NAVY MIL-T-81955-1973 TIN PLATING IMMERSION FOR COPPER AND COPPER ALLOYS《铜及铜合金浸染镀锡钢片》.pdf
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1、II 3 MIL-T-81955 PlF I 97779Ob 0460550 5 = MILJTARY SPECIFICATION MIL-T-81955 (AS) 15 November 1973 SUPERSEDING AS 1131 A 26 February1968 TIN PLATING; IMMERSION FOR COPPER AND COPPER ALLOYS This specification is approved for use by the Nava Air Systems Command, Department of the Navy. 1. SCOPE 1.1 S
2、cope. This specification covers the requirements for tin plating deposited by immersion, without an external potential, on copper and copper alloys. 1.2 Classification, 12.1 Classes, Deposited tin plating shall be of the following classes as specified (see 6.2): Class 1 - 0.000076 to 0.0001 inch thi
3、ck Class 2 - 0.000051 to 0.000075 inch thick Class 3 - O. 000026 to O. 000050 inch thick Class 4 - 0.000025 inch or less thick 2. APPLICABLE DOCUMENTS 2.1 tion for bids or request for proposal, forni a part of this specification to the extent specified herein. The following documents of the issue in
4、 effect on date of invita- SPECIFIC ATIONS Federal 0-T-634 QQ-S-57 1 Trichloroethylene, Technical Solder, Tin-Alloy : Tin-Lead Alloy; and Lead Alloy Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_- I_- MIL-T-3755 MF 777770b 0460553 7 W MTL-T-81.955
5、 (AS) SPECIFICATIONS Military I MIL-T-81533 STANDARDS Feder al I 1, 1, 1 Trichloroethane (Methyl Chloroform) Inhibited, Vapor Dogreasing Fed. Test Method Std. No, 151 Metals; Test Methods Military MIL-STD-10 5 Sampling Procedures and Tables for inspection by Attributes t F MI L-STD- 13 1 2 Fasteners
6、, Test Methods (Copies of specifications, standards, and publications required by supplie 1:s in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer. ) 2.2 Other publications. The following documents form a part of t
7、his specification to the extent specified herein. Unless otherwise indicated, the issue in effect on date of invitation for bids or request f.or proposal shall apply. American Society for Testing and Materials (ASTM) Standards Determination of Tin Coating Weights for Hot-Dip and Electrolytic Tin Pla
8、te A 630 B 487 B 499 B 504 Measuring Metal and Oxide Coating Thickness by Microscopical Examination of a Cross Section Method for Measurement of Coating Thickness by the Magnetic Method: Nonmagnetic Coatings on Magnetic Basis Metals Measuring the Thickness of Metallic Coatings by the Coulometric Met
9、hod 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-T-81755 MF m 9779706 0460552 9 H i American Society for Testing and Materials (ASTM) Standards (Continued) B 567 Test for Coating Thickness by the Beta Backscatter Principle B 568 Test for Coa
10、ting Thickness by X-Ray Spectrometry (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA 19103.) 3. REQULREMENTS 3.1 Materials. The materials used shall be such as to produce tin plating which meets the requirements of thi
11、s specification. - 3.2 Composition. The composition of the plating, deposited on the CleaninP. The basis metd shall be cleaned, pickled or other- basis metal surface, shall not be less than 99 percent tin. 3.3 wise pretreated by methods which shall not damage the substrate and shall not interfere wi
12、th the adhesion of the deposit (see 6.3). 3.4 Plating application, Unless otherwise specified (see 6.2), the plating shall be applied after all basis metal heat treatments and mechanical opera- tions, such as machining, soldering, brazing, welding, forming and perforating of the article have been co
13、mpleted. The tin plating shall be deposited from a bath solution onto the copper or copper alloy surface under the influence of the potential that exists between the solution and the immersed basis metal. 3.5 Coverwe. Unless otherwise specified, the plating shall cover all surfaces including roots o
14、f threads, corners and recesses (see 6.2). 3.6 Thickness. Unless otherwise specified (see 6.2), the thickness range of tin, as specified in- the contract, purchase order or applicable drawing, on significant surfaces for eaih class of plating shall be as detailed in Table I. Significant surfaces sha
15、ll be all surfaces of the article which can be tuched by a sphere O. 75 inch (19 mm) in diameter pius additional functional surfaces specified (see 6.2). Sur- faces on which the specified thickness cannot readily be controlled, such as holes, deep recesses, bases of angles, and internal threads from
16、 which the external environ- ment is completely excluded and where a controlled deposit cannot be normally obtained, shaii not be subjected to a thickness requirement. However, the plating on such sur- faces shall be of sufficient thickness to ensure coating continuity and uniform appear- ance. 3 Pr
17、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-VIL-T-BL755 VF W 7777906 O460553 O MIL-T-819 5 5 ( AS) Microinches (millionths of an inch) Class 3 Micromctrcs (approx. ) equivalent thickness I/ TABLE I THICKNESS Inch O, 00007G to O, O00100 O, O00051 to
18、 O. 000075 O. 000026 to O. 000050 0.000025 or less 76 to 100 51 to75 26 to 50 25 or less 1.92 - 2.54 1.28 - 1.91 0.64 - I. 27 0.63 or less I/ O. 0001 inch = O. 1 mil = 100 microinches = 2.54 3.7 Adhesion. The adhesion of the plating shall be such that when examined at a magnification of approximatel
19、y 10 diameters, the plating shall not show separation from the basis metal at the interface when subject to the tests described in 4.5.3. The ,interface between the tin plating and the basis metal is the surface of the basis metal before plating. The formation of cracks in the plating caused by rupt
20、Ure of the basis metal which does not result in flaking, peeling, or blistering of the coating shall not be considered as nonconformance to this require- ment. 3, a Solderability. Plated specimens or parts shall be easily and completed coated with solder when tested as specified in 4.5.4. The solder
21、 shall be deposited uniformly without lumps or peaks and shall be essentially free from evidence of bubbling, foaming, voids and other defects. The solder shall firmly adhere to the plating and the plating shall be firmly adherent to the basis metal. There shall be no separation at the solder-platin
22、g interface or at the plating-basis metal interface, so that they cannot be lifted when a sharp-edge instrument is applied. 3.9 W or kmans hip. 3.9.1 Basis metal, The basis metal shall be free from visible defects which will be detrimental to the appearance or protective value of the plating. 3.9.2
23、Plating. The tin plating shall be smooth, adherent, continuous, free from visible blisters, pits, nodules, porosity, excessive build-up, staining and other defects. The size and number of contact marks shall be at a minimum consistent witl. qoAd practice. The location of contact marks shall be in ar
24、eas of minimum exposure to service environmental conditions where important to the function of the part. t 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4 MIL-T-1755 MF U 747730b 04b0554 2 Superficial staining which has been demonstratedas result
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