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麦多课文档分享 > 资源分类 > 标准规范 > 国际标准 > DIN

国际标准,IEC,ISO,IEEE,JIS,ANSI,AS,EU,BS,GOST,IEC,IEEE,ISA,JASO,JIS,NASM资源 (共33574 份)

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DIN EN 60749-8-2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 Sealing (IEC 60749-8 2002 + Corr 1 2003 + Corr 2 2003) German version EN 60749-8 2003《半导体器.pdf

下载积分： 10000 积分

DIN EN 60749-8-2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 Sealing (IEC 60749-8 2002 + Corr 1 2003 + Corr 2 2003) German version EN 60749-8 2003《半导体器.pdf

DIN EN 60749-7-2012 Semiconductor devices - Mechanical and climatic test methods - Part 7 Internal moisture content measurement and the analysis of other residual gases (IEC 60749-.pdf

下载积分： 10000 积分

DIN EN 60749-7-2012 Semiconductor devices - Mechanical and climatic test methods - Part 7 Internal moisture content measurement and the analysis of other residual gases (IEC 60749-.pdf

DIN EN 60749-6-2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 Storage at high temperature (IEC 60749-6 2017) German version EN 60749-6 2017《半导体器件机械和气候试.pdf

下载积分： 10000 积分

DIN EN 60749-6-2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 Storage at high temperature (IEC 60749-6 2017) German version EN 60749-6 2017《半导体器件机械和气候试.pdf

DIN EN 60749-44-2017 Semiconductor devices - Mechanical and climatic test methods - Part 44 Neutron beam irradiated single event effect (SEE) test method for semiconductor devices .pdf

下载积分： 10000 积分

DIN EN 60749-44-2017 Semiconductor devices - Mechanical and climatic test methods - Part 44 Neutron beam irradiated single event effect (SEE) test method for semiconductor devices .pdf

DIN EN 60749-42-2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage (IEC 60749-42 2014) German version EN 60749-42 2014《半导体.pdf

下载积分： 10000 积分

DIN EN 60749-42-2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage (IEC 60749-42 2014) German version EN 60749-42 2014《半导体.pdf

DIN EN 60749-40-2012 Semiconductor devices - Mechanical and climatic test methods - Part 40 Board level drop test method using a strain gauge (IEC 60749-40 2011) German version EN .pdf

下载积分： 10000 积分

DIN EN 60749-40-2012 Semiconductor devices - Mechanical and climatic test methods - Part 40 Board level drop test method using a strain gauge (IEC 60749-40 2011) German version EN .pdf

DIN EN 60749-4-2017 Semiconductor devices - Mechanical and climatic test methods - Part 4 Damp heat steady state highly accelerated stress test (HAST) (IEC 60749-4 2017) German ver.pdf

下载积分： 10000 积分

DIN EN 60749-4-2017 Semiconductor devices - Mechanical and climatic test methods - Part 4 Damp heat steady state highly accelerated stress test (HAST) (IEC 60749-4 2017) German ver.pdf

DIN EN 60749-39-2007 Semiconductor devices - Mechanical and climatic test methods - Part 39 Measurement of moisture diffusivity and water solubility in organic materials used for s.pdf

下载积分： 10000 积分

DIN EN 60749-39-2007 Semiconductor devices - Mechanical and climatic test methods - Part 39 Measurement of moisture diffusivity and water solubility in organic materials used for s.pdf

DIN EN 60749-38-2008 Semiconductor devices - Mechanical and climatic test methods - Part 38 Soft error test method for semiconductor devices with memory (IEC 60749-38 2008) German .pdf

下载积分： 10000 积分

DIN EN 60749-38-2008 Semiconductor devices - Mechanical and climatic test methods - Part 38 Soft error test method for semiconductor devices with memory (IEC 60749-38 2008) German .pdf

DIN EN 60749-37-2008 Semiconductor devices - Mechanical and climatic test methods - Part 37 Board level drop test method using an accelerometer (IEC 60749-37 2008) German version E.pdf

下载积分： 10000 积分

DIN EN 60749-37-2008 Semiconductor devices - Mechanical and climatic test methods - Part 37 Board level drop test method using an accelerometer (IEC 60749-37 2008) German version E.pdf

DIN EN 60749-36-2003 Semiconductor devices - Mechanical and climatic test methods - Part 36 Acceleration steady state (IEC 60749-36 2003) German version EN 60749-36 2003《半导体器件机械和气.pdf

下载积分： 10000 积分

DIN EN 60749-36-2003 Semiconductor devices - Mechanical and climatic test methods - Part 36 Acceleration steady state (IEC 60749-36 2003) German version EN 60749-36 2003《半导体器件机械和气.pdf

DIN EN 60749-35-2007 Semiconductor devices - Mechanical and climatic test methods - Part 35 Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35 2006) G.pdf

下载积分： 10000 积分

DIN EN 60749-35-2007 Semiconductor devices - Mechanical and climatic test methods - Part 35 Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35 2006) G.pdf

DIN EN 60749-34-2011 Semiconductor devices - Mechanical and climatic test methods - Part 34 Power cycling (IEC 60749-34 2010) German version EN 60749-34 2010《半导体器件机械和气候试验方法第34部分 .pdf

下载积分： 10000 积分

DIN EN 60749-34-2011 Semiconductor devices - Mechanical and climatic test methods - Part 34 Power cycling (IEC 60749-34 2010) German version EN 60749-34 2010《半导体器件机械和气候试验方法第34部分 .pdf

DIN EN 60749-33-2004 Semiconductor devices - Mechanical and climatic test methods - Part 33 Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33 2004) German version .pdf

下载积分： 10000 积分

DIN EN 60749-33-2004 Semiconductor devices - Mechanical and climatic test methods - Part 33 Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33 2004) German version .pdf

DIN EN 60749-32-2011 Semiconductor devices - Mechanical and climatic test methods - Part 32 Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32 2002 + C.pdf

下载积分： 10000 积分

DIN EN 60749-32-2011 Semiconductor devices - Mechanical and climatic test methods - Part 32 Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32 2002 + C.pdf

DIN EN 60749-31-2003 Semiconductor devices - Mechanical and climatic test methods - Part 31 Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31 2002 + C.pdf

下载积分： 10000 积分

DIN EN 60749-31-2003 Semiconductor devices - Mechanical and climatic test methods - Part 31 Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31 2002 + C.pdf

DIN EN 60749-30-2011 Semiconductor devices - Mechanical and climatic test methods - Part 30 Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC .pdf

下载积分： 10000 积分

DIN EN 60749-30-2011 Semiconductor devices - Mechanical and climatic test methods - Part 30 Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC .pdf

DIN EN 60749-29-2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 Latch-up test (IEC 60749-29 2011) German version EN 60749-29 2011《半导体设备机械及气候试验方法第29部分 .pdf

下载积分： 10000 积分

DIN EN 60749-29-2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 Latch-up test (IEC 60749-29 2011) German version EN 60749-29 2011《半导体设备机械及气候试验方法第29部分 .pdf

DIN EN 60749-27-2013 Semiconductor devices - Mechanical and climatic test methods - Part 27 Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27 200.pdf

下载积分： 10000 积分

DIN EN 60749-27-2013 Semiconductor devices - Mechanical and climatic test methods - Part 27 Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27 200.pdf

DIN EN 60749-25-2004 Semiconductor devices - Mechanical and climatic test methods - Part 25 Temperature cycling (IEC 60749-25 2003) German version EN 60749-25 2003《半导体器件机械和气候试验方法 .pdf

下载积分： 10000 积分

DIN EN 60749-25-2004 Semiconductor devices - Mechanical and climatic test methods - Part 25 Temperature cycling (IEC 60749-25 2003) German version EN 60749-25 2003《半导体器件机械和气候试验方法 .pdf

DIN EN 60749-24-2004 Semiconductor devices - Mechanical and climatic test methods - Part 24 Accelerated moisture resistance - Unbiased HAST (IEC 60749-24 2004) German version EN 60.pdf

下载积分： 10000 积分

DIN EN 60749-24-2004 Semiconductor devices - Mechanical and climatic test methods - Part 24 Accelerated moisture resistance - Unbiased HAST (IEC 60749-24 2004) German version EN 60.pdf

