ASTM F458-2006 Standard Practice for Nondestructive Pull Testing of Wire Bonds《金属丝连接的非破坏性抗拉试验的标准实施规范》.pdf

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1、Designation: F 458 06Standard Practice forNondestructive Pull Testing of Wire Bonds1This standard is issued under the fixed designation F 458; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in p

2、arentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This practice covers nondestructive testing of individualwire bo

3、nds made by either ultrasonic, thermal compression orthermosonic techniques. The test is destructive to nonaccept-able wire bonds but is designed to avoid damage to acceptablewire bonds.NOTE 1Common usage at the present time considers the term “wirebond” to include the entire interconnection: both w

4、elds and the interven-ing wire span.1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-m) wire of thetype used in integrated circuits and hybrid microcircuits.1.3 This practice can be used only when the loop height ofthe wire bond is large enough to allow

5、 a suitable hook forpulling to be placed under the wire.1.4 While the procedure is applicable to wire of anycomposition and metallurgical state, criteria are given only forgold and aluminum wire.1.5 A destructive pull test is used on wire bonds of the sametype and geometry to provide the basis for t

6、he determination ofthe nondestructive pulling force to be used in this practice. Thismay only be used if the sample standard deviation, s,ofthepulling forces required to destroy at least 25 of the same wirebonds tested by the destructive pull-test method is less than orequal to 0.25 of the sample av

7、erage, x.Ifs 0.25 x, thispractice may not be used.NOTE 2If s 0.25 x, some aspect of the bonding process is out ofcontrol. Following corrective action, the destructive pull-test measure-ments should be repeated to determine if the s # 0.25 x criterion is met.1.6 The nondestructive wire-bond pull test

8、 is to be per-formed before any other treatment or screening followingbonding and at the same point in processing as the accompa-nying destructive test. Preferably, this is done immediatelyafter bonding.1.7 The procedure does not ensure against wire-bond failuremodes induced after the test has been

9、performed.1.8 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.9 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standar

10、d to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2F 459 Test Methods for Measuring Pull Strength of Micro-electronic Wire Bonds2.2 Military Standard:3MIL-STD-883 Method 20233. Sum

11、mary of Practice3.1 The use of nondestructive wire-bond pull tests is predi-cated on data obtained from destructive pull tests on typicalsamples selected from a lot. The maximum safe nondestructivepull-force levels are determined as a function of the metallur-gical properties of the wire and from th

12、e calculated mean (x)and standard deviation (s) of the destructive pull-test datadetermined in accordance with Test Methods F 459.3.2 In some cases, rather than use a calculated nondestruc-tive pull force, a fixed pull force may be agreed upon by testparticipants. This value may be based upon indust

13、ry practice,or some other accepted value, such as that in MIL STD 883,Method 2023. All other parts of the present ASTM standardwill apply.1This practice is under the jurisdiction of ASTM Committee F01 on Electronicsand is the direct responsibility of Subcommittee F01.07 on Wire Bonding, Flip Chip,an

14、d Tape Automated BondingCurrent edition approved Jan. 1, 2006. Published January 2006. Originallyapproved in 1976 as F 458 76 T. Last previous edition approved in 2001 asF 458 84 (2001).2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceas

15、tm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 191115094, Attn: NPODS.1Copyright ASTM International, 100 Barr Harbo

16、r Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.3.3 The maximum safe nondestructive bond-pull force isthen applied as a screen for individual wire bonds to identify allbonds with pull strength below the predetermined level ofacceptability.4. Significance and Use4.1 The nondestr

17、uctive wire-bond pull test provides a screenfor evaluating wire-bond quality and is capable of detectingweak or nonadherent bonds.4.2 The test is not destructive to acceptable wire bonds.4.3 This practice provides a procedure for identifying abonding situation that requires corrective action.4.4 The

18、 purpose of this practice is to identify wire bondsthat may fail during subsequent screening procedures or fieldoperation.4.5 The procedure is to be applied after bonding and beforeany further treatment.5. Interferences5.1 The same interferences apply as given in Test MethodsF 459 (Section 6, Interf

19、erences).6. Apparatus6.1 The apparatus used for the procedure is identical to thatused in Test Methods F 459 except that the lifting mechanismshall have the capability of stressing the wire bond up to apredetermined level. As this predetermined level may changein accordance with the results of a suc

