ASTM B32-2008(2014) Standard Specification for Solder Metal《金属焊料的标准规格》.pdf

《ASTM B32-2008(2014) Standard Specification for Solder Metal《金属焊料的标准规格》.pdf》由会员分享，可在线阅读，更多相关《ASTM B32-2008(2014) Standard Specification for Solder Metal《金属焊料的标准规格》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: B32 08 (Reapproved 2014)Standard Specification forSolder Metal1This standard is issued under the fixed designation B32; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revision.Anumber in parentheses i

2、ndicates the year of last reapproval.Asuperscriptepsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S. Department of Defense.1. Scope1.1 This specification covers solder metal alloys (commonlyknown as soft solde

3、rs) used in non-electronic applications,including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the pur-pose of joining together two or more metals at temperaturesbelow their mel

4、ting points. Electronic grade solder alloys andfluxed and non-fluxed solid solders for electronic solderingapplications are not covered by this specification as they areunder the auspices of IPC Association Connecting ElectronicIndustries.1.1.1 These solders include those alloys having a liquidustem

5、perature not exceeding 800F (430C).1.1.2 This specification includes solders in the form of solidbars, ingots, powder and special forms, and in the form of solidand flux-core ribbon, wire, and solder paste.1.2 The values stated in inch-pound units are to be regardedas standard. The values given in p

6、arentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to become familiarwi

7、th all hazards including those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine the applicability ofregulatory limitations prior to use.2. Referenced Documents2.

8、1 ASTM Standards:2D269 Test Method for Insoluble Matter in Rosin and RosinDerivativesD464 Test Methods for Saponification Number of NavalStore Products Including Tall Oil and Other RelatedProductsD465 Test Methods for Acid Number of Naval StoresProducts Including Tall Oil and Other Related ProductsD

9、509 Test Methods of Sampling and Grading RosinE28 Test Methods for Softening Point of Resins Derivedfrom Pine Chemicals and Hydrocarbons, by Ring-and-Ball ApparatusE29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE46 Test Methods for Chemical Analysis

10、 of Lead- andTin-Base Solder (Withdrawn 1994)3E51 Method for Spectrographic Analysis of Tin Alloys bythe Powder Technique (Withdrawn 1983)3E55 Practice for Sampling Wrought Nonferrous Metals andAlloys for Determination of Chemical CompositionE87 Methods for ChemicalAnalysis of Lead, Tin,Antimonyand

11、Their Alloys (Photometric Method) (Withdrawn1983)3E88 Practice for Sampling Nonferrous Metals and Alloys inCast Form for Determination of Chemical Composition2.2 Federal Standard:4Fed. Std. No. 123 Marking for Shipment (Civil Agencies)2.3 Military Standard:5MIL-STD-129 Marking for Shipment and Stora

12、ge3. Terminology3.1 Definitions:3.1.1 producer, nthe primary manufacturer of the mate-rial.3.2 Definitions of Terms Specific to This Standard:1This specification is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.02 on R

13、efined Lead, Tin, Antimony, and Their Alloys.Current edition approved Oct. 1, 2014. Published October 2014. Originallyapproved in 1919. Last previous edition approved in 2008 as B32 08. DOI:10.1520/B0032-08R14.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Custo

14、mer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3The last approved version of this historical standard is referenced onwww.astm.org.4Available from Global Engineering Documents, 15 Inverness Way, Eas

15、tEnglewood, CO 80112-5704, http:/.5Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:/www.dodssp.daps.mil.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United State

16、s13.2.1 lot, nThe term “lot” as used in this specification isdefined as follows:3.2.1.1 DiscussionFor solid solder metal, a lot consists ofall solder of the same type designation, produced from thesame batch of raw materials under essentially the sameconditions, and offered for inspection at one tim

17、e.3.2.1.2 DiscussionFor fluxcore solder, a lot consists ofall solder of the same core mixture, produced from the samebatch of raw materials under essentially the same conditionsand offered for inspection at one time.3.2.2 lot number, nThe term “lot number” as used in thisspecification refers to an a

18、lphanumeric or numerical designa-tion for a lot which is traceable to a date of manufacture.4. Classification4.1 Type DesignationThe type designation uses the fol-lowing symbols to properly identify the material:4.1.1 Alloy CompositionThe composition is identified bya two-letter symbol and a number.

19、 The letters typically indicatethe chemical symbol for the critical element in the solder andthe number indicates the nominal percentage, by weight, of thecritical element in the solder. The designation followed by theletters A or B distinguishes between different alloy grades ofsimilar composition

20、(see Table 1).4.1.2 FormThe form is indicated by a single letter inaccordance with Table 2.4.1.3 Flux TypeThe flux type is indicated by a letter orcombination of letters in accordance with Table 3.4.1.4 Core Condition and Flux Percentage (applicable onlyto flux-cored solder)The core condition and fl

21、ux percentageis identified by a single letter and a number in accordance withTable 4.4.1.5 Powder Mesh Size and Flux Percentage (applicableonly to solder paste)The powder mesh size and flux percent-age is identified by a single letter and a number in accordancewith Table 5.5. Ordering Information5.1

22、 Orders for material under this specification indicate thefollowing information, as required, to adequately describe thedesired material.5.1.1 Type designation (see 4.1),5.1.2 Detailed requirements for special forms,5.1.3 Dimensions of ribbon and wire solder (see 9.2),5.1.4 Unit weight,5.1.5 Packagi

23、ng (see Section 18),5.1.6 Marking (see Section 17),5.1.7 ASTM specification number and issue, marked on (a)purchase order and (b) package or spool, and5.1.8 Special requirements, as agreed upon between sup-plier and purchaser.6. Materials and Manufacture6.1 The producer must have each lot of solder

24、metal asuniform in quality as practicable and of satisfactory appearancein accordance with best industrial practices. Each bar, ingot, orother form in which the solder is sold must be uniform incomposition with the entire lot.7. Chemical Composition7.1 Solder AlloyThe solder alloy composition is as

25、speci-fied in Table 1.NOTE 1By mutual agreement between supplier and purchaser, analy-sis may be required and limits established for elements or compounds notspecified in Table 1.7.2 Flux (applicable to flux-core ribbon, wire, and solderpaste):7.2.1 Type RThe flux is composed of Grade WW or WGgum ro

26、sin of Test Methods D509. The rosin shall have atolueneinsoluble matter content of not more than 0.05weight % in accordance with Test Method D269, a minimumacid number of 160 mg KOH/1 g sample in accordance withTest Methods D465, a minimum softening point of 70C inaccordance with Test Methods E28, a

27、nd a minimum saponifi-cation number of 166 in accordance with Test Methods D464.When solvents or plasticizers are added, they must be nonchlo-rinated.7.2.2 Type RMAThe flux is composed of rosin conformingto 7.2.1. Incorporated additives provide a material meeting therequirements of 8.1.2 for type RM

28、A. When solvents orplasticizers are added, they must be nonchlorinated.7.2.3 Type RAThe flux is composed of rosin conformingto 7.2.1. Incorporated additives provide a material meeting therequirements of 8.1.2 for Type RA. When solvents or plasti-cizers are added, they must be nonchlorinated.7.2.4 Ty

29、pe OAThe flux is composed of one or morewater-soluble organic materials.7.2.5 Type OSThe flux is composed of one or morewater-insoluble organic materials, other than Types R, RMA,and RA, which are soluble in organic solvents.7.2.6 Type ISThe flux is composed of one or moreinorganic salts or acids wi

30、th or without an organic binder andsolvents.8. Physical Properties and Performance Requirements8.1 Solder PasteSolder paste must exhibit smoothness oftexture (no lumps) and the absence of caking and drying.8.1.1 Powder Mesh SizeThe solder powder mesh sizeshall be as specified (see 5.1.1 and 4.1.5) w

31、hen the extractedsolder powder is tested as specified in 13.4.8.1.2 ViscosityThe viscosity of solder paste and themethod used to determine the viscosity must be agreed uponbetween the supplier and purchaser. The following variablesmust be taken into account when relating one viscositymeasurement to

32、another type of viscometer used, spindle sizeand shape, speed (r/min), temperature of sample, and the use ornon-use of a helipath.8.2 Requirements for FluxThe flux must meet the physicaland performance requirements specified in Table 6 as appli-cable.8.2.1 Solder PoolWhen solder is tested as specifi

33、ed in13.3.2, there must be no spattering, as indicated by thepresence of flux particles outside the main pool of residue. Theflux must promote spreading of the molten solder over thecoupon to form integrally thereon a coat of solder that shallB32 08 (2014)2TABLE1SolderCompositions-wt%(rangeormaximum

34、)Composition,%AMeltingRangeBAlloy GradeSn1Pb2Sb3Ag4Cu5Cd6Al7Bi8As9Fe 10Zn 11Ni 12Ce 13Se 14SolidusLiquidusUNSNumberFCFCSection1:SolderAlloysContainingLessthan0.2%LeadCSn96Rem0.100.123.43.80.080.0050.0050.150.05max0.020.005.430221430221L13965Sn95Rem0.100.124.44.80.080.0050.0050.150.050.020.005.430221

35、473245L13967Sn94Rem0.100.125.45.80.080.0050.0050.150.050.020.005.430221536280L13969Sb594.0min0.204.5-5.50.0150.080.0050.0050.150.050.040.005.450233464240L13950EDRem0.100.050.250.753.05.00.0050.0050.020.050.020.005.440225660349L13935HADRem0.100.54.00.13.00.12.00.0050.0050.150.050.020.54.0.42021644022

36、7L13955HBDRem0.104.06.00.050.52.05.00.0050.0050.150.050.020.010.052.0.460238660349L13952HNDRem0.100.050.050.153.54.50.0050.0050.150.050.020.0050.15-0.25.440225660350L13933PTDRem0.20.254.00.050.500.254.00.0050.0050.150.010.020.0050.0050.01-0.25.430221435224ACDRem0.100.050.20.30.10.30.0050.0052.75-3.7

37、50.050.020.0050.001.403206453234L13964OADRem0.20.050.050.32.04.00.0050.0050.51.50.050.040.05.420216460238L13937AMRem0.100.81.20.40.62.83.20.0050.0050.150.050.020.005.430220446230L13938TCRem0.200.050.0154.05.00.0050.0050.050.050.040.0050.005.0.04-0.20419215660350L13931WSRem0.101.01.50.20.63.54.50.005

38、0.0050.020.050.020.005.440225660350L13939AForpurposesofdeterminingconformancetotheselimits,anobservedvalueorcalculatedvalueobtainedfromanalysisshallberoundedtothenearestunitinthelastright-handplaceoffiguresusedinexpressingthespecifiedlimit,inaccordancewiththeroundingmethodofPracticeE29.BTemperatures

39、givenareapproximationsandforinformationonly.CForalloysnotidentified,namedelementsshallconformtothefollowingtolerances(wt%):5%0.5%,=5%0.25%;Impurityelements(maximum):Sn-0.2,Pb-0.2,Sb-0.5,Ag-0.015,Cu-0.08,Cd-0.005,Al-0.05,Bi-0.15,As-0.02,Fe-0.02,Zn-0.005.DGradesEandOAarecoveredbyU.S.patentsheldbyEngel

