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1、 A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Kenneth Rice COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY Michael Frye DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-11-19 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD PROGRAMMABLE GATE ARRAY, 4000 GATES, MONOLITHIC SILICON 。

2、Added device type 03. Editorial changes throughout document. 95-09-26 M. A. Frye D Changes in accordance with NOR 5962-R007-97 96-10-04 Ray Monnin E Update drawing to current requirements. Editorial changes throughout. - gap 02-03-15 Ray Monnin REV SHET REV E E E E E E E E E E E E E E E E E E E E SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY 。

3、rawn with changes. Added devices 03 and 04. Changes to paragraph 4.2.1. Changes to table I and table IIA. Changed the max lead thickness on case outline Z. 93-09-10 M.A. Frye D Added case outlines U and T. Made format changes, editorial changes throughout. 94-01-27 M.A. Frye E Changes in accordance with NOR 5962-R198-95. 95-10-05 M.A. Frye F Changes in accordance with NOR 5962-R005-97. 96-10-04 Raymond Monnin G Updated drawing to current requirements. Editorial changes throughout. - gap 01-11-09。

4、AILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A *=+TtT+T SHEET PREPARED BY KENNETH RICE CHECKED BY JEFF BOWLING APPROVED BY MICHAEL FRYE DRAWING APPROVAL DATE 95 - 06- 23 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, MEMORY, DIGITAL, CMOS 8000 GATE CONFIGURABLE LOGIC ARRAY, MONOLITHIC SILICON SIZE ICICE CODE 5962-94634 A 67268 I SHEET 1 OF 22 )ESC FORM 193 JUL 94 DISTRIBUTION STATEMENT A. Approved for public release; distr。

5、ints of BGA and LGA and measurement methodsBS EN 61191-6:2010National forewordThis British Standard is the UK implementation of EN 61191-6:2010. It isidentical to IEC 61191-6:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsib。

6、embles de cartes imprimes Partie 6: Critres dvaluation des vides dans les joints brass des botiers BGA et LGA et mthode de mesure IEC61191-6:2010 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2010 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without p。

7、0g3g38g50g51g60g53g44g42g43g55g3g47g36g58devices Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGAThe European Standard EN 60191-6-16:2007 has the status of a British StandardICS 31.080.01Mechanical standardization of semiconductor BRITISH STANDARDBS EN 60191-6-16:2007BS EN 60191-6-16:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007ISBN 978 0 580 55248 9Amendments is。

8、ints of BGA and LGA and measurement methodsBS EN 61191-6:2010National forewordThis British Standard is the UK implementation of EN 61191-6:2010. It isidentical to IEC 61191-6:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsib。