DLA DESC-DWG-87035 REV C-2009 DELAY LINE ACTIVE TRIPLE 14-PIN DIP COMPATIBLE LOW POWER SCHOTTKY.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Changed several dc characteristics in table II. Changed dimensions on figure 1. Updated vendor part numbers on source table. Editorial changes throughout 29 Nov 88 Randy Larson B Added 3.1.3, 3.2.1.1, 3.2.7, 3.3.10 and note 6 to figure 1. Changed 3.1.4. Mov

2、ed rise time data from table II to 3.2.2. Added vendors 03947 and 25219. Editorial changes throughout. 22 Jan 93 Tony Westphal C Incorporated boilerplate updates. 01 Dec 09 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source Control drawing REV STATUS OF PAGES REV C C C C C C C C C C

3、PAGES 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Ken R. Beymer DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing 10 Nov 87 CHECKED BY Dan McGrath TITLE DELAY LINE, ACTIVE, TRIPLE, 14-PIN DIP COMPATIBLE, LOW POWER SCHOTTKY APPROVED BY Randy Larson SIZE A

4、CODE IDENT. NO. 14933 DWG NO. 87035 SCALE N/A REV C PAGE 1 OF 10 AMSC N/A 5999-E221CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

5、-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of active triple, 14-pin DIP compatible delay lines. These are low power Schottky devices. 1.2 Part or Identifying Number

6、 (PIN). The complete PIN shall be as shown in the following example: 87035 -01 | | | | Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents c

7、ited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specif

8、ication, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those c

9、ited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-19491 - Semiconductor Devices, Packaging of. MIL-PRF-83532 - Delay Lines, Active, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Method Standard, Electronic and Electrical Component Part

10、s. MIL-STD-883 - Test Method Standard, Microelectronics. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwis

11、e noted herein, or int he contract in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.

12、 REQUIREMENTS 3.1 Interface and physical dimensions. 3.1.1 Case material. The case material shall be molded diallyl phthalate or encapsulated epoxy and shall be in accordance with MIL-PRF-83532. 3.1.2 Dimensions and circuit diagram. Dimensions and circuit diagram shall be in accordance with figure 1

13、. 3.1.3 Microcircuits. Microcircuits shall meet the requirements of MIL-STD-883, class B, as a minimum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHE

14、ET 3 3.1.4 Terminals. Terminal material and finish shall be in accordance with MIL-PRF-83532. 3.1.5 Terminal strength. Terminal strength testing shall be in accordance with MIL-STD-202, method 211, test condition C, and as specified in MIL-PRF-83532. 3.1.6 Solderability. Solderability testing shall

15、be as specified in MIL-PRF-83532. 3.1.7 Resistance to solvents. Resistance to solvents testing shall be as specified in MIL-PRF-83532. 3.2 Electrical. 3.2.1 Total delay time. The total delay time per line shall be in accordance with table I. 3.2.1.1 Delay tolerance. At +25C and +5.0 V dc, the delay

16、tolerance shall be 2.0 ns or 5 percent, whichever is greater. At -55C to +125C and +5.0 V dc, the tolerance shall be 3.0 ns or 8 percent, whichever is greater. 3.2.2 Rise time. The rise time shall be 8 ns maximum. Conditions: VCC= 5.0 V; TRI 3 ns. 3.2.3 Pulse width. Minimum input pulse width is 100

17、percent of the total delay. 3.2.4 Supply voltage. Supply voltage shall be 4.50 V dc to 5.50 V dc. 3.2.5 Fan out. The fan out shall be 10 maximum (each delay line is capable of driving 10 LSTTL). 3.2.6 DC characteristics. DC characteristics shall be in accordance with table II. 3.2.7 Check for intern

18、al shorts. When a test signal is applied to any input, a delay signal should be detected at the output for that line only. For example, when input 1 is tested, there shall be no signals detected at outputs 2 and 3. All three inputs shall be checked in this manner. 3.3 Environmental. 3.3.1 Temperatur

19、e range. The operating temperature range shall be -55C to +125C. 3.3.2 Thermal shock. Thermal shock testing shall be in accordance with MIL-STD-202, method 107, test condition A, 5 minutes at each temperature extreme and in accordance with MIL-PRF-83532. 3.3.3 Seal. Seal testing shall be in accordan

20、ce with MIL-PRF-83532. 3.3.4 Vibration. Vibration testing shall be in accordance with MIL-STD-202, method 204, test condition B and in accordance with MIL-PRF-83532. 3.3.5 Shock. Shock testing shall be in accordance with MIL-STD-202, method 213, test condition D and in accordance with MIL-PRF-83532.

