JEDEC JESD22-A121A-2008 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.pdf
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1、JEDEC STANDARD Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes JESD22-A121A (Revision of JESD22-A121.01, December 2005) JULY 2008 (Reaffirmed: MAY 2014) JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prep
2、ared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitati
3、ng interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are a
4、dopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information
5、 included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and
6、ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address bel
7、ow, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2012 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyri
8、ght on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. Fo
9、r information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A121A -i- Test method A121A (Revision of A121.01) TEST METHOD A121 Test Me
10、thod For Measuring Whisker Growth On Tin And Tin Alloy Surface Finishes Disclaimer This document is not a qualification standard. It contains a suite of recommended tin whisker growth tests. If these common tests are adopted, then the industry can collect common and comparable data that may improve
11、the understanding of the fundamentals of whisker growth and allows comparisons between technologies. Tests in this document may be changed in the future as a better understanding of the mechanisms causing tin whisker growth is developed. Based on a variety of testing and data review from around the
12、globe, three test conditions have been identified that appear to be suitable for monitoring tin whisker growth. The three test conditions include two isothermal conditions with controlled humidity and a thermal cycling condition. However, these test conditions have not been correlated with longer en
13、vironmental exposures of components in service. Thus, there is at present no way to quantitatively predict whisker lengths over long time periods based on the lengths measured in the short-term tests described in this document. At the time of writing, the fundamental mechanisms of tin whisker growth
14、 are not fully understood and acceleration factors have not been established. However until such time that acceleration factors are determined all acceptance requirements for commercial tin finishes are provided in JEDEC standard JESD201. Certain applications, e.g., military or aerospace, may requir
15、e additional and/or different tin whisker tests or evaluations. Introduction The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys
16、 of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts. JEDEC Standard No. 22-A1
17、21A Test method A121A -ii- (Revision of A121.01) JEDEC Standard No. 22-A121A Page 1 Test method A121A (Revision of A121.01) TEST METHOD A121 Test Method For Measuring Whisker Growth On Tin And Tin Alloy Surface Finishes (From JEDEC Board ballot JCB-08-42, formulated under the cognizance of the JC-14
18、.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applicati
19、ons with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document. The purpose of this standard is to: Provide an industry-standardized suite of tests for measurement and comparison of whisker propensity for different platin
20、g or finish chemistries and processes. Provide a consistent inspection protocol for tin whisker examination. Provide a standard reporting format. 2 Normative references JESD22-A104, Standard for Temperature Cycling IPC 7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow they can be
21、 kinked, bent, or twisted; they usually have a uniform cross-sectional shape; they typically consist of a single columnar filament that rarely branches; they may have striations along the length of the column and/or rings around the circumference of the column; they have lengths of 10 micrometers or
22、 greater; features shorter than 10 micrometers may be deemed important for research but are not considered significant in JESD22-A121A. NOTE 2 Whiskers are not to be confused with dendrites: fern-like growths on the surface of a material, which can be formed as a result of electrochemical migration
23、of an ionic species or produced during solidification. 3.3 whisker density: The number of whiskers per unit area on a single lead or coupon area. 3.4 whisker growth: Measurable changes in whisker length and/or whisker density after exposure to a whisker test condition for a certain duration or numbe
24、r of cycles. 3.5 whisker length: The straight line distance from the point of emergence of the whisker to the most distant point on the whisker (i.e., the radius of a sphere containing the whisker with its center located at the point of emergence), see Figure 5 3.6 whisker test coupon: A piece of me
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