IEC 60191-6-10-2003 Mechanical standardization of semiconductor devices - Part 6-10 General rules for the preparation of outline drawings of surface mounted sem.pdf

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1、 IEC 60191-6-10 Edition 1.0 2003-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON Normalisation mcanique des dispos

2、itifs semiconducteurs Partie 6-10: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Dimensions des botiers P-VSON IEC 60191-6-10:2003 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2003 IEC, Geneva, Switzerland All rights reserved.

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16、 webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60191-6-10 Edition 1.0 2003-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-10: General rules

17、for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON Normalisation mcanique des dispositifs semiconducteurs Partie 6-10: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Dimensi

18、ons des botiers P-VSON INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE M ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220-520-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale

19、Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60191-6-10 IEC:2003 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES

20、 Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees

21、(IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Repor

22、ts, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and no

23、n-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements o

24、f IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are

25、accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote intern

26、ational uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in th

27、e latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or

28、its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expense

29、s arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attenti

30、on is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-10 has been prepared by subcommittee 47D: Mechanical standardizati

31、on of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual version (2012-12) corresponds to the monolingual English version, published in 2003-11. The text of this standard is based on the following documents: FDIS Report on voting 47D/551/FDIS 47D565/RVD Full

32、information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. 60191-6-10 IEC:2003 3 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The c

33、ommittee has decided that the contents of this publication will remain unchanged until 2005. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 4 60191-6-10 IEC:2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-10: General rules for

34、 the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON 1 Scope This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (herein

35、after called P-VSON). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC

36、60191(all parts), Mechanical standardization of semiconductor devices ISO/DIS 2692: Geometrical Product Specification (GPS) Geometrical tolerancing Maximum material requirement (MMR) and least material requirement (LMR) 3 Terms and definitions For the purposes of this document, the following definit

37、ion, as well as those given in other parts of the IEC 60191 series, apply. 3.1 P-VSON plastic very thin-profile small outline, flat package with no leads NOTE The package leads (terminals) are on opposite sides of the bottom of the package body and do not extend beyond the package body. 60191-6-10 I

38、EC:2003 5 Date: 2003 GENERAL RULES P-VSON Drawing of Plastic non-lead packages with two parallel rows of terminals 6 60191-6-10 IEC:2003 Date: 2003 GENERAL RULES P-VSON Drawing of Plastic non-lead packages with two parallel rows of terminals c 1c 60191-6-10 IEC:2003 7 Date: 2003 GENERAL RULES P-VSON

39、 Drawing of Plastic non-lead packages with two parallel rows of terminals 8 60191-6-10 IEC:2003 Table 1 Dimensions to be specified for Group 1 Group 1 Group 1 includes dimensions and numerals associated with mounting of packages and different kinds of packages. The dimensions and numerals belonging

40、to the group mean values is guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized. Name Ref. Limits to be observed Recommended values for the dimension mm Note Min. Nom. Max. Standard number of terminals n X See Table 3 9 Seated height A X A max= 1,0 S

41、tand-off height A 1X X 7 Body height A 2 X A 2 nom. = 0,75 Terminal width plated b X X e b min.b max. 1,25 0,55 0,70 1,00 0,55 0,70 0,80 0,35 0,50 0,65 0,30 0,45 0,50 0,25 0,40 0,40 0,15 0,25 7 Terminal thickness plated c X X cmin.cmax.0,09 0,25 Package length D X X X From 7,00 to 26,00 increment 1,

42、00 D max.= D nom. + 0,20 D min.= D nom. 0,20 Package width E X X X E nom.From 5,00 to 13,00 increment 1,00 E max.= E nom. + 0,20 E min.= E nom. 0,20 Terminal pitch e X( * ) e nom.=1,25;1,00; 0,80; 0,65; 0,50; 0,40 4 Overall width H EX X X H E = E + 2L 1 nom.A 1min.A 1 max. 0,00 0,05 60191-6-10 IEC:2

43、003 9 Table 1 (continued) Name Ref. Limits to be observed Recommended values for the dimension mm Note Min. Nom. Max. Length of solder part L X X Terminal position tolerance x X X max.= 0,05 3 Coplanarity y X y max.= 0,05 5 Flatness y 1 X y 1 max.= 0,10 . e Lmin.Lmax. 1,25 0,70 1,30 1,00 0,70 1,20 0

44、,80 0,50 0,90 0,65 0,40 0,80 0,50 0,35 0,75 0,40 0,35 0,75 10 60191-6-10 IEC:2003 Table 2 Dimensions to be specified for Group 2 Group 2 Group 2 includes dimensions that do not belong to Group 1, but are associated with fabrication of packages and dimensions of terminal position areas. The group is

45、to achieve its own original purpose as an industry standard. The group belongs to the dimensions and numerals of external shapes of packages useful for designers and manufacturers and the dimensions of terminal position areas that can be referenced in nominal design values specified thereto. Name Re

46、f. Limits to be observed Recommended values for the dimension mm Note Min. Nom. Max. Terminal width unplated b 1X X 7 Terminal position area in width b 2 X b 2 max. = b max. + x Terminal thickness unplated c 1X X c 1 min.c 1 max.0,09 0,21 Terminal length L 1 X L 1 nom. = 0,10 Terminal position area

47、in length l 1 X l 1 max.= Lmax.+ (H E max. H E min. )/2 Package overhang (Z D ) X Z D nom. b 1 nom. X 1,5 e b 1 min.b 1 max. 1,25 0,55 0,65 1,00 0,55 0,65 0,80 0,35 0,45 0,65 0,30 0,40 0,50 0,25 0,35 0,40 0,15 0,20 60191-6-10 IEC:2003 11 Table 3 Standard number of terminals D e 0,40 0,50 0,65 0,80 1

48、,00 1,25 n Z Dn Z Dn Z Dn Z Dn Z Dn Z D7,0 34 0,30 26 0,50 20 0,575 16 0,70 12 1,00 - - 8,0 38 0,40 30 0,50 22 0,75 18 0,80 14 1,00 10 1,50 9,0 42 0,30 34 0,50 26 0,60 20 0,90 16 1,00 12 1,375 10,0 46 0,40 38 0,50 28 0,775 24 0,60 18 1,00 14 1,25 11,0 50 0,30 42 0,50 32 0,625 26 0,70 20 1,00 12,0 54 0,40 46 0,50 34 0,80 28 0,80 22 1,00 13,0 58 0,30 50 0,50 38 0,65 30 0,90 24 1,00 18 1,50 14,0 62 0,40 54 0,50 40 0,825 34 0,60 26 1,00 20 1,375 15,0 66 0,30 58 0,50 44 0,675 36 0,70 28 1,00 22 1,25 16,0 70 0,40 62 0,50 48 0,525 38 0,80 30 1,00 24 1,125 17,0 74 0,30 66 0,50 5