EN 60749-37-2008 en Semiconductor devices - Mechanical and climatic test methods - Part 37 Board level drop test method using an accelerometer《半导体器件 机械和气候试验方法 第37部分 使用加速计的板级跌落试验方法》.pdf
《EN 60749-37-2008 en Semiconductor devices - Mechanical and climatic test methods - Part 37 Board level drop test method using an accelerometer《半导体器件 机械和气候试验方法 第37部分 使用加速计的板级跌落试验方法》.pdf》由会员分享,可在线阅读,更多相关《EN 60749-37-2008 en Semiconductor devices - Mechanical and climatic test methods - Part 37 Board level drop test method using an accelerometer《半导体器件 机械和气候试验方法 第37部分 使用加速计的板级跌落试验方法》.pdf(22页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARDBS EN 60749-37:2008Semiconductor devices Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer ICS 31.080.01g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g
2、53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 60749-37:2008This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 May 2008 BSI 2008ISBN 978 0 580 55509 1National forewordThis British Standard is the UK implementation o
3、f EN 60749-37:2008. It is identical to IEC 60749-37:2008. It supersedes DD IEC/PAS 62050:2004 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its
4、 secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments/corrigenda issued since publicationDate CommentsEUROPEAN S
5、TANDARD EN 60749-37 NORME EUROPENNE EUROPISCHE NORM April 2008 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2008 CENELEC - Al
6、l rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-37:2008 E ICS 31.080.01 English version Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008) Disp
7、ositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 37: Mthode dessai de chute au niveau de la carte avec utilisation dun acclromtre (CEI 60749-37:2008) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 37: Prfverfahren Fall der Leiterplatte unter Verwen
8、dung eines Beschleunigungs-Messgertes (IEC 60749-37:2008) This European Standard was approved by CENELEC on 2008-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard wit
9、hout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other langu
10、age made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Den
11、mark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 47/1937/FDIS, future editi
12、on 1 of IEC 60749-37, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-37 on 2008-03-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identi
13、cal national standard or by endorsement (dop) 2008-12-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2011-03-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60749-37:2008 was approved by CENELEC
14、 as a European Standard without any modification. _ BS EN 60749-37:2008 2 CONTENTS INTRODUCTION.4 1 Scope and object5 2 Normative references .5 3 Terms and definitions .5 4 Test apparatus and components.6 4.1 Test apparatus 6 4.2 Test components.7 4.3 Test board.7 4.4 Test board assembly .7 4.5 Numb
15、er of components and sample size .8 5 Test procedure .8 5.1 Test equipment and parameters 8 5.2 Pre-test characterization .9 5.3 Drop testing.11 6 Failure criteria and failure analysis .11 7 Summary13 Annex A (informative) Preferred board construction, material, design and layout .14 Bibliography18
16、Figure 1 Typical drop test apparatus and mounting scheme for PCB assembly 9 Figure 2 Typical shock test half-sine pulse graphic and formulae .10 Figure 3 Fundamental mode of vibration of PCB supported with four screws13 Figure A.1 Recommended test board size and layout.17 Table 1 Quantity of test bo
17、ards and components required for testing .8 Table 2 Component locations for test boards .12 Table A.1 Test board stack-up and material .14 Table A.2 Mechanical property requirements for dielectric materials 15 Table A.3 Recommended test board pad sizes and solder mask openings .16 Table A.4 X, Y loc
18、ations for components centre 17 BS EN 60749-37:2008 3 Annex ZA (normative) Normative references to international publications with theircorresponding European publications19INTRODUCTION Handheld electronic products fit into the consumer and portable market segments. Included in handheld electronic p
19、roducts are cameras, calculators, cell phones, cordless phones, pagers, palm size PCs, personal computer memory card international association (PCMCIA) cards, smart cards, personal digital assistants (PDAs) and other electronic products that can be conveniently stored in a pocket and used while held
20、 in users hand. These handheld electronic products are more prone to being dropped during their useful service life because of their size and weight. This dropping event can not only cause mechanical failures in the housing of the device but also create electrical failures in the printed circuit boa
21、rd (PCB) assemblies mounted inside the housing due to transfer of energy through PCB supports. The electrical failures may result from various failure modes such as cracking of the circuit board, track cracking on the board, cracking of solder interconnections between the components and the board, a
22、nd component cracks. The primary driver of these failures is excessive flexing of the circuit board due to input acceleration to the board created from dropping the handheld electronic product. This flexing of the board causes relative motion between the board and the components mounted on it, resul
23、ting in component, interconnect or board failures. The failure is a function of the combination of the board design, construction, material, thickness and surface finish; interconnect material and standoff height and component size. Correlation between test and field conditions is not yet fully esta
24、blished. Consequently, the test procedure is presently more appropriate for relative component performance than for use as a pass/fail criterion. Rather, results should be used to augment existing data or establish a baseline for potential investigative efforts in package/board technologies. The com
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