ASTM D3013-2013 Standard Specification for Epoxy Molding Compounds《环氧基树脂模塑化合物的标准规格》.pdf
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1、Designation: D3013 99 (Reapproved 2012)D3013 13Standard Specification forEpoxy Molding Compounds1This standard is issued under the fixed designation D3013; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision.
2、A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope*1.1 This specification covers requirements for epoxy th
3、ermosetting molding compounds. It provides for their identification,quality control, and purchase in such a manner that the purchaser and the seller can agree on the substantial similarity of differentcommercial lots or shipments.1.2 The compounds covered under this specification consist of mixtures
4、 or blends of epoxy resins and curing agents intimatelycombined, in an unreacted or partially reacted condition, with fillers, reinforcements, colorants, and other chemical agents.1.3 The values stated in SI units are to be regarded as the standard.NOTE 1The properties included in this specification
5、 are those required to identify the kinds of molding compounds covered. There may be otherrequirements necessary to define particular characteristics. These will be added to the specification as their inclusion becomes generally desirable and thenecessary test data and methods become available.NOTE
6、2There is no similar or equivalent ISO known ISO equivalent to this standard.2. Referenced Documents2.1 ASTM Standards:2D149 Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials atCommercial Power FrequenciesD150 Test Methods for AC Loss Chara
7、cteristics and Permittivity (Dielectric Constant) of Solid Electrical InsulationD256 Test Methods for Determining the Izod Pendulum Impact Resistance of PlasticsD495 Test Method for High-Voltage, Low-Current, Dry Arc Resistance of Solid Electrical Insulation (Withdrawn 2013)3D570 Test Method for Wat
8、er Absorption of PlasticsD618 Practice for Conditioning Plastics for TestingD638 Test Method for Tensile Properties of PlasticsD648 Test Method for Deflection Temperature of Plastics Under Flexural Load in the Edgewise PositionD790 Test Methods for Flexural Properties of Unreinforced and Reinforced
9、Plastics and Electrical Insulating MaterialsD883 Terminology Relating to PlasticsD1896 Practice for Transfer Molding Test Specimens of Thermosetting CompoundsD2863 Test Method for Measuring the Minimum Oxygen Concentration to Support Candle-Like Combustion of Plastics(Oxygen Index)D3892 Practice for
10、 Packaging/Packing of Plastics2.2 IEC Standards:IEC 61621 Dry Solid Insulating MaterialsResistance Test to High-Voltage, Low-Current Arc Discharges33. Terminology3.1 DefinitionsDefinitions of terms used in this specification are in accordance with Terminology D883.1 This specification is under the j
11、urisdiction of ASTM Committee D20 on Plastics and is the direct responsibility of Subcommittee D20.16 on Thermosetting Materials.Current edition approved Dec. 1, 2012Sept. 1, 2013. Published December 2012September 2013. Originally approved in 1972. Last previous edition approved in 20042012as D3013
12、- 99(2004)(2012).1. DOI: 10.1520/D3013-99R12.10.1520/D3013-13.2 For referencedASTM standards, visit theASTM website, www.astm.org, or contactASTM Customer Service at serviceastm.org. For Annual Book of ASTM Standardsvolume information, refer to the standards Document Summary page on the ASTM website
13、.3 The last approved version of this historical standard is referenced on www.astm.org.Available from American National Standards Institute (ANSI), 25 W. 43rd St., 4thFloor, New York, NY 10036, http:/www.ansi.org.This document is not an ASTM standard and is intended only to provide the user of an AS
14、TM standard an indication of what changes have been made to the previous version. Becauseit may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current versionof the standard as published
15、 by ASTM is to be considered the official document.*A Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States14. Classification4.1 GradesThis specification is subdivided into vario
16、us grades of epoxy molding compounds based on physical properties.This specification provides for a system of characterization and identification which enables coverage for all commerciallyavailable grades having properties within the range of the possible combinations as may be selected from Table
17、1. A grade isdesignated by the cell numbers for each property in the order in which they are listed in Table 1. When a property is not specified,a “0” is entered as the cell number.4.2 ClassesEach of the grades of epoxy molding compound may be further subdivided into classes according to specialrequ
18、irements. A class is designated by a capital letter followed by cell designation corresponding to the requirements detailed inTable 2. Where no special requirements, in addition to grade properties, are needed, no class designation is shown.NOTE 3An example of this classification system would be gra
19、de 12324-D-00200-F-3 an epoxy molding compound having the following requirements(see Table 1 and Table 2):NOTE 4Although the values listed in Table 1 and Table 2 are necessary to include the range of properties available in existing materials, they shouldnot be interpreted as implying that every pos
20、sible combination of the properties exists or can be obtained commercially.5. General Requirements5.1 The molding compounds shall be of uniform composition and so formulated as to conform to the requirements of thisspecification.5.2 The apparent density, bulk factor, flow, particle size, and color o
21、f the compounds shall be as agreed upon between thepurchaser and the seller in the order or contract. Properties other than those specified in this specification may also be agreed upon.TABLE 1 Detail Grade Requirements for Epoxy Molding CompoundsDesig-nationOrderNo.Property and UnitGrades (Cell Lim
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