21、 3.3.6 Immersion. Immersion testing shall be in accordance with MIL-STD-202, method 104, test condition A and in accordance with MIL-PRF-83532. 3.3.7 Moisture resistance. The moisture resistance testing shall be as specified in MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction or networkin

22、g permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 4 FIGURE 1. Dimensions and circuit diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRON

23、ICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 5 Ltr Inches mm Min Max Min Max A - .810 - 20.57 B - .400 - 10.16 C - .360 - 9.14 D .015 - 0.38 - E .125 .250 3.18 6.35 F .018 .022 0.46 0.56 G .007 .017 0.18 0.43 H .295 .305 7.49 7.75 J .095 .105 2.41 2.67 K .145

24、.155 3.68 3.94 L .295 .305 7.49 7.75 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerance is .005 (0.13 mm). 4. Internal design of schematic may vary, provided all electrical requirements are met. 5. Location and s

25、hape of standoffs are optional. Height shall be as indicated. 6. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inch (0.25 mm) above the seating plane of the delay line. FIGURE 1. Dimensions and circuit diagram Continued. Provided by IHS

26、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 6 TABLE I. PINs and delay times. DESC drawing PIN 87035- Delay per line (ns) 01 02 03 04 05 06 07 08 09 10 11 12 13

27、14 15 16 17 10 15 20 25 30 35 40 45 50 75 100 125 150 175 200 225 250 3.4 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operatio

28、nal and maintenance requirements, and promotes economically advantageous life cycle costs. 3. 5 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Qualified Product List for at least one part, or perform the Group

29、 A and Group C inspections specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.7 Pure tin. The use of pure tin, as an underpl

30、ate or final finish is prohibited both internally and externally. Tin content of delay lines and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.8 Marking. Marking shall be in accordance with MIL-PRF-83532 except the military P

31、IN shall be as specified in 1.2 herein. 3.9 Workmanship. Parts shall be free of flash pits, voids, and excessive mold marks. Visible parting line is acceptable. 4. VERIFICATION 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordanc

32、e with (applicable test method document or applicable paragraph(s) in the document). 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of the product for delivery shall consist of the group A inspection for level A of MIL-PRF-83532. Provided by IHSNot for ResaleNo repr

33、oduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 7 4.2.2 Optional statement of compliance. The contracting activity, at its discretion, may accept a statement of compliance with the grou

34、p A requirements in lieu of the manufacturer performing the group A tests (see 6.2d). 4.2.3 Inspection of packaging. The sampling and inspection of the preservation, packing, and container marking shall be in accordance with the requirements for semiconductor devices in MIL-DTL-19491. TABLE II. DC c

35、haracteristics. Test Symbol Conditions: -55C TC +125C unless otherwise specified Limits Unit Min Max High level output voltage VOHVCC= 4.5 V VIH= 2.0 V IOH= -0.4 mA 2.5 V Low level output voltage VOLVCC= 4.5 V VIL= 0.8 V IOL= 6 mA 0.4 V Input clamp voltage VICVCC= 4.5 V II= -18 mA TC= +25C -1.5 V Hi

36、gh level input current IIH1VCC= 5.5 V, VIH= 2.7 V 20 A IIH2VCC= 5.5 V, VIH= 5.5 V 100 A Low level input current IILVCC= 5.5 V, VIL= 0.4 V -0.4 mA Short-circuit output current IOSVCC= 5.5 V, VOS= 0.0 V (Not more than one output shorted at a time. Short circuit time 1 second.) -20 -100 mA Supply curre

37、nt ICCLVCC= 5.5 V VI= 0.0 V 50 mA Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 8 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packagi

38、ng requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintain

39、ed by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by co

40、ntacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified m

41、ilitary devices that will perform the required function are not available for OEM application. Devices covered by this drawing replace similar devices covered by nonmilitary specifications or drawings. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (s

42、ee 1.2). b. Requirement for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacture performs the group A i

43、nspection or provides a statement of compliance with group A requirements (see 4.2.2) e. Requirement for the manufacturer to notify the acquiring activity in the event of a change in product. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin

44、 whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of t

45、in whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is co

46、ordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 3990, Columbus, O

47、H 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.5 Approved source(s) of supply. Approved source(s) of supply are listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at mailto:relaydla.mil, or by contact

48、ing Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87035 REV C SHEET 9 DSCC drawing PIN 87035- Vendor CAGE and PIN 1/ 00222 22519 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 S14LPC10 S14LPC15 S14LPC20 S14LPC25 S14LPC30 S14LPC35 S14LPC40 S14LPC45 S14LPC50 S14L