EN 60512-12-6-1996 en Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 12 Soldering Tests Section 6 Test 12f Sealing Ag.pdf

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1、BRITISH STANDARD Electromechanical components for electronic equipment - Basic testing procedures and measuring methods Part 12. Soldering tests Section 6. Test 12f. Sealing against flux and cleaning solvents in machine soldering * rn * The European Standasd EN 60512-12-6 : 1996 has the status of a

2、British standard ICs 31.220.01 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BS EN 1997 1996 60512-12-6 : IEC 512-12-6 : BS EN 60512-12-6 : 1997 Committees responsible for this British Standard The preparation of this British standard was entrusted by Technid Committee EPU48

3、, Electromechanical components for electronic equipment, to Subcommittee EPUW, Connectors for electronic equipment, upon which the following bodies were represented: Association of Manufacturem Allied to the Electrical and Electronic British Telecommunications plc BSI QuaiiQ Assurance Federation of

4、the Electroni- Industry Ministry of Defence Premises Cabling Association Industry (BEAMA Ltd.) This British Standard, having been prepared under the direction of the Electrotechnid Sector Board, was published under the authority of the Standards Board and comes into effect on 15 April 1997 O BSI 199

5、7 Amendments issued since publication Amd. No. Date I Te* The following BSI references reiate to the work on this standard Committee reference EPU482 Announced in BSZ Update February 1997 ISBN O 680 27314 8 4 M 4 Contents page Committees responsible Inside front cover National foreword u Foreword 2

6、Text Of EN 60612-12-6 3 I O BSI 1997 i STD-BSI BS EN bO522-12-b-ENGL 2777 m LbZLibb7 Ob07222 33T m BS EN 60612-12-6 : 1997 National foreword This Section of BS EN 60512 has been prepared by Subcommittee EPy48/2, and is the English anguage version of EN 60512-12-6 : 1996 hlectromechanical cmnp0nent.s

7、 for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests -Section 6: Test 123 Sealing against flux and deaning solvents in mhim sokiering, published by the European Committee for Electrotechnicai Standardization (CENELEC). It is identicai with IEC 512-12-

8、6 : 1996, published by the Intrnational Electrotechnical Commission (IEC). Cross-references Publication referred to EN 600681 : 1994 (IEC 68-1 : 1988) HD 323.2.20 S3 : 1988 Corresponding British Standard BS EN 60068 Environmental testing Part 1 : 1995 General and guidance Bs 2011 Enmrnental testing

9、(IEC 68-2-20 : 1979) Part 2.1T : 1981 Test I: SOMTZQ Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 8, an inside back cover and

10、back cover. ii O BSI 1997 _ STD-BSI BS EN bOSL2-12-6-ENGL 1777 lb2Libb7 0607233 27b m EUROPEAN STANDARID EN 605121243 NOW EUR0PEE”E EUROP- NORM March 1996 ICs 31.220.00 Descriptors: Testing procedures, soldering tests, test 12f, sealing against flux English version Electromechanical components for e

11、lectronic equipment - Basic testing procedures and measuring methods Part 12: Soldering tests Section 6 Test 12E Sealing against flux and cleaning solvents in machine soldering (IEC 512-12-6 : 1996) Composants lectromcaniques pour quipements lectroniques - Procdures dessai de base et mthodes de mesu

12、re pnifverfahrn Partie 12 Essais de soudure Section 6 Essai 1% Etanchit aux flux et solvants de nettoyage dans une machine souder (CE1 512-12-6 : 1996) Lten Elekh-isch-mechanische Bauelemente fr elektronische Einrichtungen - MeB- und Teil 12 Prfungen der Ltbarkeit Hauptabschnitt 6 pnifung 1% Dichthe

13、it gegen Flu3- und Reinigungsmitkl bei maschinellem (IEC 512-12-6 : 1996) This European standard was approved by CENELEC on 199603-05. CENELEC members are bound to comply with the CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a nationa

14、l stan- without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any

15、other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmask, Finland, France, Germ

16、any, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normidisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Sec

17、retariat: rue de Stassart 36, B-1060 Brussels O 1996 Copyright reserved to CENELEC members Ref. No. EN 60512-128 : 1996 E STD-BSI BS EN bO512-L2-b-ENGL 1777 Lb24bbS Ob07214 LO2 Page 2 EN 60612-12-6 : 1996 Foreword The text of document 48W420/FDIS, as prepared by SC 48B, Connectors, of IEC TC 48, Ele

