BS EN 60286-4-2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms《自动装配用元件的包装 封装在不同形式包装件中的电子元件用.pdf
《BS EN 60286-4-2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms《自动装配用元件的包装 封装在不同形式包装件中的电子元件用.pdf》由会员分享,可在线阅读,更多相关《BS EN 60286-4-2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms《自动装配用元件的包装 封装在不同形式包装件中的电子元件用.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、BSI Standards PublicationPackaging of components for automatic handlingPart 4: Stick magazines for electronic components encapsulated in packages of different formsBS EN 60286-4:2013National forewordThis British Standard is the UK implementation of EN 60286-4:2013. It is identical to IEC 60286-4:201
2、3. It supersedes BS EN 60286-4:1998 which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/40X, Capacitors and resistors for electronic equipment.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publicat
3、ion does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2013.Published by BSI Standards Limited 2013ISBN 978 0 580 72420 6ICS 31.020; 31.240Compliance with a British Standard cannot confer immunit
4、y fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 November 2013.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60286-4:2013EUROPEAN STANDARD EN 60286-4 NORME EUROPENNE EUROPISCHE
5、NORM November 2013 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form
6、 and by any means reserved worldwide for CENELEC members. Ref. No. EN 60286-4:2013 E ICS 31.020; 31.240 Supersedes EN 60286-4:1998 English version Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286
7、-4:2013) Emballage des composants pour oprations automatises Partie 4: Magasins chargeurs pour composants lectroniques encapsuls dans des botiers de diffrentes formes (CEI 60286-4:2013) Gurtung und Magazinierung von Bauteilen fr automatische Verarbeitung - Teil 4: Stangenmagazine fr elektronische Ba
8、uelemente mit verschiedenen Gehusen (IEC 60286-4:2013) This European Standard was approved by CENELEC on 2013-08-30. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard withou
9、t any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any othe
10、r language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cypru
11、s, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the
12、 United Kingdom. BS EN 60286-4:2013EN 60286-4:2013 - 2 - Foreword The text of document 40/2230/FDIS, future edition 3 of IEC 60286-4, prepared by IEC TC 40, “Capacitors and resistors for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60286-4:2013.
13、The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-05-30 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-08-30
14、 This document supersedes EN 60286-4:1998. EN 60286-4:2013 includes the following significant technical changes with respect to EN 60286-4:1998: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules
15、for orientation of components in stick magazines which have been moved to Annexes Z to D. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent righ
16、ts. Endorsement notice The text of the International Standard IEC 60286-4:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: ISO 11469 NOTE Harmonized as EN ISO 11469.
17、 BS EN 60286-4:2013- 3 - EN 60286-4:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dat
18、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year
19、Title EN/HD Year IEC 60191-3 1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits EN 60191-3 1999 IEC 60747-1 + corr. August + A1 2006 2008 2010 Semiconductor devices - Part 1: General - - BS EN 60286-4:2013 2
20、 60286-4 IEC:2013 CONTENTS 1 Scope 5 2 Normative references . 5 3 Terms, definitions and conventions 5 3.1 Terms and definitions . 5 3.2 Conventions . 5 4 Shape and cross-section of stick magazine 6 5 Dimensions of stick magazines 7 5.1 General 7 5.2 Materials 8 5.3 Recycling . 8 6 Mechanical stabil
21、ity 8 7 End stoppers and spacers 9 8 Orientation of the components in the stick magazine 9 9 Marking . 9 Annex A (informative) DIL packages for through-hole mount . 10 Annex B (informative) SO packages for surface mounting . 12 Annex C (informative) Leaded chip carrier packages (PLCC) for surface mo
22、unting . 13 Annex D (normative) Rule for the orientation of integrated circuit packages in handling and shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) . 14 Bibliography 16 Figure 1 Shape and cross-sections of stick magazines . 6 Figure 2 Schematic of stick magaz
23、ine design and schematic of package profile 7 Figure A.1 DIL packages for through-hole mounting 10 Figure B.1 SO packages for surface mounting 12 Figure C.1 Leaded chip carrier packages (PLCC) for surface mounting . 13 Figure D.1 Five examples of the terminal No. 1 marking locations . 15 Table 1 Tol
24、erances to the package profile dimensions 7 Table 2 Principle of stick magazine requirements . 8 Table 3 Material reference for magazines and stoppers 8 Table A.1 e1= 3 modules e 10 Table A.2 e1= 4 modules e 11 Table A.3 e1= 6 modules e 11 Table B.1 Stick magazine dimensions for SO packages 12 Table
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