BS EN 123400-800-1991 Harmonized system of quality assessment for electronic components - Capability detail specification flexible printed boards without through-connections《电子元器件质.pdf

《BS EN 123400-800-1991 Harmonized system of quality assessment for electronic components - Capability detail specification flexible printed boards without through-connections《电子元器件质.pdf》由会员分享，可在线阅读，更多相关《BS EN 123400-800-1991 Harmonized system of quality assessment for electronic components - Capability detail specification flexible printed boards without through-connections《电子元器件质.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 123400-800: 1992 Incorporating Amendment No. 1 Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boards without through-connections The European Standard EN 123400-800:1992 has the status of a British StandardB

2、SEN 123400-800:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards Policy Committee, was published underthe authority of the Standards Board and comes intoeffect on 20December1991 BSI 08-1999 The following BSI references relate to the work on th

3、is standard: Committee reference ECL/19 Draft announced in BSI News August 1991 ISBN 0 580 20309 3 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, up

4、on which the following bodies were represented: British Telecommunications plc EEA (The Association of the Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering

5、 Association ERA Technology Ltd. GAMBICA (BEAMA Ltd.) Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Amendments issued since publication Amd. No. Date Comments 7368 November 1992 Indicated by a sideline in the marginBSEN 123400-800:1992 BSI 08-1999 i

6、 Contents Page Committees responsible Inside front cover National foreword ii Foreword iii Text of CECC 23400-800 1BSEN 123400-800:1992 ii BSI 08-1999 National foreword This British Standard has been prepared under the direction of the Electronics Components Standards Policy Committee. It is identic

7、al with CENELEC Electronic Components Committee (CECC) 23400-800:1990 “Harmonized system of quality assessment for electronic components: Capability detail specification:Flexible printed boards without through-connections”. This standard is a harmonized specification within the CECC system and shoul

8、d be read in conjunction with BS CECC23000and BS CECC23400. In 1992 the CENELEC Electronic Components Committee (CECC) accepted CECC 23400-800:1990 as European Standard EN123400-800:1992. Cross-references The British Standard which implements CECC00100is BS9000, “General requirements for a system fo

9、r electronic components of assessed quality”, Part2:1991 “Specification for the national implementation of the CECC system”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance

10、 with a British Standard does not of itself confer immunity from legal obligations. International Standard Corresponding British Standard CECC 23000:1985 BS CECC 23000:1989 Harmonized system of quality assessment for electronic components: Generic specification: Printed boards (Identical) CECC 23400

11、:1985 BS CECC 23400:1990 Specification for harmonized system of quality assessment for electronic components:Sectional specification: Flexible printed boards without through-connections (Identical) IEC 68 BS 2011 Environmental testing (Most Parts are identical) IEC 249 BS 4584 Metal-clad base materi

12、als for printed wiring boards (Most Parts are identical) BS 6221 Printed wiring boards IEC 326-2:1990 Part 2:1991 Methods of test (Identical) IEC 326-3:1991 Part 3:1991 Guide for the design and use of printed wiring boards (Identical) Summary of pages This document comprises a front cover, an inside

13、 front cover, pages i and ii, theEN title page, page 2, the CECC title page, pages ii to iv, pages 1 to 6 and aback cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.EUROPEAN ST

14、ANDARD NORME EUROPENNE EUROPISCHE NORM EN 123400-800 May 1992 UDC: Descriptors: Quality, electronic components, printed boards English version Capability Detail Specification: Flexible printed boards without through connections Spcification Particulire dAgrment: Cartes imprimes souples sans connexio

15、ns transversales Bauartspezifikation zur Anerkennung der Befhigung: Flexible Leiterplatten ohne Durchverbindungen This European Standard was approved by the CENELEC Electronic Components Committee (CECC) on12 December1991. The text of this standard consists of the text of CECC23400-800 Issue11990 of

16、 the corresponding CECC Specification. CENELEC members are bound to comply with CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such

17、national standards may be obtained on application to the General Secretariat of the CECC or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into

18、 its own language and notified to the CECC General Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal

19、, Spain, Sweden, Switzerland and United Kingdom. The membership of the CECC is identical, with the exception of the national electrotechnical committees of Greece, Iceland and Luxembourg. CECC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Eur

20、opisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1992 Copyright reserved to CENELEC members Ref. No. EN 123400-800:1992 E2 blankBSCECC 23400-800:1990 ii BSI 08-1999 Contents Page Foreword iii 1 General 1 2 Capability qualifying component CQC 1 3

21、Capability approval 2 4 Capability testing 2 Characteristics test tables 3BSCECC23400-800:1990 BSI 08-1999 iii Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take p

22、art in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or C

23、ertificate, of Conformity. The components produced under the System are thereby acceptable in all member countries without further testing. This specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmon

24、ized CAPABILITY DETAIL SPECIFICATIONS (Cap DS) for FLEXIBLE PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS. It should be read in conjunction with the current regulations for the CECC System. At the date of printing of this specification, the member countries of the CECC are Austria, Belgium, Denmark, Fi

25、nland, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and the United Kingdom, and copies of it can be obtained from the addresses shown on the blue fly sheet. Preface This specification was prepared by CECC Working Group 23: Printed Circuits. It is bas

26、ed, wherever possible, on the Publications of the International Electrotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the document indicated below and was ratified by the President of the CECC for printing as a CECC Specification. Document Date of

27、 Voting Report on the Voting CECC (Secretariat) 2427 January 1990 CECC (Secretariat) 2527iv blankBSCECC23400-800:1990 BSI 08-1999 1 1 General 1 Scope This Cap DS is based on CECC 23400. It relates to flexible printed boards without through connections made with materials and surface finishes as spec

28、ified in2. 1.2 Object To specify the capability qualifying component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic capability. 2 Capability qualifying component CQC Test boards to be used as CQC shall be

29、made of one of the copper clad base materials specified in2.1 of this Cap DS, nominal base material thickness of1004m and184m copper foil on both sides bear the composite test pattern specified in8.2 of CECC 23400 have one of the surface finishes specified in2.2 of this Cap DS. 2.1 Materials 2.2 Sur

30、face finishes 2.3 Combination of material and surface finishes and variant designation The combination of any material of one material group specified in 2.1 and any surface finish of one finish group as specified in 2.2 constitutes a variant. Material group designation Publication Base material Bas

31、e material thickness range Cu-foil thickness IEC type grade 4m 4m A 249-2-8 Polyester film General purpose B 249-2-13 Polyimide film General purpose 12,5.125 18,35,70 249-2-15 Polyimide film Defined flammability Finish group designation Surface finish Abbreviation for QPL 11 Bare copper (with or wit

32、hout temporarily protective coating) Cu 12 Tin, tin-lead (irrespective of process used) Sn, Sn, Pb 13 Specimen K54m min. gold plated on copper, remainder finish group 11 5 Au/Cu, Cu 14 Specimen K54m min. gold plated on copper, remainder finish group 12 5 Au/Cu Sn, Sn, Pb 15 Specimen K0,74m min. gold

33、 plated on nickel, remainder finish group 11 0,7 Au/Ni, Cu 16 Specimen K0,74m min. gold plated on nickel, remainder finish group 12 0,7 Au/Ni, Sn, Sn PbBSCECC 23400-800:1990 2 BSI 08-1999 The variant is designated by the combination of the material group designation and the finish group designation,

34、 e.g.A11, A12 etc. 3 Capability approval 3.1 Range of capability approval Capability approval granted on testing one variant is valid within the limits specified in 3.7 of CECC23000 for all metal-clad base materials within the specific material group as given in2.1 as follows: approval for material

35、group A covers material group A only approval for material group B covers material groups A and B all base material thicknesses and all foil thicknesses of the metal-clad base materials in accordance with the IEC Standards quoted in2.1, and the surface finishes within one surface finish group as quo

36、ted in 2.2, i.e. 3.2 QPL information The QPL information shall be given in accordance with 3.4 of CECC 23000 and shall contain the following details related to this Cap DS: 4 Capability testing 4.1 Capability test programme The capability test programme, the number of specimens to be tested and the

