GEIA-STD-0006-2008 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts《利用浸焊替代电子单一零件整饰的要求》.pdf

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1、ANSI/GEIA-STD-0006-2008 Approved: October 14, 2008 ITAA STANDARD GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts GEIA-STD-0006 July 2008 INFORMATION TECHNOLOGY ASSOCIATION OF AMERICA Copyright Government Electronics solder dipping for purposes other th

2、an full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriat

3、e requirements for hand-dipping for tin whisker mitigation at this time. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by any other group, including a third party supplier, production facilities at the

4、 supplier and other organizations, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. The intent of this standard is for suppliers and users to incorporate these requirements into their operations to provide a consistent and well-controlled process for produc

5、t applications that require significant control, typically Control Levels 2C or 3 of GEIA-STD-0005-2. Each user shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability

6、of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard, and should be specified separately. Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished

7、for the purposes of GEIA-STD-0005-2. 2 References 2.1 Normative References IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies IPC/EIA J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications

8、J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices J-STD-004 Requirements for Soldering Fluxes JESD22-B101 External Visual JESD22-B102 Solderability JESD22-A101 Steady-State Temperature Humidity Bias Life Test JESD22-A104 Temperature Cycling JESD46 Custo

9、mer Notification of Product Process Changes by Semiconductor Suppliers MIL-STD-883 Test Method Standard Microcircuits 1 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license

10、from IHS-,-,-GEIA-STD-0006 ASTM B487 Standard Test Method for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of a Cross Section ASTM B568 Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry IPC-TM-650-2.3.25 Detection and Measurement of Ioni

11、zable Surface Contaminants by Resistivity of Solvent Extract (ROSE) J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires ANSI/NCSL Z540-1 Calibration Laborator

12、ies and Measuring and Test Equipment ISO 10012 Measurement Management Systems - Requirements for Measurement Processes and Measuring Equipment EIA-595 Visual and Mechanical Inspection: Multilayer Ceramic Chip Capacitors EIA-469 Standard Test Method for Destructive Physical Analysis of Ceramic Monoli

13、thic Capacitors J-STD-075 Classification for Non-IC Electronic Components for Assembly Processes 2.2 Informative References GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems MIL-PRF-38534 General Specification for Hybrid Microcir

14、cuits MIL-PRF-38535 General Specification for Integrated Circuits (Microcircuits) MIL-PRF-19500 General Specification for Semiconductor Devices FED-STD-595 Colors Used in Government Procurement J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-free and Other Attr

15、ibutes 3 Definitions and Acronyms Approved category. A category as listed in Table 1. Approved piece part. A piece part that can meet a category definition listed in Table 1. Corrosion. The deterioration of a metal by a chemical or electro-chemical reaction with its environment. Customer. The person

16、 or organization requesting to have piece parts solder dipped. Dross. Oxide formed on the surface of solder, whether in still solder pots or wave soldering machines. ESD. Electrostatic Discharge 2 Copyright Government Electronics & Information Technology Association Provided by IHS under license wit

17、h GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-STD-0006 Flux. A material which reduces the oxides on the surface of solder, whether from a solder pot or a piece part. It also displaces oxygen on the surface of the solder, thereby preventing re-oxidatio

18、n. Ionic Contamination. Any foreign material such as salts, acids, inorganic materials and organic residues, which conduct electricity in the presence of moisture. Lot. A group of piece parts processed under the same manufacturing and inspection specifications and procedures, manufactured with the s

19、ame type of equipment, and processed at the same time as one entity. MSDS. Material Safety Data Sheets MLC. Multilayer Chip Capacitor MSL. Moisture Sensitivity Level as per J-STD-020. Semi-automatic. A process capable of controlling the rates of immersion and emersion of the terminations and providi

20、ng a dwell time (time of total immersion to the required depth) in the solder bath. The piece part may be moved through refinishing steps by an operator, but some kind of mechanical, electrical, or other dipping apparatus controls piece part immersion rate, depth, and extraction rate for the dipping

21、 itself. Purely manual dipping is not covered by this definition and is beyond the scope of this document. Original Supplier. Original manufacturer of the piece part to be dipped. Product Lot. One lot of Qualified Piece parts undergoing solder dip. Qualified Piece part. An Approved Piece part that h

22、as been qualified with a solder dip service suppliers dipping process. Qualification Lot. One lot of Approved Piece parts undergoing qualification, but are not yet qualified. Pb-free Tin. Pure tin or any tin alloy with 25 mil pitch 200 ASTM B487:YES ASTM B568:NO 0 500 Ionic Cleanliness IPC-TM-650-2.

