ASTM B773-1996(2002)e1 Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies《用超声波C扫描测定钎焊或焊接电触点组件的粘接性的标准指南》.pdf
《ASTM B773-1996(2002)e1 Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies《用超声波C扫描测定钎焊或焊接电触点组件的粘接性的标准指南》.pdf》由会员分享,可在线阅读,更多相关《ASTM B773-1996(2002)e1 Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies《用超声波C扫描测定钎焊或焊接电触点组件的粘接性的标准指南》.pdf(3页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: B 773 96 (Reapproved 2002)e1Standard Guide forUltrasonic C-Scan Bond Evaluation of Brazed or WeldedElectrical Contact Assemblies1This standard is issued under the fixed designation B 773; the number immediately following the designation indicates the year oforiginal adoption or, in the
2、case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.e1NOTEParagraph 1.3 was corrected editorially in June 2002.INTRODUCTIONThis guidance document is th
3、e result of an investigation by the ASTM Committee B04.04 TaskForce on Ultrasonic Bond Testing of Electrical Contacts. Although ultrasonic interrogation is widelyemployed as a non-destructive evaluation method, its application to the testing of electrical contactbonds requires specific techniques.2,
4、3The desire to study the variation of technique and its effect upontest results was responsible for a round-robin test program. The program was conducted in two phasesin an attempt to standardize practices which would improve testing agreement. This study providedanalysis and suggestions for reducin
5、g the variability of test results. The decision of the committee wasto publish a summary of this information to serve as guidelines for writing specifications that willincorporate practices.1. Scope1.1 This guide describes ultrasonic testing procedures thatcan be used for evaluating the bond quality
6、 of electrical contactassemblies manufactured by brazing or welding.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with it
7、s use. It is theresponsibility of the user of this standard to become familiarwith all hazards including those identified in the appropriateMaterial Safety Data Sheet for this product/material as pro-vided by the manufacturer, to establish appropriate safety andhealth practices, and determine the ap
8、plicability of regulatorylimitations prior to use.2. Referenced Documents2.1 ASTM Standards:E 214 Practice for Immersed Ultrasonic Examination by theReflection Method Using Pulsed Longitudinal Waves4E 500 Terminology Relating to Ultrasonic Examination5E 1001 Practice for Detection and Evaluation of
9、Disconti-nuities by the Immersed Pulse-Echo Ultrasonic Methodusing Longitudinal Waves42.2 American Society for Nondestructive Testing Standard(ASNT):SNT-TC-1A Recommended Practice for Personnel Qualifi-cation and Certification in Nondestructive Testing63. Summary of Guide3.1 Pulse-echo TechniqueThe
10、pulse-echo technique isemployed as an ultrasonic testing method which displaysreflected energy pulses. A Piezoelectric transducer (typically1525 M Hz frequency with 0.5- to 1.5-in. (12.7- to 38.1-mm)focal length in water) converts the original electrical pulse intoa mechanical sound wave and then al
11、so acts as a receiver of thereflected mechanical energy, converting it back into usefulelectrical energy. The electrical instrumentation used with thetransducer generates, receives, amplifies, and displays thecontrolled electrical pulses. (See Practices E 214 and E 1001.)3.2 C-ScanThe amplified elec
12、trical signals as receivedfrom the transducer are gated for time/distance and establishthe depth of analysis. When the transducer (coupled through awater medium) is made to traverse in the X-Y directions, the1This guide is under the jurisdiction of ASTM Committee B02 on NonferrousMetals and Alloys a
13、nd is the direct responsibility of Subcommittee B02.11 onElectrical Contact Test Methods.Current edition approved May 10, 1996. Published July 1996. Originallypublished as B 773 87. Last previous edition B 773 87 (1991)e1.2Buckley, R. I., Commey, R. R., Jr., and Popat, P. V.,“Nondestructive Ultrason
14、icInspection of Braze Bonds in High Current Electrical Contact Assemblies,”Proceedings of the Holm Conference on Electrical Contacts, 1971, pp. 6371.3Jost, E., and Fontaine, G., “Ultrasonic In-line Inspection Technique for ContactMaterials,” Proceedings of the Holm Conference on Electrical Contacts,
15、 1979, pp.209213.4Annual Book of ASTM Standards, Vol 03.03.5Discontinued; see 1991 Annual Book of ASTM Standards, Vol 03.036Available from ASNT, 1711 Arlingate Lane, P.O. Box 28518, Columbus, OH43228-0518.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-
16、2959, United States.gated electrical signals are then used to describe a two-dimensional plan view of defects in the interior of the testedobject(s). This plan view of defect information at a given depthof analysis (that is, the brazed or welded layer within thecontact assembly) is called a C-scan.
17、(See Terminology E 500.)3.3 Data Presentation:3.3.1 The gated C-scan signals are used to drive an X-Yplotter/printer that provides a permanent record of the defectplane being examined.3.3.2 The sensitivity of the instrument (alarm levels) isadjusted with the printer circuit by a technician to provid
18、e anaccurate resolution level for the true characterization of de-fects.3.3.3 The calibrated C-scan printed display can then be usedto evaluate the bonded area (or unbonded area shapes) of anarray of contacts under examination.4. Significance and Use4.1 This guide is recommended to be used in prepar
19、ingspecifications for the non-destructive evaluation of brazed orwelded electrical contact bonded area.7The recommendedprocedures are meant to improve the reproducibility of test dataamong various laboratories. Specific differences among equip-ment models and technician skills do exist which will li
20、mitabsolute correlation. This guide provides an indication of thedegree of variability which has been observed as realisticamong industry participants.4.2 Ultrasonic testing alone does not insure an understand-ing of bonded integrity. Other attributes (that is, strength) mayrequire correlation with
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