37、number of failures permitted shall be applied as specified in6 of CECC23400. 4.2 Characteristics The characteristics given in the following table shall be tested, the test methods and conditions given there shall be applied and the requirements given there shall be fulfilled in accordance with4.1 of

38、 this Cap DS. finish ” ” ” ” ” group ” ” ” ” ” 11 12 13 14 15 16 covers ” ” ” ” ” finish ” ” ” ” ” group ” ” ” ” ” 11 12 11 12 11 12 only ” also ” ” ” Reference to the Generic Specification : CECC 23000 Reference to the Sectional Specification : CECC 23400 Reference to this Cap DS : CECC 23400-800 V

39、ariant for which capability approval is granted Abbreviations of the surface finishes as given in2.2 which are covered by the capability approval.BS CECC 23400-800:1990 BSI 08-1999 3 Characteristics Test No. of IEC 326-2 Specimen of composite test pattern CECC 23400 Test conditions Requirements with

40、 material according to IEC 249-2-8 249-2-13 249-2-15 Remarks General examination Visual inspection Conformity, identification 1 a Pattern, marking, identification and material finishes shall comply with this Cap DS. Appearance and workmanship 1a a The board shall appear to have been processed in a c

41、areful and workmanlike manner, in accordance with good current practice. Board edges a The edges or the board and internal cut-outs shall be clean cut without tears or nicks. Bonding conductor to substrate a There shall be no separation of the conductors from the substrate by apparent blisters or wr

42、inkles other than those permitted in the material specification. Bonding coverlayer to substrate and pattern 1a a The bonding shall appear to be complete and uniform. Minor delaminations are permitted in the following positions: a) At random locations away from the conductors. Such delaminations sha

43、ll have an area not exceeding5mm 2each and shall be more than0,5mm from the edges. Examples of delaminations are shown in Figure 4 of CECC23400 b) Along conductor edges. Such delaminations shall not infringe upon the design spacing between the conductors by more than20% of the design width by visual

44、 estimation. There shall be a minimum continuous bonding width of0,5mm between adjacent conductors. a Complete composite test patternBS CECC 23400-800:1990 4 BSI 08-1999 Characteristics Test No. of IEC 326-2 Specimen of composite test pattern CECC 23400 Test conditions Requirements with material acc

45、ording to IEC 249-2-8 249-2-13 249-2-15 Remarks There shall be no delamination with conductor spacings less then0,5mm. Conductor defects 1b a There shall be no cracks or breaks. Imperfections such as voids or edge defects are permissible provided the conductor width or the leakage path between condu

46、ctors is not reduced by more than35%. The length L of defect (Figure 1 of CECC 23400) shall not be greater than the nominal conductor width. Particles between conductors 1b or 1c F Residual metallic particles are permissible provided the leakage path is not reduced by more then20%. Dimensional exami

47、nation Board dimensions 2 a Dimensions and nominal board thickness shall comply with CECC 23400 and with2of this Cap DS. Holes 2 a Dimensions shall comply with 8.2 of CECC 23400. The limits of the hole diameter recommended in IEC 326-3 (deviation for plain holes) shall not be exceeded. Access holes

48、2 a , Coverlayer Registration of an access hole including influence of adhesive flow in the cover layer with relation to the relevant land on the base material shall be such that any overlapping will not reduce the effective land dimensions to less than0,15mm. See CECC 23400, Figure 3 a See page 3BS

49、 CECC 23400-800:1990 BSI 08-1999 5 Characteristics Test No. of IEC 326-2 Specimen of composite test pattern CECC 23400 Test conditions Requirements with material according to IEC 249-2-8 249-2-13 249-2-15 Remarks Conductor width 2a F The conductor width shall not deviate from nominal values by more than + 0,08/ 0,05 mm. Particles between conductors and conductor defects shall be ignored when evaluating conductor width and spacing Conductor spacings 2a F The conductor spacings 0,5 mm nom. shall not be below 0,42 mm. Misalignment o