KS C IEC 62137-1-2-2009 Surface mounting technology-Environmental and endurance test methods for surface mount solder joint-Part 1-2 Shear strength test《表面安装技术 表面装配焊接接缝的环境和耐久性试验方法 .pdf

《KS C IEC 62137-1-2-2009 Surface mounting technology-Environmental and endurance test methods for surface mount solder joint-Part 1-2 Shear strength test《表面安装技术 表面装配焊接接缝的环境和耐久性试验方法 .pdf》由会员分享，可在线阅读，更多相关《KS C IEC 62137-1-2-2009 Surface mounting technology-Environmental and endurance test methods for surface mount solder joint-Part 1-2 Shear strength test《表面安装技术 表面装配焊接接缝的环境和耐久性试验方法 .pdf（18页珍藏版）》请在麦多课文档分享上搜索。

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2、2 1 3 .2 4 2 5 3 5.1 3 5.2 3 5.3 3 5.4 (SEM) 3 5.5 .3 5.6 .4 5.7 4 5.8 4 6 4 7 .5 7.1 : .5 7.2 5 8 .5 8.1 5 8.2 .6 8.3 .6 8.4 .6 8.5 .6 8.6 / .6 9 .6 10 .7 A ( ) 10 A.1 .10 A.2 .10 KS C IEC 62137 1 2:2009 12 KS C IEC 62137 1 2:2009 ii . , , . , , . KS C IEC 62137 1 2:2009 1 2： Surface mounting techn

3、ology Environmental and endurance test methods for surface mount solder joint Part 1 2： Shear strength test 2007 1 IEC 621371-2, Surface mounting technologyEnvironmental and endurance test methods for surface mount solder jointPart 1-2: Shear strength test . 1 IEC 62137 IEC 61190 , . . (gull-wing :

4、) . . . 2 . . ( ) . KS C IEC 600681, 1： KS C IEC 60194, , KS C IEC 611885-2, 5-2：(/) KS C IEC 617601, 1：(SMD) KS C IEC 611885-5, 5-5：(/) - KS C IEC 62137 1 2:2009 2 KS C IEC 612492-7, 2-7： E , () KS C IEC 611901-1, 1-1： KS C IEC 611901-2, 1-2： KS C IEC 611901-3, 1-3： IEC 600682-14, 2-14： N： 3 . KS C

5、 IEC 60194 KS C IEC 60068 1 . 3.1 SMD , 3.2 . . 3.3 4 , . . , , . . . 1 . 2 KS C IEC 60068 2-21 . 1 . (QFN, LGA ) . 2 . KS C IEC 62137 1 2:2009 3 1 5 5.1 . . , . . . 5.2 . . ( A.2 ). 5.3 50250 . 2 000 . 5.4 (SEM) SEM 310 nm (vacuum chamber) . SEM 2 CRT . 5.5 2 . SMD KS C IEC 62137 1 2:2009 4 5.6 ()

6、. a) : , (KS C IEC 61249 2-7), . , 0.20 mm 1.6 mm . (0.0350.010) mm . b) : . . c) : KS C IEC 61188 5-5 . KS C IEC 61188 5-5 , . (toe) : (heel) : (side) : d) : () ：(OSP) . 6.2 . 5.7 Sn, Ag, Cu 3 . Ag 3.0 % 4.0 %, Cu 0.5 % 1.0 % SnAg3.0Cu0.5 . KS C IEC 611901-3 . 5.8 KS C IEC 611901-2 . 5.7 . 6 . a) 5

7、.8 5.6 . 100 m150 m , . b) . c) 5.5 . KS C IEC 617601 2 . . KS C IEC 62137 1 2:2009 5 : ( ) : , ( ). ( ) 2 7 7.1 : . a) : IEC 60068 2-14 Na b) (TA) 40 , (TB) 125 . c) 30 . d) 500( ) 1 000( ) . 7.2 A . 8 8.1 5 . . 6 k/s 3 k/s KS C IEC 62137 1 2:2009 6 3 8.2 . 4 (KS C IEC 600681). 8.3 8.2 7.2 . ( 4 6)

8、 . 8.4 7.1 . 8.5 4 (KS C IEC 600681). 8.6 / 7.2 . ( 4 6) . 9 a) b) c) , , , d) e) f) , g) h) , (8.2) (6) (8.3) (500) (7.1) (1 000)(7.1) (8.5) (8.5) (8.6) (8.6) KS C IEC 62137 1 2:2009 7 i) j) ( ) k) l) m) n) o) p) q) r) 10 . a) (5.1) b) (5.2) c) (5.6) d) (5.7) e) (5.8) f) (6.) g) (7.1) h) (7.2) i) (

9、8.1) j) (8.2) k) (8.3) l) / (8.6) KS C IEC 62137 1 2:2009 8 1A 1B 2 3 4 5 4 (5 ) (Tantalum capacitor) 1A 1B 2 3 4 5 5 (2 ) KS C IEC 62137 1 2:2009 9 (Switch) 1A 1B 2 3 4 5 6 ( ) KS C IEC 62137 1 2:2009 10 A ( ) A.1 A 7.2 . A.2 A.2.1 8.2 A.2.2 A.1 . . A.2.3 A.2.3.1 A.2 , . ( ) . , 1/4 ( A.2). . A.2.3

10、.2 . . . 1 0.5 mm SOIC, TSOP, QFP 0.0083 mm/ (0.5 mm/ ) . 2 , . . 0.008 3 mm/s(0.5 mm/min) . 0.008 3 mm/s(0.5 mm/min) 10 1/ , . A.2.3.3 KS C IEC 62137 1 2:2009 11 () . A.2.3 . . . A.2.3.4 . . . A.1 A.2 ( ) (4 ) ： H H/4 WdW1 WdKS C IEC 62137 1 2:2009 12 KS C IEC 62137 1 2:2009 . 1 1.1 (IEC) (KS) . (W

11、TO/TBT ) , IEC 62137 1-2 , (KS A 0001 : 2008) . 2 (TC) 2.1 : TC 91( ) . 2.2 IEC 62137 1-2 KS C IEC 62137 1-2 . 3 3.1 , . / (,) / (.) . 3.2 . 4 . , (www.standard.go.kr ) . . 5 . 12： 153787 1 92 3(13) (02)26240114 (02)262401489 http:/ Korean Agency for Technology and Standards http:/www.kats.go.kr KS C IEC 62137 1 2:2009 KSKSKS SKSKS KSKS SKS KS SKS KSKS SKSKS KSKSKS Surface mounting technology Environmental and endurance test methods for surface mount solder jointPart 12：Shear strength test ICS 31.190