23、3.25 For ionic cleanliness testing limit 1.5 microgram/centimeter square or 10 micrograms/square inch. At least one square inch of piece parts area is needed for testing. NO 0 600 Solderability Piece parts shall meet the solderability requirements of J-STD-002. YES 0 800 Temperature Cycling + Electr

24、ical Category 1 and Category 3 Piece parts (See Table 1). As applicable: MIL-PRF-38534 or MIL-PRF-38535 100 cycle min -65oC to +150oC (Notes: 38534 App C, Table C-Xc Grp C) TEST = Room temperature pre+post-stress OR MIL-PRF-19500 500 cycles min -55oC to +175oC (Notes: 19500 App E Table E-IX Grp E in

25、spections all quality levels = 500 cycles min) TEST = Room temperature pre+post-stress Category 2 Piece parts (See Table 1) MIL-PRF-19500 EIA JESD22-A104 500 cycles 65oC to +150oC or 1000 Cycles 55oC to +175oC TEST = Room temperature pre+post-stress Test Method 200 is required after thermal cycling.

26、 YES 0 900 THB + Electrical EIA JESD22-A101 1000 hours +85 C / 85% RH TEST = Room temperature pre+post-stress YES 0 1000 DPA (for piece part class 3) EIA-595 for multilayer chip capacitors. EIA-469 for other devices YES 0 14 Copyright Government Electronics & Information Technology Association Provi

27、ded by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-STD-0006 15 Annex A Bibliography 1 “Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process,” S. Sengupta, D. Das, S. Gane

28、san, W. Rollins, D. Pinsky, T. Lin and M. Pecht. IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 128-137, April, 2007. 2 “Challenges in Modification of Electronic Components,”R.T. Winslow. IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 356

29、-358, June 2007. 3 “Effects of re-finishing of terminations by solder-dipping on plastic quad flatpack electronic parts,” S. Sengupta, D. Das, S. Ganesan, and M. Pecht, . Proc. EPTC Annu. Conf., Singapore, Dec. 2005, pp. 16. 4 “Hot solder dip and minimizing thermal gradients,” R. Winslow, G. Iyer, M

30、. Cruz, and G. Selvaduray. Proc. Int. Microelectron. Packag.Soc. Conf., San Diego, CA, Oct. 2006, pp. 513520. 5 “Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation, The Use of Robotic Solder Dipping to Replace Electr

31、onic Part Surfaces Finishes of Pure Tin with a Tin-Lead Finish” Prepared for the Office of Naval Research Manufacturing Technology Program. (FINAL DRAFT) 6 “A Robotic Solder Dip Process Proven for Use with a Range of Part Types,” Charlie Minter, CALCE Symposium for RoHS Impact on Rework / Repair / R

32、eprocessing, College Park, MD, September 2007. 7 “Hot Solder Dip and Related Risks,” R.T. Winslow, CALCE Symposium for RoHS Impact on Rework / Repair / Reprocessing, College Park, MD, September 2007. 8 “Evaluation of Solder Dipped Parts,” Diganta Das, CALCE Symposium for RoHS Impact on Rework / Repa

33、ir / Reprocessing, College Park, MD, September 2007. 9 “Framework for Retinning and Reballing: Pb-free to SnPb,” David Cavanaugh, CALCE Symposium for RoHS Impact on Rework / Repair / Reprocessing, College Park, MD, September 2007. Copyright Government Electronics & Information Technology Association

34、 Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without lice

35、nse from IHS-,-,-ITAA Document Improvement Proposal If, in the review or use of this document, a potential change is made evident for safety, health, or technical reasons please fill in the appropriate information below and mail or FAX to: Information Technology Association of America (ITAA) Standar

36、ds & Technology Department 1401 Wilson Boulevard, Suite 1100. Arlington, VA 22209 FAX: (703) 525-2279 Document No. Document Title: Submitters Name: Telephone No.: FAX No.: E-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and/or Drawing: b. Recommended C

37、hanges: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ITAA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-