, 11 38 tPHL39 01 29 ns Propagation delay time, high-to-low

32、 level output from clock (load input CL= 15 pF 10% 10, 11 49 9 34 low) to any Q CL= 50 pF 10% 10, 11 48 tPLH39 01 25 ns Propagation delay time, low-to-high level output from clock (load input CL= 15 pF 10% 10, 11 35 9 30 low) to any Q CL= 50 pF 10% 10, 11 42 See footnotes at end of table. Provided b

33、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test

34、 Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL49 01 16 ns Propagation delay time, high-to-low level output from enable T to ripple VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 22 9 21 carry 2/ CL= 50 pF 10% 10, 11 29 tPLH49 01 16 ns P

35、ropagation delay time, low-to-high level output from enable T to ripple CL= 15 pF 10% 10, 11 22 9 21 carry CL= 50 pF 10% 10, 11 29 tPHL59 01 28 ns Propagation delay time, high-to-low level output from clear to any Q CL= 15 pF 10% 10, 11 39 9 33 CL= 50 pF 10% 10, 11 46 1/ Not more than one output sho

36、uld be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits s

37、pecified for a 50 pF load. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on

38、 all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall

39、 be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-3

40、8535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be requi

41、red for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.

42、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F 2 Terminal number

43、 Terminal symbol 1 CLR NC 2 CLK CLR 3 DATA A CLK 4 DATA B DATA A 5 DATA C DATA B 6 DATA D NC 7 ENP DATA C 8 GND DATA D 9 LOAD ENP 10 ENT GND 11 QDNC 12 QCLOAD 13 QBENT 14 QAQD15 RCO QC16 VCCNC 17 - - - QB18 - - - QA19 - - - RCO 20 - - - VCCNC = No internal connection FIGURE 1. Terminal connections.

44、LOAD ENT ENP Action on the rising clock edge ( |) X X X Reset (clear) L X X Load (Datan Qn) H H H Count (Increment) H L X No change (Hold) H X L No change (Hold) H = High voltage level. L = Low voltage level. X = Dont care. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or netwo

45、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

46、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2

47、 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit

48、shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests pr