IEC 60191-5-1997 Mechanical standardization of semiconductor devices - Part 5 Recommendations applying to integrated circuit packages using tape automated bondi.pdf
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1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 601915 Deuximedition Secondedition 199704 Numroderfrence Referencenumber CEI/IEC601915:1997 Normalisationmcanique desdispositifssemiconducteurs Partie5: Recommandationsapplicablesauxbotiers transfertautomatissurbande(TAB) descircuitsintgrs Mechanic
2、alstandardization ofsemiconductordevices Part5: Recommendationsapplyingtointegrated circuitpackagesusingtapeautomated bonding(TAB)Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIestcons tammentrevuparlaCEIafinquilreflteltatactuelde latechnique. Desrenseignementsrelatifsladatede
3、reconfirmationde lapublicationsontdisponiblesauprsduBureauCentralde laCEI. Lesrenseignementsrelatifscesrvisions,ltablis sementdesditionsrvisesetauxamendementspeuvent treobtenusauprsdesComitsnationauxdelaCEIet danslesdocumentscidessous: BulletindelaCEI AnnuairedelaCEI Publiannuellement Cataloguedespu
4、blicationsdelaCEI Publiannuellementetmisjourrgulirement Terminologie Encequiconcernelaterminologiegnrale,lelecteurse reporteralaCEI50:VocabulaireElectrotechniqueInter national(VEI),quiseprsentesousformedechapitres sparstraitantchacundunsujetdfini.Desdtails completssurleVEIpeuventtreobtenussurdemande
5、. VoirgalementledictionnairemultilinguedelaCEI. Lestermesetdfinitionsfigurantdanslaprsentepubli cationonttsoittirsduVEI,soitspcifiquement approuvsauxfinsdecettepublication. Symbolesgraphiquesetlittraux Pourlessymbolesgraphiques,lessymboleslittrauxetles signesdusagegnralapprouvsparlaCEI,lelecteur con
6、sultera: laCEI27: Symboleslittrauxutiliseren lectrotechnique; laCEI417: Symbolesgraphiquesutilisables surlematriel.Index,relevetcompilationdes feuillesindividuelles; laCEI617: Symbolesgraphiquespourschmas; etpourlesappareilslectromdicaux, laCEI878: Symbolesgraphiquespour quipementslectriquesenpratiq
7、uemdicale. Lessymbolesetsignescontenusdanslaprsentepubli cationonttsoittirsdelaCEI27,delaCEI417,dela CEI617et/oudelaCEI878,soitspcifiquementapprouvs auxfinsdecettepublication. PublicationsdelaCEItabliesparle mmecomitdtudes Lattentiondulecteurestattiresurleslistesfigurantlafin decettepublication,quin
8、umrentlespublicationsdela CEIprparesparlecomitdtudesquiatablila prsentepublication. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthecontent reflectscurrenttechnology. Informationrelatingtothedateofthereconfirmationofthe publicationi
9、savailablefromtheIECCentralOffice. Informationontherevisionwork,theissueofrevised editionsandamendmentsmaybeobtainedfromIEC NationalCommitteesandfromthefollowingIEC sources: IECBulletin IECYearbook Publishedyearly CatalogueofIECpublications Publishedyearlywithregularupdates Terminology Forgeneralter
10、minology,readersarereferredtoIEC50: InternationalElectrotechnicalVocabulary (IEV),whichis issuedintheformofseparatechapterseachdealing withaspecificfield.FulldetailsoftheIEVwillbe suppliedonrequest.SeealsotheIECMultilingual Dictionary. Thetermsanddefinitionscontainedinthepresentpubli cationhaveeithe
11、rbeentakenfromtheIEVorhavebeen specificallyapprovedforthepurposeofthispublication. Graphicalandlettersymbols Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersarereferredto publications: IEC27: Lettersymbolstobeusedinelectrical technology; IEC417: Graphicalsymbolsforu
12、seon equipment.Index,surveyandcompilationofthe singlesheets; IEC617: Graphicalsymbolsfordiagrams; andformedicalelectricalequipment, IEC878:Graphicalsymbolsforelectromedical equipmentinmedicalpractice. Thesymbolsandsignscontainedinthepresentpublication haveeitherbeentakenfromIEC27,IEC417,IEC617 and/o
13、rIEC878,orhavebeenspecificallyapprovedforthe purposeofthispublication. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesofthis publicationwhichlisttheIECpublicationsissuedbythe technicalcommitteewhichhaspreparedthepresent publication.NORME INTERNATIONALE C
14、EI IEC INTERNATIONAL STANDARD 601915 Deuximedition Secondedition 199704 Normalisationmcanique desdispositifssemiconducteurs Partie5: Recommandationsapplicablesauxbotiers transfertautomatissurbande(TAB) descircuitsintgrs Mechanicalstandardization ofsemiconductordevices Part5: Recommendationsapplyingt
15、ointegrated circuitpackagesusingtapeautomated bonding(TAB) W Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue CODEPRIX PRICECODE IEC1997Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteniut ilise sousquelqueformequecesoitetparaucunpro
16、cd,lectronique oumcanique,ycomprislaphotocopieetlesmicrofilms,sans laccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyanymeans,electronicormechanical,including photocopyingandmicrofilm,withoutpermissioninwritingfrom thepublisher. InternationalElectrotechnicalCommiss
17、ion 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission2 601915CEI:1997 SOMMAIRE Page AVANTPROPOS 4 INTRODUCTION . 6 Articles 1 Domainedapplication. 8 2 Termesetdfinitions
18、8 3 Descriptiondutransfertautomatiquesurbande(TAB) 10 4 Exigencesdimensionnelles. 10 4.1 Formatdufilm . 12 4.2 Lestrousdalignement. 12 4.3 Ladimensionducorps. 12 4.4 Motifsdesplotsdessai 14 4.5 Motifsdesconnexionsextrieures . 14 4.6 Nombremaximaldeconnexionsextrieures 14 5 Codesdevariation 16 6 Exig
19、encesrelativeslasoudureinterne(ILB)etlasoudureexterne(OLB) . 16 Figures .1 8 Tableaux . 30 Notesrelativesauxfiguresettableaux. 52 Annexes A RsumdesconfigurationsrecommandesdubotierTAB(formatsuper) 56 B RsumdesconfigurationsrecommandesdubotierTAB(formatwide) 58 C Numrotagedesconnexionsextrieures. 60
20、D Numrotagedesplotsdessai. 68601915IEC:1997 3 CONTENTS Page FOREWORD. 5 INTRODUCTION . 7 Clause 1 Scope. 9 2 Termsanddefinitions . 9 3 Descriptionoftapeautomatedbonding(TAB) . 11 4 Dimensionalrequirements 11 4.1 Filmformat 13 4.2 Alignmentholes . 13 4.3 Bodysize. 13 4.4 Testpadpatterns. 15 4.5 Outer
21、leadpatterns 15 4.6 Maximumleadcount 15 5 Variationcodes. 17 6 Requirementsforinnerandouterleadbonding(ILBandOLB) 17 Figures .1 9 Tables . 31 Notestofiguresandtables 53 Annexes A SummaryofrecommendedTABpackageconfigurations(superformat) 57 B SummaryofrecommendedTABpackageconfigurations(wideformat) 5
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