18、ctromechanical components and mechanical stmw for electronic equipment, was submitted to the IEGCENELEC parallel vote and was approved by CENELEC as EN 60512-12-6 on 1996-03-05. The following dates were fixed: - latestdatebywhichthe EN has to be implemented at national level by publication of an ide

19、ntical national standard or by endorsement (dop) 199 e.g. resin-reduced foam flux, other fluxing and cleaning methods as prescribed herein. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this section of IEC

20、512-12. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this section of IEC 512-12 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicate

21、d below. Members of IEC and IS0 maintain registers of currently valid International Standards. - z .i - * m * IEC 68-1: 1988, Environmental testing - Part 7: General and guidance IEC 68-2-20: 1979, Environmental testing - Part 2: Tests - Test T: Soldering 3 Preparation of the specimen The specimen s

22、hall be preconditioned, wired and mounted as specified in the detail specif cat ion. 4 lest equipment A typical wave-soldering machine with foam flux pre-heating and single- or double-wave shall be used. NOTE - There are small machines by different manufacturers on the market which are well suited f

23、or the required test purpose. 8 Scope of technical committee 48: Standardization of electric connectors, connecting devices and mechanical structures for electronic and electrical equipment. STD-BSI BS EN b0512-22-b-ENGL 1777 = lb24bb7 Ob072Lb T85 Page 4 EN 60612-12-6 : 1996 Additives Flux concentra

24、tion Brllliant-blue s 1,4 gn Malachite-green s 2,6 gn Fuchsine 1 gn The foam-waye shall be adjusted such that, with a printed board test specimen without components, the flux just reaches the upper brim of the plated-through holes. Remarks Suited for optical proof of ingressed flux in liquid state P

25、re-heating: 70 OC to 90 OC The flux shall be dry at the end of the pre-heating zone. If the resistance against cleaning solvents has to be tested, a cleaning equipment shall be used. It may be separate from the soldering machine. The cleaning, however, shall be performed immediately after the solder

26、ing. 5 Test procedure The test specimen shall be equipped as described in the detail specification. 5.1 Immersion of the specimen The test specimen shall be immersed in the solution of flux in accordance with IEC 68-2-20. Non-activated flux is preferred. To improve the detection, it is recommended t

27、o add to the flux one of the additives in table 1. Table 1 A better determination is possible if a flux with a fluorescent additive according to table 1 is used and the specimen is inspected in ultraviolet light. 5.2 Soldering Solder according to IEC 68-2-20, annex B is preferred. Solder temperature

28、: 260 OC f 5 OC Soldering time: 5 s * 1 s 5.3 Cleaning solvents When cleaning is required by the detail specification, the cleaning solvent shall be defined or chosen from table 2. Also the test procedure shall be described in the detail specification or chosen from table 3. Possible combinations ar

29、e stated in table 4. STD - BSI Numeral 1 BS Cleaning solvents Distilled water + 10 % wetting (vol. %) 45 % ethylene glycol monobutyl ether (Pbutoxyethyl) 45 % mono-ethanolamine 10 % water EN 2 4 b0512-12-b-ENGL Isopropyl alcohol (2-propanol) specific gravity of 0,785 kgldma Ethyl alcohol Table 2 Cle

30、aning solvent LbZqbbS Test procedure (code) Ob072L7 911 Page 5 EN 60512-12-6 : 1996 2 4 xxxx xx Code A B C O Table 3 Qualificationltest method Immersion of the printed board mounting plane up to 2 mm Immersion time (2 o ) min Temperature of cleaning solvent (23 f 5) C Permitted pollution of cleaning

31、 solvent 1 mg flux (solid content) per litre No movement of the Drinted board durina immersion time 45 immersion of the printed board 25 mm, single chamber procedure Immersion time (2 t 0.2) min Temperature of cleaning solvent (23 f 5) C Permitted pollution of cleaning solvent 1 mg flux (solid conte

32、nt) per litre No movement of the printed board during immersion time Immersion of the printed board 25 mm, multbchamber procedure No movement of the printed board during immersion Ume Under consideration: - - - - - three - or four - chamber procedure; design of test chambers (cooled. heated); cleani

33、ng solvent in each chamber; cleaning solvent temperature in each chamber; immersion time in each chamber. As C. however with additional ultrasonic influence, of 35 kHt to 40 kHz Under consideration (additional): - duration of ultrasonic exposure; - - designation of chambers having ultrasonic sources

