ASTM D3013-1999(2012) Standard Specification for Epoxy Molding Compounds《环氧基树脂模塑化合物的标准规格》.pdf
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1、Designation: D3013 99 (Reapproved 2012)Standard Specification forEpoxy Molding Compounds1This standard is issued under the fixed designation D3013; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number
2、 in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope*1.1 This specification covers requirements for epoxy ther-moset
3、ting molding compounds. It provides for theiridentification, quality control, and purchase in such a mannerthat the purchaser and the seller can agree on the substantialsimilarity of different commercial lots or shipments.1.2 The compounds covered under this specification consistof mixtures or blend
4、s of epoxy resins and curing agentsintimately combined, in an unreacted or partially reactedcondition, with fillers, reinforcements, colorants, and otherchemical agents.1.3 The values stated in SI units are to be regarded as thestandard.NOTE 1The properties included in this specification are those r
5、equiredto identify the kinds of molding compounds covered. There may be otherrequirements necessary to define particular characteristics. These will beadded to the specification as their inclusion becomes generally desirableand the necessary test data and methods become available.NOTE 2There is no s
6、imilar or equivalent ISO standard.2. Referenced Documents2.1 ASTM Standards:2D149 Test Method for Dielectric Breakdown Voltage andDielectric Strength of Solid Electrical Insulating Materialsat Commercial Power FrequenciesD150 Test Methods for AC Loss Characteristics and Permit-tivity (Dielectric Con
7、stant) of Solid Electrical InsulationD256 Test Methods for Determining the Izod PendulumImpact Resistance of PlasticsD495 Test Method for High-Voltage, Low-Current, Dry ArcResistance of Solid Electrical InsulationD570 Test Method for Water Absorption of PlasticsD618 Practice for Conditioning Plastic
8、s for TestingD638 Test Method for Tensile Properties of PlasticsD648 Test Method for Deflection Temperature of PlasticsUnder Flexural Load in the Edgewise PositionD790 Test Methods for Flexural Properties of Unreinforcedand Reinforced Plastics and Electrical Insulating Materi-alsD883 Terminology Rel
9、ating to PlasticsD1896 Practice for Transfer Molding Test Specimens ofThermosetting CompoundsD2863 Test Method for Measuring the Minimum OxygenConcentration to Support Candle-Like Combustion ofPlastics (Oxygen Index)D3892 Practice for Packaging/Packing of Plastics3. Terminology3.1 DefinitionsDefinit
10、ions of terms used in this specifica-tion are in accordance with Terminology D883.4. Classification4.1 GradesThis specification is subdivided into variousgrades of epoxy molding compounds based on physical prop-erties. This specification provides for a system of characteriza-tion and identification
11、which enables coverage for all commer-cially available grades having properties within the range of thepossible combinations as may be selected from Table 1.Agrade is designated by the cell numbers for each property in theorder in which they are listed in Table 1. When a property is notspecified, a
12、“0” is entered as the cell number.4.2 ClassesEach of the grades of epoxy molding com-pound may be further subdivided into classes according tospecial requirements. A class is designated by a capital letterfollowed by cell designation corresponding to the requirementsdetailed in Table 2. Where no spe
13、cial requirements, in additionto grade properties, are needed, no class designation is shown.1This specification is under the jurisdiction of ASTM Committee D20 onPlastics and is the direct responsibility of Subcommittee D20.16 on ThermosettingMaterials.Current edition approved Dec. 1, 2012. Publish
14、ed December 2012. Originallyapproved in 1972. Last previous edition approved in 2004 as D3013 - 99(2004)1.DOI: 10.1520/D3013-99R12.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume informa
15、tion, refer to the standards Document Summary page onthe ASTM website.*A Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1NOTE 3An example of this classification system woul
16、d be grade12324-D-00200-F-3 an epoxy molding compound having the followingrequirements (see Table 1 and Table 2):NOTE 4Although the values listed in Table 1 and Table 2 arenecessary to include the range of properties available in existing materials,they should not be interpreted as implying that eve
17、ry possible combinationof the properties exists or can be obtained commercially.5. General Requirements5.1 The molding compounds shall be of uniform composi-tion and so formulated as to conform to the requirements of thisspecification.5.2 The apparent density, bulk factor, flow, particle size, andco
18、lor of the compounds shall be as agreed upon between thepurchaser and the seller in the order or contract. Propertiesother than those specified in this specification may also beagreed upon.6. Detail Requirements6.1 Test specimens molded by transfer in accordance withPractice D1896, or compression me
19、thods in accordance withthe suppliers recommendations shall conform to the require-ments prescribed in Section 4 and Table 1 and Table 2 for thegrade and classes specified.7. Sampling7.1 A batch or lot shall be considered as a unit of manufac-ture and may consist of a blend of two or more production
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