DIN EN 60749-23-2011 Semiconductor devices - Mechanical and climatic test methods - Part 23 High temperature operating life (IEC 60749-23 2004 + A1 2011) German version EN 60749-23.pdf

下载积分： 10000 积分

DIN EN 60749-23-2011 Semiconductor devices - Mechanical and climatic test methods - Part 23 High temperature operating life (IEC 60749-23 2004 + A1 2011) German version EN 60749-23.pdf

DIN EN 60749-22-2003 Semiconductor devices - Mechanical and climatic test methods - Part 22 Bond strength (IEC 60749-22 200 + Corr 1 2003) German version EN 60749-22 2003《半导体器件机械和.pdf

下载积分： 10000 积分

DIN EN 60749-22-2003 Semiconductor devices - Mechanical and climatic test methods - Part 22 Bond strength (IEC 60749-22 200 + Corr 1 2003) German version EN 60749-22 2003《半导体器件机械和.pdf

DIN EN 60749-21-2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 Solderability (IEC 60749-21 2011) German version EN 60749-21 2011《半导体设备机械和气候试验方法第21部分 .pdf

下载积分： 10000 积分

DIN EN 60749-21-2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 Solderability (IEC 60749-21 2011) German version EN 60749-21 2011《半导体设备机械和气候试验方法第21部分 .pdf

DIN EN 60749-20-2010 Semiconductor devices - Mechanical and climatic test methods - Part 20 Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering.pdf

下载积分： 10000 积分

DIN EN 60749-20-2010 Semiconductor devices - Mechanical and climatic test methods - Part 20 Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering.pdf

DIN EN 60749-20-1-2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1 Handling packing labelling and shipping of surface-mount devices sensitive to the co.pdf

下载积分： 10000 积分

DIN EN 60749-20-1-2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1 Handling packing labelling and shipping of surface-mount devices sensitive to the co.pdf

DIN EN 60749-2-2003 Semiconductor devices - Mechanical and climatic test methods - Part 2 Low air pressure (IEC 60749-2 2002) German version EN 60749-2 2002《半导体器件机械和气候试验方法第2部分低气.pdf

下载积分： 10000 积分

DIN EN 60749-2-2003 Semiconductor devices - Mechanical and climatic test methods - Part 2 Low air pressure (IEC 60749-2 2002) German version EN 60749-2 2002《半导体器件机械和气候试验方法第2部分低气.pdf

DIN EN 60749-19-2011 Semiconductor devices - Mechanical and climatic test methods - Part 19 Die shear strength (IEC 60749-19 2003 + A1 2010) German version EN 60749-19 2003 + A1 20.pdf

下载积分： 10000 积分

DIN EN 60749-19-2011 Semiconductor devices - Mechanical and climatic test methods - Part 19 Die shear strength (IEC 60749-19 2003 + A1 2010) German version EN 60749-19 2003 + A1 20.pdf

DIN EN 60749-18-2003 Semiconductor devices - Mechanical and climatic test methods - Part 18 Ionizing radiation (total dose) (IEC 60749-18 2002) German version EN 60749-18 2003《半导体器.pdf

下载积分： 10000 积分

DIN EN 60749-18-2003 Semiconductor devices - Mechanical and climatic test methods - Part 18 Ionizing radiation (total dose) (IEC 60749-18 2002) German version EN 60749-18 2003《半导体器.pdf

DIN EN 60749-17-2003 Semiconductor devices - Mechanical and climatic test methods - Part 17 Neutron irradiation (IEC 60749-17 2003) German version EN 60749-17 2003《半导体器件机械和气候试验方法 .pdf

下载积分： 10000 积分

DIN EN 60749-17-2003 Semiconductor devices - Mechanical and climatic test methods - Part 17 Neutron irradiation (IEC 60749-17 2003) German version EN 60749-17 2003《半导体器件机械和气候试验方法 .pdf

DIN EN 60749-16-2003 Semiconductor devices - Mechanical and climatic test methods - Part 16 Particle impact noise detection (PIND) (IEC 60749-16 2003) German version EN 60749-16 20.pdf

