IEC 61967-4 Edition 1.1-2006 Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - Part 4 Measurement of conducted emissions 1 150 d.pdf

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1、 NORME INTERNATIONALECEIIECINTERNATIONAL STANDARD 61967-4Edition 1.12006-07Circuits intgrs Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 4: Mesure des missions conduites Mthode par couplage direct 1 /150 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part

2、 4: Measurement of conducted emissions 1 /150 direct coupling method Numro de rfrence Reference number CEI/IEC 61967-4:2002+A1:2006 Edition 1:2002 consolide par lamendement 1:2006 Edition 1:2002 consolidated with amendment 1:2006 Copyright International Electrotechnical Commission Provided by IHS un

3、der license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Numrotation des publications Depuis le 1er janvier 1997, les publications de la CEI sont numrotes partir de 60000. Ainsi, la CEI 34-1 devient la CEI 60034-1. Editions consolides Les versions consol

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16、serviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 . Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NORME INTERNATIONALE CEIIECINTERNATIONAL STANDARD 61967-4Edition 1.120

17、06-07Circuits intgrs Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 4: Mesure des missions conduites Mthode par couplage direct 1 /150 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions 1 /150 direct coupling method P

18、our prix, voir catalogue en vigueur For price, see current catalogue IEC 2006 Droits de reproduction rservs Copyright - all rights reserved Aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la ph

19、otocopie et les microfilms, sans laccord crit de lditeur. No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission

20、, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch V Commission Electrotechnique InternationaleInternational Electrotechnical Commission CODE PRIX PRICE CODE Edition 1:2002 consolide par lamendemen

21、t 1:2006 Edition 1:2002 consolidated with amendment 1:2006 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 2 61967-4 CEI:2002+A1:2006 SOMMAIRE AVANT-PROPOS 6 1 Domaine dappli

22、cation.10 2 Rfrences normatives .10 3 Dfinitions 12 4 Gnralits.12 4.1 Principes de base de mesure.12 4.2 Mesure du courant RF .14 4.3 Mesure de la tension RF aux broches CI14 4.4 Evaluation de la technique de mesure16 5 Conditions dessai.16 6 Appareillage dessai16 6.1 Spcification du rcepteur dessai

23、16 6.2 Spcification de la sonde de courant RF 16 6.3 Essai de la capacit de la sonde de courant RF .18 6.4 Spcification du rseau dadaptation18 7 Montage dessai20 7.1 Configuration gnrale dessai.20 7.2 Disposition pour carte dessai circuit imprim20 8 Procdure dessai.22 9 Rapport dessai.22 Annexe A (n

24、ormative) Procdure dtalonnage de sonde 24 Annexe B (informative) Classification des niveaux des missions conduites30 B.1 Remarque dintroduction30 B.2 Gnralits30 B.3 Dfinition des niveaux dmission 30 B.4 Prsentation des rsultats .32 Annexe C (informative) Exemple de niveaux de rfrence pour applicatio

25、ns automobiles38 C.1 Remarque dintroduction38 C.2 Gnralits38 C.3 Niveaux de rfrence.38 Annexe D (informative) Exigences CEM et mthode dutilisation des techniques de mesure CEM CI42 D.1 Introduction .42 D.2 Utilisation des procdures de mesures CEM 42 D.3 Evaluation de linfluence des CI sur le comport

26、ement CEM des modules 44 Annexe E (informative) Exemple de montage dessai comprenant une carte principale dessai CEM et une carte dessai EME CI 46 E.1 Carte principale dessai CEM .46 E.2 Carte dessai EME CI.50 Annexe F (informative) Rseaux de couplage directs 150 pour mesures dmission en mode commun

27、 des CI de transfert de donnes en mode diffrentiel et circuits analogues .58 F.1 Rseau de couplage direct de base .58 F.2 Exemple dune alternative de rseau de couplage en mode commun pour CAN ou LVDS haute vitesse ou RS485 ou systmes analogues60 Copyright International Electrotechnical Commission Pr

28、ovided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-61967-4 IEC:2002+A1:2006 3 CONTENTS FOREWORD.7 1 Scope.11 2 Normative references11 3 Definitions 13 4 General 13 4.1 Measurement basics13 4.2 RF current measurement .15 4.3 RF volta

29、ge measurement at IC pins .15 4.4 Assessment of the measurement technique .17 5 Test conditions .17 6 Test equipment.17 6.1 Test receiver specification .17 6.2 RF current probe specification .17 6.3 Test of the RF current probe capability.19 6.4 Matching network specification 19 7 Test set-up .21 7.

