EN 60191-6-10-2003 en Mechanical standardization of semiconductor devices Part 6-10 General rules for the preparation of outline drawings of surface mounted semiconductor device pa.pdf

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1、BRITISH STANDARD BS EN 60191-6-10: 2003 Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON The European Standard EN 60191-6-10:2003 has the status of a British Stan

2、dard ICS 31.080.01 BS EN 60191-6-10:2003 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2004 BSI 31 March 2004 ISBN 0 580 43613 6 National foreword This British Standard is the official English language version of EN 60191-6-10:2003

3、. It is identical with IEC 60191-6-10:2003. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The Br

4、itish Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards O

5、nline. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the respon

6、sible European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN titl

7、e page, pages 2 to 12, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-10 NORME EUROPENNE EUROPISCHE NORM December 2003 CENEL

8、EC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved world

9、wide for CENELEC members. Ref. No. EN 60191-6-10:2003 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON (IEC 60191-6-10:2003) Norma

10、lisation mcanique des dispositifs semiconducteurs Partie 6-10: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Dimensions des botiers P-VSON (CEI 60191-6-10:2003) Mechanische Normung von Halbleiterbauelementen Teil 6-10: Allgemeine R

11、egeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - P-VSON Gehusemae (IEC 60191-6-10:2003) This European Standard was approved by CENELEC on 2003-11-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this

12、European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions

13、(English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Aust

14、ria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. EN 69101-6-012:300 - - 2 Foreword The text of document 47D/551/FDIS, future

15、 edition 1 of IEC 60191-6-10, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-10 on 2003-11-01. The following dates were fixed: latest date by which

16、the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-08-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2006-11-01 Annexes designated “normative“ are part of the body of the stan

17、dard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-10:2003 was approved by CENELEC as a European Standard without any modification. _ BSEN60191610:2003Page2 EN60191610:2003 4 061-19-610 IEC:0203(E

18、) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON 1 Scope This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures

19、and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the

20、latest edition of the referenced document (including any amendments) applies. IEC 60191(all parts), Mechanical standardization of semiconductor devices ISO/DIS 2692: Geometrical Product Specification (GPS) Geometrical tolerancing Maximum material requirement (MMR) and least material requirement (LMR

21、). 3 Terms and definitions For the purposes of this document, the following definition, as well as those given in other parts of the IEC 60191 series, apply. 3.1 P-VSON plastic very thin-profile small outline, flat package with no leads NOTE The package leads (terminals) are on opposite sides of the

22、 bottom of the package body and do not extend beyond the package body. Pa1eg BS3002:01619106NEBSEN60191610:20031 Page3 EN60191610:2003061-19-610 IEC:0230(E) 5 Date: 2003 GENERAL RULES P-VSON Drawing of Plastic non-lead packages with two parallel rows of terminals Page2 BSEN60191610:2003BS3002:016191

23、06NE2 Page4 EN60191610:2003 6 061-19-610 IEC:0230(E) Date: 2003 GENERAL RULES P-VSON Drawing of Plastic non-lead packages with two parallel rows of terminals c 1c Pae3g BSEN60191610:2003BS3002:01619106NE3 Page5 EN60191610:200360191-6-10 IEC:2003(E) 7 Date: 2003 GENERAL RULES P-VSON Drawing of Plasti

24、c non-lead packages with two parallel rows of terminals Pa4eg SBEN60191610:2003BSEN60191610:20034 Page6 EN60191610:2003 8 061-19-610 CEI :0203(E) Table 1 Dimensions to be specified for Group 1 Group 1 Group 1 includes dimensions and numerals associated with mounting of packages and different kinds o

25、f packages. The dimensions and numerals belonging to the group mean values is guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized. Limits to be observed Name Ref. Min. Nom. Max. Recommended values for the dimension mm Note Standard number of terminal

26、s n X See Table 3 9 Seated height A X A max= 1,0 Stand-off height A 1X X 7 Body height A 2 X A 2 nom. = 0,75 Terminal width plated b X X e b min.b max. 1,25 0,55 0,70 1,00 0,55 0,70 0,80 0,35 0,50 0,65 0,30 0,45 0,50 0,25 0,40 0,40 0,15 0,25 7 Terminal thickness plated c X X cmin.cmax.0,09 0,25 Pack

27、age length D X X X From 7,00 to 26,00 increment 1,00 D max.= D nom. + 0,20 D min.= D nom. 0,20 Package width E X X X E nom.From 5,00 to 13,00 increment 1,00 E max.= E nom. + 0,20 E min.= E nom. 0,20 Terminal pitch e X( * ) e nom.=1,25;1,00; 0,80; 0,65; 0,50; 0,40 4 Overall width H EX X X H E = E + 2

28、L 1 nom.A 1min.A 1 max. 0,00 0,05 Pa5eg BSEN60191610:2003BSEN60191610:20035 Page7 EN60191610:2003061-19-610 IEC:0203(E) 9 Table 1 (continued) Limits to be observed Name Ref. Min. Nom. Max. Recommended values for the dimension mm Note Length of solder part L X X Terminal position tolerance x X X max.

