DLA SMD-5962-76043 REV E-2007 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL ADDER MONOLITHIC SILICON《硅单片先行加法器肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76043 REV E-2007 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL ADDER MONOLITHIC SILICON《硅单片先行加法器肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76043 REV E-2007 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL ADDER MONOLITHIC SILICON《硅单片先行加法器肖脱基小功率TTL数字微型电路》.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Remove vendors, 18324 and 27014. Convert to military format. Add LCC package. 87-06-18 N. A. Hauck D Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 04-05-13 Raymond Monnin E Add device class V. Ed

2、itorial changes throughout. - gap 07-01-04 Joseph D. Rodenbeck CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Joe A. Kerby DEFENSE SUPPLY CENTE

3、R COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER, SCHOTTKY TTL, ADDER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF

4、DEFENSE DRAWING APPROVAL DATE 76-11-24 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 76043 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E022-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY C

5、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead fin

6、ishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 76043 01 E X Drawing number Device type (

7、see 1.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 76043 01 V E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designa

8、tor. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indi

9、cates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS283 4-bit binary full adders with fast carry 1.2.3 Device class designator. The device class designator is a single letter identifying the pro

10、duct assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-ce

11、rtification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

12、RD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GD

13、IP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage . -

14、0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 187 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.

15、4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specificat

16、ion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-3853

17、5 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Draw

18、ings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedenc

19、e. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Maximum power dissipation is de

20、fined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

21、 E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM pl

22、an shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, cons

23、truction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal con

24、nections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specifie

25、d herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The e

26、lectrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

27、 has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1

28、 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certifi

29、cate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK

30、-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the require

31、ments of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notif

32、ication of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs age

33、nt, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by

34、this drawing shall be in microcircuit group number 11 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

35、E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A, VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level outp

36、ut voltage VOL VCC= 4.5 V, IOL= 4 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA TC= +25C 1, 2, 3 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 40 A at any A or B IIH2 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 200 A High level input c

37、urrent IIH3 VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A at C0 IIH4 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 100 A Low level input current at any A or B IIL1 VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -.80 mA Low level input current at C0 IIL2 VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -.40 mA Short circuit output current IOS

38、VCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -15 -130 mA Supply current ICC1VCC= 5.5 V, all inputs grounded 1, 2, 3 All 39 mA ICC2VCC= 5.5 V, all B inputs = GND, other inputs = 4.5 V 1, 2, 3 All 34 mA CC3VCC= 5.5 V, all inputs = 4.5 V 1, 2, 3 All 34 mA Functional tests See 4.3.1c 7 All 9 All 24 ns Propaga

39、tion delay time, high-to-low level tPHL1VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 34 9 All 29 C0 to any 2/ CL= 50 pF 10% 10, 11 All 41 9 All 24 ns Propagation delay time, low-to-high level tPLH1CL= 15 pF 10% 10, 11 All 34 9 All 29 C0 to any CL= 50 pF 10% 10, 11 All 41 See footnotes at end of t

40、able. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics -

41、 Continued. Test Symbol Conditions -55C TC +125C Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max 9 All 24 ns Propagation delay time, high-to-low level tPHL2VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 34 9 All 29 Aior Bito i2/ CL= 50 pF 10% 10, 11 All 41 9 All 24 ns Pr

42、opagation delay time, low-to-high level tPLH2CL= 15 pF 10% 10, 11 All 34 9 All 29 Aior Bito iCL= 50 pF 10% 10, 11 All 41 9 All 22 ns Propagation delay time, high-to-low level tPHL3CL= 15 pF 10% 10, 11 All 31 9 All 27 C0 to C4 CL= 50 pF 10% 10, 11 All 38 9 All 17 ns Propagation delay time, low-to-hig

43、h level tPLH3CL= 15 pF 10% 10, 11 All 24 9 All 22 C0 to C4 CL= 50 pF 10% 10, 11 All 31 9 All 17 ns Propagation delay time, high-to-low level tPHL4CL= 15 pF 10% 10, 11 All 24 9 All 22 Aior Bito C4 CL= 50 pF 10% 10, 11 All 31 9 All 17 ns Propagation delay time, low-to-high level tPLH4CL= 15 pF 10% 10,

44、 11 All 24 9 All 22 Aior Bito C4 CL= 50 pF 10% 10, 11 All 31 1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one second. 2/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 1

45、5 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFEN

46、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols Terminal symbols 1 2 NC 2 B2 2 3 A2 B2 4 1 A2 5 A1 1 6 B1 NC 7 C0 A1 8 GND B1 9 C4 C0 10 4 GND 11 B4 NC 12 A4 C4 13 3 4 14 A3 B4

47、 15 B3 A4 16 VCC NC 17 3 18 A3 19 B3 20 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76043 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DS

48、CC FORM 2234 APR 97 Outpt When C0 = L When C0 = H Input When C2 = L When C2 = H A1 B1 A2 B2 1 2 C2 1 2 C2 A3 B3 A4 B4 3 4 C4 3 4 C4 L L L L L L L H L L H L L L H L L L H L L H L L H L L L H L H H L L L H L H H L L L H L L H L H H L H L H L H H L L L H L H H L H H L L L H H H H L L L H H L H L L L H L H L H H L H L L H H H L L L H L H L H H H L L L H H H L H L L H H L H L L H H L L H H L H H L H H H L H L H H L H H H H L H L H H H H H H L H H H H H H = High voltage level L = Low v