40、hardCorp,Mansfield,MA,andOateyCo.Cleveland,OHrespectively.FederatedFryMetals,Altoona,PAandTaracorpInc.,Atlanta,GAhaveappliedforpatentsongradesACandTCrespectively.GradesHA,HB,andHNarecoveredbypatentsassignedtoJ.W.HarrisCo.,Cincinnati,OH.GradePTiscoveredbyapatentissuedtoPreciseAlloysCorporation,Bronx,

41、NY.InterestedpartiesareinvitedtosubmitinformationregardingidentificationofacceptablealternativestothesepatenteditemstotheCommitteeonStandards,ASTMInternationalHeadquarters,100BarrHarborDrive,WestConshohocken,PA19428.Yourcommentswillreceivecarefulconsiderationatameetingoftheresponsibletechnicalcommit

42、tee,1whichyoumayattend.OAvalueforFE10wascorrectededitorially.B32 08 (2014)3TABLE1SolderCompositions-wt%(rangeormaximum)(continued)Composition,%AMeltingRangeBAlloy GradeSn1Pb2Sb3Ag4Cu5Cd6Al7Bi8As9Fe 10Zn 11Ni 12Ce 13Se 14SolidusLiquidusUNSNumberFCFCSection2:SolderAlloysContainingLeadSn7069.571.5Rem0.

43、500.0150.080.0010.0050.250.030.020.005.361183377193L13700Sn6362.563.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183361183L13630Sn6261.562.5Rem0.501.752.250.080.0010.0050.250.030.020.005.354179372189L13620Sn6059.561.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183374190L13600Sn5049.551.5Rem0.5

44、00.0150.080.0010.0050.250.0250.020.005.361183421216L55031Sn4544.546.5Rem0.500.0150.080.0010.0050.250.0250.020.005.361183441227L54951Sn40A39.541.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183460238L54916Sn40B39.541.5Rem1.82.40.0150.080.0010.0050.250.020.020.005.365185448231L54918Sn35A34.536.5Rem

45、0.500.0150.080.0010.0050.250.020.020.005.361183447247L54851Sn35B34.536.5Rem1.62.00.0150.080.0010.0050.250.020.020.005.365185470243L54852Sn30A29.531.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183491255L54821Sn30B29.531.5Rem1.41.80.0150.080.0010.0050.250.020.020.005.365185482250L54822Sn25A24.526.

46、5Rem0.500.0150.080.0010.0050.250.020.020.005.361183511266L54721Sn25B24.526.5Rem1.11.50.0150.080.0010.0050.250.020.020.005.365185504263L54722Sn20A19.521.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183531277L54711Sn20B19.521.5Rem0.81.20.0150.080.0010.0050.250.020.020.005.363184517270L54712Sn1514.5

47、16.5Rem0.500.0150.080.0010.0050.250.020.020.005.437225554290L54560Sn10A9.011.0Rem0.500.0150.080.0010.0050.250.020.020.005.514268576302L54520Sn10B9.011.0Rem0.201.72.40.080.0010.0050.030.020.020.005.514268570299L54525Sn54.55.5Rem0.500.0150.080.0010.0050.250.020.020.005.586308594312L54322Sn21.52.5Rem0.

48、500.0150.080.0010.0050.250.020.020.005.601316611322L54210Ag1.50.751.25Rem0.401.31.70.300.0010.0050.250.020.020.005.588309588309L50132Ag2.50.25Rem0.402.32.70.300.0010.0050.250.020.020.005.580304580304L50151Ag5.50.25Rem0.405.06.00.300.0010.0050.250.020.020.005.580304716380L50180AForpurposesofdetermini

49、ngconformancetotheselimits,anobservedvalueorcalculatedvalueobtainedfromanalysisshallberoundedtothenearestunitinthelastright-handplaceoffiguresusedinexpressingthespecifiedlimit,inaccordancewiththeroundingmethodofPracticeE29.BTemperaturesgivenareapproximationsandforinformationonly.B32 08 (2014)4feather out to a thin edge. The complete edge of the solder poolmust be clearly visible through the fl