20、cessive series of testsusing Test Methods F 459, as well as to accommodate changesin wire composition and metallurgy, the lifting mechanismmust be capable of applying an adjustable maximum force.7. Sampling7.1 As the test is nondestructive, it may be used as a 100 %production line screen so that sam

21、pling is not required.7.2 The test may be used as a lot acceptance test with thesampling scheme agreed to by the participating parties.8. Calibration and Standardization8.1 Calibrate the nondestructive stressing device in the samemanner as is used in calibrating the destructive wire-bondpull-test ap

22、paratus as specified in Test Methods F 459.8.2 Carry out the destructive wire-bond pull test in accor-dance with either Method A or B of Test Methods F 459,whichever is appropriate to the particular wire bond beingtested. Use a rate of force application within the range from 1to 30 gf/s (10 to 290 m

23、N/s) inclusive. Record the force requiredto break the wire bond, as well as identifying the wire bond, thedevice, and whether Method A or B was used.8.2.1 For noncontinuous use of a particular bonding ma-chine, apply either Method A or Method B (whichever isappropriate) of Test Methods F 459 to a mi

24、nimum sample of atleast 25 of the same wire bonds once the bonding machine hasbeen turned on, thermally stabilized, and tuned (if the machineis not self-tuning).8.2.2 For continuous use of a particular bonding machine,apply either Method A or B (whichever is appropriate) of TestMethods F 459 to a sa

25、mple of approximately 0.1 % (at least 25bonds) of the particular wire bond under study after every 2-hperiod of bonding.8.3 Given a set of n observed values of the destructivewire-bond pull strength xi, i = 1, ., n, calculate the mean, x,and the standard deviation, s, of the destructive wire-bond pu

26、lltest in accordance with the following:8.3.1 Calculate the average wire-bond pull strength, x, asfollows:x 51n(i 5 1nxi8.3.2 Calculate the standard deviation for the sample, s,byeither of the following:s 5H1n 2 1(i 5 1nxi2 x!2J1/2,or (equivalently)s 5H1n 2 1(i 5 1nxi22 nx!2#J1/28.4 Using Table 1, s

27、elect the wire composition and elonga-tion (obtainable from the wire manufacturer), and the relationbetween x and s appropriate to the wire bond to be tested anddetermine the recommended maximum safe nondestructivepull (NDP) force from the corresponding entry in the lastcolumn.9. Procedure9.1 Mount

28、the specimen to be tested and set the liftingmechanism to apply the maximum force level determined in8.4.9.2 Carefully place the hook under the center of the wire-bond loop, as in the previously performed destructive wire-bond pull test.9.3 Set the rate of force application at the same as that usedi

29、n the destructive test.9.4 Actuate the lifting mechanism to stress the wire bond.9.5 Observe whether the bond breaks.9.5.1 If the bond breaks, record the identification of thebond and the device containing the bond.9.5.2 If the bond does not break, accept it as satisfactory.9.6 Repeat 9.1 through 9.

30、5 for all bonds to be tested.9.7 Record the total number of wire bonds that fail whensubjected to the predetermined stress.TABLE 1 Recommended Maximum Safe Nondestructive PullForce for Aluminum and Gold WireNOTE 1s 0.25 x is inapplicableWire Relation Between xand s on the Wire-Bond Pull TestRecommen

31、dedMaximumSafe NDP ForceComposition Elongation, %Aluminum 20 s# 0.25x (x 3s)/3Gold all 0.15x s# 0.25x 0.7 (x 3s)Gold all s # 0.15x 0.7 (x 4s)F4580629.8 Record the number of devices that failed the test.10. Report10.1 Report the following information:10.1.1 Name of the person performing the test,10.1

32、.2 Date of the test,10.1.3 Identification of the microelectronic specimen,10.1.4 Identification of the specific wire bond tested,10.1.5 Identification of wire by spool and lot,10.1.6 Identification of bonding machine,10.1.7 Mean and standard deviation of the destructivewire-bond pull test, as well a

33、s the total number of wire bondsso tested,10.1.8 Wire elongation, and10.1.9 Percentage of wire bonds that failed upon applicationof the predetermined safe maximum NDP force.NOTE 3Information pertaining to the failure modes observed duringthe nondestructive test may be useful in failure analysis stud

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37、mittee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).F458063