ASTM D1867-2007 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的标准规范》.pdf
《ASTM D1867-2007 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的标准规范》.pdf》由会员分享,可在线阅读,更多相关《ASTM D1867-2007 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的标准规范》.pdf(5页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: D 1867 07An American National StandardStandard Specification forCopper-Clad Thermosetting Laminates for Printed Wiring1This standard is issued under the fixed designation D 1867; the number immediately following the designation indicates the year oforiginal adoption or, in the case of r
2、evision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers twelve grades of thermosettinglaminate with copper foil bonded to one
3、 or both surfaces. Thesecombination forms are intended primarily for use in fabricationof printed (etched) wiring or circuit boards.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.3 This standard does not purport
4、to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 709 S
5、pecification for Laminated Thermosetting MaterialsD 1711 Terminology Relating to Electrical InsulationD 3636 Practice for Sampling and Judging Quality of SolidElectrical Insulating MaterialsD 5109 Test Methods for Copper-Clad ThermosettingLaminates for Printed Wiring Boards2.2 Other Standards:MIL-P-
6、13949 Plastic Sheet, Laminated, Metal Clad (forPrinted Wiring Boards)3NEMA Publication Number LI-143. Terminology3.1 For definitions of terms used in this standard, refer toTerminology D 1711.4. Classification4.1 Base Laminate GradesWhere applicable, the dielec-tric material forming the base of the
7、copper-clad laminate ofthe types listed in Table 1 and Table 2 shall conform to theproperty requirements of that specific grade shown in Specifi-cation D 709.4.2 Copper Foil SurfacesThe surfaces shall be copperfoil, either rolled or electrodeposited, having a minimum purityof 99.50 % (silver conside
8、red as equal to copper). The thick-ness tolerances of the copper foil shall conform to therequirements of Table 3.4.3 Thickness Tolerance ClassesCopper-clad laminatesare available in two classes of thickness tolerance. Class Irepresents those tolerances of standard manufacturing practice.Class II re
9、presents a closer tolerance product than Class I. Anyspecified class shall conform to the requirements shown inTable 4.4.3.1 For sheets of laminate equal to or greater than 18 by18 in. (approximately 2.3 ft2) at least 90 % of all thickness testmeasurements made upon any sheet of laminate shall be wi
10、thinthe limits specified in Table 4. For metric size sheets this 90 %requirement shall apply to sheet sizes of 0.5 by 0.5 m or 0.25m2area.4.3.2 The deviation of any single thickness test measure-ment value (see Practice D 3636) from the nominal overallthickness listed in Table 4 shall not exceed 125
11、 % of thetolerance listed in Table 4.4.3.3 Any overall laminate thickness not listed in Table 4shall meet the tolerance requirements of the next highestnominal thickness listed in Table 4.4.3.4 For cut panels (for example, laminate sheets cut toarea less than 2.3 ft2or less than 0.25 m2) at least 98
12、 % of allthickness test measurements shall be within the specifiedoverall laminate thickness tolerance values of Table 4.1This specification is under the jurisdiction of the ASTM Committee D09 onElectrical and Electronic Insulating Materials and is the direct responsibility ofSubcommittee D09.07 on
13、Flexible and Rigid Insulating Materials.Current edition approved May 1, 2007. Published June 2007. Originallyapproved in 1961. Last previous edition approved in 2001 as D 1867 01.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org.
14、 For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.4Available from National Electrical Manufacturers A
15、ssociation, 2101 L St.,N.W., Washington, DC 20037.1*A Summary of Changes section appears at the end of this standard.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.5. Ordering Information5.1 Orders for copper-clad laminates shall spe
16、cify the gradeof laminate base (see 4.1); the type of copper foil (either rolledor electrodeposited); the nominal weight of the copper foil (see4.2); one- or two-side cladding; nominal overall laminatethickness; and the thickness tolerance class (see 4.3).6. Detailed Requirements6.1 The laminate sha
17、ll meet the requirements shown inTable 5.7. Warp or Twist7.1 The warp or twist of copper-clad laminate shall meet therequirements of Table 6. The maximum values shown in Table6 are percentage values applicable only to sheet sizes asmanufactured and to sheets cut such that neither length norwidth is
18、less than 18 in. (457 mm). The values shown arepercentages based upon 36-in. (914-mm) dimension sheets.8. Blistering8.1 No blistering shall occur due to exposure of specimensof the material to air at the temperatures and times shown inTable 7. This requirement applies to copper-clad specimensand to
19、laminate from which all of the copper has been etched.9. Workmanship and Surface Requirements9.1 Grades XXXP, XXXPC, FR-2 and FR-6 Only:9.1.1 Copper surfaces shall be free from defects which mayaffect serviceability of the laminate. Such defects in coppersurfaces include blisters, wrinkles, cracks,
20、dents, and scratches.9.1.2 The copper shall not contain any pin holes havingaverage diameter greater than 0.015 in. (0.381 mm).9.1.3 Pin holes in the copper exceeding average diameter0.005 in. (0.127 mm) shall not be present in concentrationexceeding one per ft2.9.1.4 The number of inclusions in cop
21、per which are largerthan 0.020 in. (0.508 mm) in length shall be limited in a singleft2of laminate and in any single sheet of approximately 0.5 m2size. The limits are:9.1.4.1 5 in any one ft2, and9.1.4.2 10 in any one 0.5 m2size sheet.9.1.5 The unclad laminate surface shall have a semi-gloss ordull
22、finish.9.2 Grades FR-3, FR-4, FR-5, CEM-1, CEM-3, G-10, andG-11:9.2.1 Copper surfaces shall be free from defects which mayaffect serviceability. Such defects include blisters, wrinkles,and cracks. The copper surfaces shall be free from other defectsas required in 9.2.2.9.2.2 Pits are small holes occ
23、urring as imperfections that donot penetrate entirely through the copper foil. Dents aredepressions in the copper foil that do not significantly decreasethe thickness of the copper foil. Pits and dents are limited by apoint count system in which the maximum total allowableTABLE 1 Base Laminate Grade
24、sNOTE 1 A cross reference table of grade designations (see Table 2)appears here for reference purposes only. The ASTM grades shown aremost closely associated with the NEMA and the military grades listed inthis table. There is no requirement, stated or implied, in this ASTMspecification that the ASTM
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- ASTMD18672007STANDARDSPECIFICATIONFORCOPPERCLADTHERMOSETTINGLAMINATESFORPRINTEDWIRING 印制电路 镀铜 层压板 标准规范

链接地址:http://www.mydoc123.com/p-510592.html