下载积分： 10000 积分

DIN EN 60749-16-2003 Semiconductor devices - Mechanical and climatic test methods - Part 16 Particle impact noise detection (PIND) (IEC 60749-16 2003) German version EN 60749-16 20.pdf

DIN EN 60749-15-2011 Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15 2010).pdf

下载积分： 10000 积分

DIN EN 60749-15-2011 Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15 2010).pdf

DIN EN 60749-14-2004 Semiconductor devices - Mechanical and climatic test methods - Part 14 Robustness of terminations (lead integrity) (IEC 60749-14 2003) German version EN 60749-.pdf

下载积分： 10000 积分

DIN EN 60749-14-2004 Semiconductor devices - Mechanical and climatic test methods - Part 14 Robustness of terminations (lead integrity) (IEC 60749-14 2003) German version EN 60749-.pdf

DIN EN 60749-13-2003 Semiconductor devices - Mechanical and climatic test methods - Part 13 Salt atmosphere (IEC 60749-13 2002) German version EN 60749-13 2002《半导体器件机械和气候试验方法第13部.pdf

下载积分： 10000 积分

DIN EN 60749-13-2003 Semiconductor devices - Mechanical and climatic test methods - Part 13 Salt atmosphere (IEC 60749-13 2002) German version EN 60749-13 2002《半导体器件机械和气候试验方法第13部.pdf

DIN EN 60749-11-2003 Semiconductor devices - Mechanical and climatic test methods - Part 11 Rapid change of temperature Two-fluid-bath method (IEC 60749-11 2002) German version EN .pdf

下载积分： 10000 积分

DIN EN 60749-11-2003 Semiconductor devices - Mechanical and climatic test methods - Part 11 Rapid change of temperature Two-fluid-bath method (IEC 60749-11 2002) German version EN .pdf

DIN EN 60749-10-2003 Semiconductor devices - Mechanical and climatic test methods - Part 10 Mechanical shock (IEC 60749-10 2002) German version EN 60749-10 2002《半导体器件机械和气候试验方法第10.pdf

下载积分： 10000 积分

DIN EN 60749-10-2003 Semiconductor devices - Mechanical and climatic test methods - Part 10 Mechanical shock (IEC 60749-10 2002) German version EN 60749-10 2002《半导体器件机械和气候试验方法第10.pdf

DIN EN 60749-1-2003 Semiconductor devices - Mechanical and climatic test methods - Part 1 General (IEC 60749-1 2002 + Corr 1 2003) German version EN 60749-1 2003《半导体器件机械和气候试验方法第1.pdf

下载积分： 10000 积分

DIN EN 60749-1-2003 Semiconductor devices - Mechanical and climatic test methods - Part 1 General (IEC 60749-1 2002 + Corr 1 2003) German version EN 60749-1 2003《半导体器件机械和气候试验方法第1.pdf

DIN EN 60747-5-3-2003 Discrete semiconductor devices and integrated circuits - Part 5-3 Optoelectronic devices Measuring methods (IEC 60747-5-3 1997 + A1 2002) German version EN 60.pdf

下载积分： 10000 积分

DIN EN 60747-5-3-2003 Discrete semiconductor devices and integrated circuits - Part 5-3 Optoelectronic devices Measuring methods (IEC 60747-5-3 1997 + A1 2002) German version EN 60.pdf

DIN EN 60747-5-2-2003 Discrete semiconductor devices and integrated circuits - Part 5-2 Optoelectronic devices Essential ratings and characteristics (IEC 60747-5-2 1997 + A1 2002) .pdf

下载积分： 10000 积分

DIN EN 60747-5-2-2003 Discrete semiconductor devices and integrated circuits - Part 5-2 Optoelectronic devices Essential ratings and characteristics (IEC 60747-5-2 1997 + A1 2002) .pdf

DIN EN 60747-5-1-2003 Discrete semiconductor devices and integrated circuits - Part 5-1 Optoelectronic devices General (IEC 60747-5-1 1997 + A1 2001 + A2 2002) German version EN 60.pdf

下载积分： 10000 积分

DIN EN 60747-5-1-2003 Discrete semiconductor devices and integrated circuits - Part 5-1 Optoelectronic devices General (IEC 60747-5-1 1997 + A1 2001 + A2 2002) German version EN 60.pdf

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