30、1 General test configuration21 7.2 Printed circuit test board layout21 8 Test procedure .23 9 Test report23 Annex A (normative) Probe calibration procedure .25 Annex B (informative) Classification of conducted emission levels 31 B.1 Introductory remark .31 B.2 General .31 B.3 Definition of emission

31、levels.31 B.4 Presentation of results.33 Annex C (informative) Example of reference levels for automotive applications.39 C.1 Introductory remark .39 C.2 General .39 C.3 Reference levels39 Annex D (informative) EMC requirements and how to use EMC IC measurement techniques43 D.1 Introduction .43 D.2

32、Using EMC measurement procedures 43 D.3 Assessment of the IC influence to the EMC behaviour of the modules 45 Annex E (informative) Example of a test set-up consisting of an EMC main test board and an EME IC test board .47 E.1 The EMC main test board 47 E.2 EME IC test board .51 Annex F (informative

33、) 150 direct coupling networks for common mode emission measurements of differential mode data transfer ICs and similar circuits .59 F.1 Basic direct coupling network.59 F.2 Example of a common-mode coupling network alternative for high speed CAN or LVDS or RS485 or similar systems 61 Copyright Inte

34、rnational Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 4 61967-4 CEI:2002+A1:2006 F.3 Exemple dune alternative de rseau de couplage en mode commun pour sorties CI diffrentielles aux charges rsist

35、ives (par exemple contrleur dallumage de coussins de scurit gonflables)62 F.4 Exemple dun rseau de couplage en mode commun pour les systmes CAN tolrance de pannes .62 Figure 1 Exemple de deux boucles dmission retournant au CI par lintermdiaire de la masse de rfrence12 Figure 2 Exemple de CI avec deu

36、x contacts la masse, une petite boucle E/S et deux boucles dmission .14 Figure 3 Construction de la sonde de courant RF .16 Figure 4 Rseau dadaptation dimpdance correspondant la CEI 61000-4-618 Figure 5 Configuration gnrale dessai20 Figure A.1 Circuit dessai .24 Figure A.2 Perte dinsertion dune sond

37、e de 1 .24 Figure A.3 Disposition du circuit dessai dtalonnage .26 Figure A.4 Connexion du circuit dessai dtalonnage28 Figure A.5 Limite minimale de dcouplage par rapport la frquence.28 Figure B.1 Schma des niveaux dmission 32 Figure B.2 Exemple de niveau dmission maximal G8f 34 Figure C.1 Mthode 1

38、Niveaux de rfrence pour perturbations conduites provenant de semiconducteurs (dtecteur de crte).40 Figure C.2 Mthode 150 Niveaux de rfrence pour perturbations conduites provenant de semiconducteurs (dtecteur de crte).40 Figure E.1 Carte principale pour essai CEM48 Figure E.2 Espace rserv aux fils de

39、 connexion 50 Figure E.3 Carte dessai EME CI (zones de contact pour broches de connecteurs ressort de la carte dessai principale) .50 Figure E.4 Exemple de systme dessai EME CI.54 Figure E.5 Ct composants de la carte dessai EME CI.54 Figure E.6 Face infrieure de la carte pour essai EME CI .56 Figure

40、 F.1 Couplage direct de base pour mesures CEM en mode commun .58 Figure F.2 Montage de mesure pour la mesure de S21 du couplage en mode commun .60 Figure F.3 Utilisation dune terminaison de charge divise comme couplage pour lquipement de mesure 60 Figure F.4 Utilisation dune terminaison de charge di

41、vise comme couplage pour lquipement de mesure 62 Figure F.5 Exemple dune adaptation acceptable pour les exigences spciales de rseau (par exemple les systmes CAN tolrance de pannes) .62 Tableau 1 Spcification de la sonde de courant RF.18 Tableau 2 Caractristiques du rseau dadaptation dimpdance 20 Tab

42、leau B.1 Niveaux dmission.36 Tableau D.1 Exemples dans lesquels la procdure de mesure peut tre rduite42 Tableau D.2 Paramtres ambiants lis au systme et au module 44 Tableau D.3 Modifications au niveau du CI qui influencent la CEM44 Copyright International Electrotechnical Commission Provided by IHS

43、under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-61967-4 IEC:2002+A1:2006 5 F.3 Example of a common-mode coupling network alternative for differential IC outputs to resistive loads (e.g. airbag ignition driver) .63 F.4 Example of a common-mode

44、coupling network for fault tolerant CAN systems63 Figure 1 Example of two emitting loops returning to the IC via common ground.13 Figure 2 Example of IC with two ground pins, a small I/O loop and two emitting loops .15 Figure 3 Construction of the RF current probe 17 Figure 4 Impedance matching netw

45、ork corresponding with IEC 61000-4-6 .19 Figure 5 General test configuration.21 Figure A.1 Test circuit 25 Figure A.2 Insertion loss of the 1 probe.25 Figure A.3 Layout of the calibration test circuit27 Figure A.4 Connection of the calibration test circuit.29 Figure A-5 Minimum decoupling limit vers

46、us frequency .29 Figure B.1 Emission level scheme 33 Figure B.2 Example of the maximum emission level G8f .35 Figure C.1 1 method Reference levels for conducted disturbances from semiconductors (peak detector) 41 Figure C.2 150 method Reference levels for conducted disturbances from semiconductors (

47、peak detector) 41 Figure E.1 EMC main test board.49 Figure E.2 Jumper field 51 Figure E.3 EME IC test board (contact areas for the spring connector pins of the main test board) 51 Figure E.4 Example of an EME IC test system 55 Figure E.5 Component side of the EME IC test board .55 Figure E.6 Bottom side of the EME IC test board 57 Figure F.1 Basic direct coupling for common mode EMC measurements.59 Figure F.2 Measurement set-up for the S21 measurement of the common-mode coupling.61 Figure F.3 Using split load t