34、; position of specimens with respect to ultrasonic sources. Table 4 - (number) A BlC D I NOTE - Possible combinations are marked by an X STD-BSI BS EN bO5L2-lt2-b-ENGL 1997 m LbZLfbbS b07218 858 Page 6 EN 60512-12-6 : 1996 5.4 Printed board test specimen I The printed board test specimen shall be sp

35、ecified in the dhtail specification. Preferably B customary standard board shall be used, double-sided, with plated-through holes: - size: 100 mm x 160 mm; - thickness: 1,5 mm; - material: see detail specification; - basic grid: 2,50 mm or 2,54 mm, as appropriate for the component to be tested; - ho

36、le diameter: see detail specification. Where necessary, additional perforations shall be provided to accommodate special component mounting means. Holes outside the area used for components may be covered by suitable adhesive tape or foil. Holes below the component shall remain open, unless otherwis

37、e specified in the detail specification. 6 Preparation for testing The specimens shall be installed on the printed board test specimen for machine soldering, without preconditioning. The specimens shall rest upon the printed board. Special mounting means, if prescribed for the specimens, shall be us

38、ed. The detail specification shall specify if the specimens shall be tested singly or at a minimum distance from each other. 7 Requirements 7.1 Initial mesurements At least one electrical as well as one mechanical feature shall be measured, e.g. contact resistance, operating force or torque, operati

39、ng characteristic, and these measurements shall be carried out according to the detail specification. 7.2 Conditioning Conditioning includes fluxing, pre-heating and soldering with the wave-soldering machine according to clause 4 and, if cleaning is prescribed, cleaning with the degree of severity a

40、s laid down in the detail specification. Cleaning shall begin within 3 min after the soldering; additional cooling is not permitted. 7.3 Recovery After cleaning, the printed boards shall be stored for 24 h at standard atmospheric conditions for testing as per IEC 68-1. * rn * _ STD-BSI BS EN b0512-1

41、2-b-ENGL 1797 Lb24bbS Ob07219 794 Page 7 EN 60512-12-6 : 1996 7.4 Final measurements The same measurements as specified for initial measurements shall be carried out. The detail specification shall state the limiting values for the inspection. 7.5 Visual examination After completion of both the elec

42、trical and mechanical tests, the specimens shall be checked, by means of appropriate optical methods, for residues of flux and, if applicable, for cleaning solvents in areas specified in the detail specification. In the specified areas no residues are permitted. 8 Details to be specified When this t

43、est is required by the detail specification, the following details shall be specified: a) number of specimens; b) layout of printed board for testing, if applicable; c) specification for the masking and fitting of holes beneath the specimen(s), if applicable; d) position of the specimen(s) on the pr

44、inted board: e) cleaning solvent(s) and cleaning procedure, if applicable; f) requirements for initial and final measurements; g) definition of flux-free and, if applicable, cleaning-solvent-free areas; h) any deviation from the standard test method. STD*BSI BS EN bO512-Ii2-b-ENGL 1997 Lb24bbS 06072

45、20 40b Page 8 EN 60512-12-6 : 1996 Annex ZA (normative) Normative references to international publications with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the

46、 appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the

47、publication referred to applies (including amendments). NOTE. When an international Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Titie EN/ED Year IFIC 681 1988 Envinmmtal testing EN 600681) 1994 IFIC 68220 1979 Part 2: %ts -

48、Test II SOMw HD 323.2.20 1988 Part 1: Geneml and guidance i) EN 60068-1 includes the corrigendum October 1988 and Al : 1992 to EC 68-1. 1 HD 323.2.20 S3 includes A2 : 1987 to IEC 68-2-20. O BSI 1997 STD-BSI BS EN bOSL2-32-b-ENGL 1777 II Lb2ibbS Ob0722L 3Li2 II BS EN 60512-12-6 : 1997 List of referen

49、ces See national foreword. O BSI 1997 BS EN 1997 1996 60512-12-6 : IEC 512-12-6 : BSI 389 Chiswick High Road London w4 4AL BSI - British Standards Institution BSI is the independent national body responsible for preparing British Standards. It presents the UK view on standards in Europe and at the international level. It is incorporated by Royal Charter. Contract requirements A British Stan* does not purport to include all the necessary provisions of a contract. Users of Br