29、= 0,05 3 Coplanarity y X y max.= 0,05 5 Flatness y 1 X y 1 max.= 0,10 . e Lmin.Lmax. 1,25 0,70 1,30 1,00 0,70 1,20 0,80 0,50 0,90 0,65 0,40 0,80 0,50 0,35 0,75 0,40 0,35 0,75 Pa6eg 3B002:01619106NESBSEN60191610:20036 Page8 EN60191610:2003 1 0 061-19-610 CEI :0203(E) Table 2 Dimensions to be specifie

30、d for Group 2 Group 2 Group 2 includes dimensions that do not belong to Group 1, but are associated with fabrication of packages and dimensions of terminal position areas. The group is to achieve its own original purpose as an industry standard. The group belongs to the dimensions and numerals of ex

31、ternal shapes of packages useful for designers and manufacturers and the dimensions of terminal position areas that can be referenced in nominal design values specified thereto. Limits to be observed Name Ref. Min. Nom. Max. Recommended values for the dimension mm Note Terminal width unplated b 1X X

32、 7 Terminal position area in width b 2 X b 2 max. = b max. + x Terminal thickness unplated c 1X X c 1 min.c 1 max.0,09 0,21 Terminal length L 1 X L 1 nom. = 0,10 Terminal position area in length l 1 X l 1 max.= Lmax.+ (H E max. H E min. )/2 Package overhang (Z D ) X Z D nom. b 1 nom. X 1,5 e b 1 min

33、.b 1 max. 1,25 0,55 0,65 1,00 0,55 0,65 0,80 0,35 0,45 0,65 0,30 0,40 0,50 0,25 0,35 0,40 0,15 0,20 Page7 3002:01619106NESBBSEN60191610:20037 Page9 EN60191610:2003061-19-610 IEC:0203(E) 11 Table 3 Standard number of terminals e 0,40 0,50 0,65 0,80 1,00 1,25 D n Z Dn Z Dn Z Dn Z Dn Z Dn Z D7,0 34 0,3

34、0 26 0,50 20 0,575 16 0,70 12 1,00 - - 8,0 38 0,40 30 0,50 22 0,75 18 0,80 14 1,00 10 1,50 9,0 42 0,30 34 0,50 26 0,60 20 0,90 16 1,00 12 1,375 10,0 46 0,40 38 0,50 28 0,775 24 0,60 18 1,00 14 1,25 11,0 50 0,30 42 0,50 32 0,625 26 0,70 20 1,00 12,0 54 0,40 46 0,50 34 0,80 28 0,80 22 1,00 13,0 58 0,3

35、0 50 0,50 38 0,65 30 0,90 24 1,00 18 1,50 14,0 62 0,40 54 0,50 40 0,825 34 0,60 26 1,00 20 1,375 15,0 66 0,30 58 0,50 44 0,675 36 0,70 28 1,00 22 1,25 16,0 70 0,40 62 0,50 48 0,525 38 0,80 30 1,00 24 1,125 17,0 74 0,30 66 0,50 50 0,70 40 0,90 32 1,00 18,0 78 0,40 70 0,50 54 0,55 44 0,60 34 1,00 26 1

36、,50 19,0 82 0,30 74 0,50 56 0,725 46 0,70 36 1,00 28 1,375 20,0 86 0,40 78 0,50 60 0,575 48 0,80 38 1,00 30 1,25 21,0 90 0,30 82 0,50 62 0,75 50 0,90 40 1,00 32 1,125 22,0 94 0,40 86 0,50 66 0,60 54 0,60 42 1,00 23,0 98 0,30 90 0,50 68 0,775 56 0,70 44 1,00 34 1,50 24,0 102 0,40 94 0,50 72 0,625 58

37、0,80 46 1,00 36 1,375 25,0 106 0,30 98 0,50 74 0,80 60 0,90 48 1,00 38 1,25 26,0 110 0,40 102 0,50 78 0,65 64 0,60 50 1,00 40 1,125 Pa8eg 3B002:01619106NESBSEN60191610:20038 Page10 EN60191610:2003 1 2 061-19-610 CEI :2030(E) Notes ( 1 ) A plane which designates the plane of contact of the package, i

38、ncluding any stand-off, with the surface on which it will be mounted. ( 2 ) A plane drawn parallel to the seating plane through the lowest point of the package, excluding any stand-off. ( 3 ) The maximum mounting conditions apply to the positional tolerance of the terminals. (For the maximum body co

39、nditions, refer to ISO 2692). ( 4 ) Specifies the true geometric position of the terminal axis. (*) Means true geometrical position. ( 5 ) Specifies the vertical shift of the flat part of each terminal from the seating plane. ( 6 ) Shows the allowable position of the Index mark area, which is basica

40、lly 1/16 with package body size, however in case of small package body size, it is less than 1/4 with package body size, it must be included in the shaded area entirely. ( 7 ) The dimensions of the terminal section apply to the ranges 0,1 mm and 0,25mm from the end of a terminal. ( 8 ) The millimete

41、r dimensions of this package are original dimensions. ( 9 ) n refers to the total number of terminal positions. _ Pae9g 3B002:01619106NESBS3002:01619106NE9 Page11 EN60191610:2003 - - 3 EN 69101-6-012:300 Annex ZA (normative) Normative references to international publications with their corresponding

42、 European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisi

43、ons of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifica

44、tions, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191 Series Mechanical standardization of semiconductor devices EN 60191 Series ISO/DIS 2692 - Geometrical Product Specification - Geometrical tolerancing - Maximum material requirement (MMR) and least mate

45、rial requirement (LMR) - - 01egaP BSEN60191610:2003BSEN60191610:200301 Page12 EN60191610:2003BS EN 60191-6-10: 2003 BSI 389 Chiswick High Road London W4 4AL BSI British Standards Institution BSI is the independent national body responsible for preparing British Standards. It presents the UK view on

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