EN 60749-4-2017 en Semiconductor devices - Mechanical and climatic test methods - Part 4 Damp heat steady state highly accelerated stress test (HAST).pdf

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1、Semiconductor devices - Mechanical and climatic test methodsPart 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)BS EN 60749-4:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARDNORME EUROPENNEEUROPISCHE NORMEN 60

2、749-4June 2017ICS 31.080.01 Supersedes EN 60749-4:2002English VersionSemiconductor devices - Mechanical and climatic test methods -Part 4: Damp heat, steady state, highly accelerated stress test(HAST)(IEC 60749-4:2017)Dispositifs semiconducteurs - Mthodes dessaismcaniques et climatiques - Partie 4:

3、Essai continu fortement accelr de contrainte de chaleur humide (HAST)(IEC 60749-4:2017)Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 4: Feuchte Wrme, konstant, Prfung mit hochbeschleunigter Wirkung (HAST)(IEC 60749-4:2017)This European Standard was approved by CENELEC on 20

4、17-04-07. CENELEC members are bound to comply with the CEN/CENELECInternal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be o

5、btained on application to the CEN-CENELEC Management Centre or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified

6、 to the CEN-CENELEC Management Centre has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece

7、, Hungary, Iceland, Ireland, Italy, Latvia,Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,Switzerland, Turkey and the United Kingdom.European Committee for Electrotechnical StandardizationComit Europen de Normalisation Elec

8、trotechniqueEuropisches Komitee fr Elektrotechnische NormungCEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.Ref. No. EN 60749-4:2017 ENational forewordThis British Standard is

9、 the UK implementation of EN 60749-4:2017. It is identical to IEC 60749-4:2017. It supersedes BS EN 60749-4:2002, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtain

10、ed on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 94229 7ICS 31.080.01Compliance with

11、a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 607494:2017EUROPEAN STANDA

12、RD NORME EUROPENNE EUROPISCHE NORM EN 60749-4 June 2017 ICS 31.080.01 Supersedes EN 60749-4:2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017) Dispositifs semiconducteurs - Mtho

13、des dessais mcaniques et climatiques - Partie 4: Essai continu fortement accelr de contrainte de chaleur humide (HAST) (IEC 60749-4:2017) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 4: Feuchte Wrme, konstant, Prfung mit hochbeschleunigter Wirkung (HAST) (IEC 60749-4:2017)

14、 This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical

15、 references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibilit

16、y of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Form

17、er Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electr

18、otechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Re

19、f. No. EN 60749-4:2017 E BS EN 607494:2017EN 60749-4:2017 2 European foreword The text of document 47/2346/FDIS, future edition 2 of IEC 60749-4, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-4:2017. The following dat

20、es are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-04-07 This document su

21、persedes EN 60749-4:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-4:2

22、017 was approved by CENELEC as a European Standard without any modification. BS EN 607494:2017EN 60749-4:2017 2 European foreword The text of document 47/2346/FDIS, future edition 2 of IEC 60749-4, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and appro

23、ved by CENELEC as EN 60749-4:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-01-07 latest date by which the national standards conflicting with the document ha

24、ve to be withdrawn (dow) 2020-04-07 This document supersedes EN 60749-4:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice

25、The text of the International Standard IEC 60749-4:2017 was approved by CENELEC as a European Standard without any modification. EN 60749-4:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole

26、or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication

27、has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60749-5 - Semiconductor devices - Me

28、chanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test EN 60749-5 - 1)1) To be published. BS EN 607494:2017This page deliberately left blank 2 IEC 60749-4:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 HAST te

29、st General remarks 5 5 Test apparatus 6 5.1 Test apparatus requirements 6 5.2 Controlled conditions 6 5.3 Temperature profile 6 5.4 Devices under stress 6 5.5 Minimize release of contamination 6 5.6 Ionic contamination . 6 5.7 De-ionized water . 6 6 Test conditions 6 6.1 Test conditions requirements

30、 6 6.2 Biasing guidelines . 7 6.3 Choosing and reporting . 8 7 Procedure 8 7.1 Test device mounting 8 7.2 Ramp-up . 8 7.3 Ramp-down 8 7.4 Test clock . 8 7.5 Bias 8 7.6 Readout 9 7.7 Handling . 9 7.8 Calibration records 9 8 Failure criteria . 9 9 Safety 9 10 Summary . 9 Table 1 Temperature, relative

31、humidity and duration requirements 7 Table 2 Bias and reporting requirements 8 2 IEC 60749-4:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 HAST test General remarks 5 5 Test apparatus 6 5.1 Test apparatus requirements 6 5.2 Controlled conditions 6

32、 5.3 Temperature profile 6 5.4 Devices under stress 6 5.5 Minimize release of contamination 6 5.6 Ionic contamination . 6 5.7 De-ionized water . 6 6 Test conditions 6 6.1 Test conditions requirements 6 6.2 Biasing guidelines . 7 6.3 Choosing and reporting . 8 7 Procedure 8 7.1 Test device mounting 8

33、 7.2 Ramp-up . 8 7.3 Ramp-down 8 7.4 Test clock . 8 7.5 Bias 8 7.6 Readout 9 7.7 Handling . 9 7.8 Calibration records 9 8 Failure criteria . 9 9 Safety 9 10 Summary . 9 Table 1 Temperature, relative humidity and duration requirements 7 Table 2 Bias and reporting requirements 8 BS EN 607494:2017IEC 6

34、0749-4:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 4: Damp heat, steady state, highly accelerated stress test (HAST) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standar

35、dization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Inter

36、national Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate

37、 in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between t

38、he two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications ha

39、ve the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any mis

40、interpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding nati

41、onal or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services

42、carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National

43、 Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is dr

44、awn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall no

45、t be held responsible for identifying any or all such patent rights. International Standard IEC 60749-4 has been prepared by IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision.

46、 This edition includes the following significant technical changes with respect to the previous edition: a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1; b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent

47、test board or DUT damage; c) allowance of additional time-to-test delay or return-to-stress delay. BS EN 607494:2017IEC 60749-4:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 4: Damp heat, steady state, highly accelerated s

48、tress test (HAST) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning stan

49、dardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental an