ASTM B558-1979(2008) Standard Practice for Preparation of Nickel Alloys for Electroplating《电镀用镍合金的制备的标准作法》.pdf
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1、Designation: B 558 79 (Reapproved 2008)Standard Practice forPreparation of Nickel Alloys for Electroplating1This standard is issued under the fixed designation B 558; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last
2、 revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice is intended to serve as a guide forproducing adherent electrodeposits of nickel on nickel alloys.Only those
3、methods that are well known and generally prac-ticed are included. Methods that have been used successfullybut not on a broad scale are not included. Once nickel isapplied, other metals may be electroplated on the product.1.2 This standard does not purport to address all of thesafety concerns, if an
4、y, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Cleaning2.1 The following cleaning treatments may be used. Thechoice of the procedure will
5、 be governed largely by thecondition of the surface.2.1.1 Degreasing is used to remove the bulk of grease, oil,and finishing compounds that may be present on the surface.The cleaning may be vapor degreasing, solvent wash, emulsioncleaning, or soak cleaning.2.1.2 Electrolytic Alkaline CleaningRemoval
6、 of finaltraces of dirt, grease, and oil is accomplished best withelectrolytic alkaline cleaning. The solution may be either aproprietary cleaner or a formulated one.3. Activation3.1 The procedure used for activating the nickel alloysurface usually determines the soundness of the adhesion. Thechoice
7、 of treatment is governed by the condition of the surfaceand the type of alloy. A mild etching treatment should be usedon polished surfaces if a highly finished surface is required.Too mild a treatment may result in a sacrifice of maximumadhesion.3.2 Anodic-Cathodic Sulfuric AcidA 25 mass % sulfuric
8、acid solution, containing 166 mL of concentrated, 93 mass %sulfuric acid (density 1.83 g/mL) diluted to 1 L is used for thisetching treatment in which the alloy is first etched anodically ata low-current density of 2 A/dm2for 10 min and then madepassive at 20 A/dm2for 2 min and finally cathodic for
9、2 or 3 sat 20 A/dm2.(WarningSlowly add the sulfuric acid withrapid stirring to the approximate amount of water required.)When the initial mixture cools, dilute to exact volume. Thetemperature of the solution should be in the range from 20 to25C (70 to 80F). Chemical lead may be used for theelectrode
10、s. Rinsing should be used before electroplating.NOTE 1This activation is not suitable for barrel operation.3.3 Acid-Nickel Chloride TreatmentThis procedure usesan anodic treatment followed by a cathodic treatment in alow-pH nickel chloride solution. The composition of thesolution is 240 g/L of nicke
11、l chloride (NiCl26H2O) and 31 mLof concentrated 31.45 mass % hydrochloric acid (density 1.16g/mL). The normal procedure is to make the alloy anodic for 2min at 3 A/dm2and then cathodic for 6 min at the same currentdensity. The temperature of the solution should be in the rangefrom 20 to 25C. Nickel
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