DLA SMD-5962-96860 REV A-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET MONOLITHIC SILICON.pdf

《DLA SMD-5962-96860 REV A-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96860 REV A-2008 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET MONOLITHIC SILICON.pdf（21页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to current MIL-PRF-38535 requirements. - MAA 08-06-04 Thomas M.Hess REV SHEET REV SHEET REV A A A A A A SHEET 15 16 17 18 19 20 REV A A A A A A A A A A A A A A REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/

2、A PREPARED BY Joseph A. Kerby CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-08-30 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WIT

3、H CLEAR AND PRESET, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-96860 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL A SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E413-08 Provided by IHSNot for Resa

4、leNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class leve

5、ls consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected i

6、n the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96860 01 Q C A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Devi

7、ce classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a n

8、on-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AHC74 Dual positive-edge-triggered D-type flip- flop with clear and preset. 1.2.3 Device class designator. The device class designator is a single letter

9、 identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. Q or V Certification and qualification to M

10、IL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lea

11、d finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENT

12、ER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ DC inp

13、ut clamp current (IIK) (VINVCC). 20 mA Continuous output current (IOUT) (VOUT= 0.0 V to VCC) 25 mA Continuous current through VCCor GND 50 mA Maximum power dissipation at TA= +55C (in still air) (PD ) 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +

14、300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +2.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to +5.5 V dc Output voltage range (VOUT). +0.0 V dc to VCCMinimum hig

15、h level input voltage (VIH): VCC= 2.0 V +1.5 V VCC= 3.0 V +2.1 V VCC= 5.5 V +3.85 V Maximum low level input voltage (VIL): VCC= 2.0 V +0.5 V VCC= 3.0 V +0.9 V VCC= 5.5 V +1.65 V Maximum high level output current (IOH): VCC= 2.0 V -50 A VCC= 3.0 V 0.3 V -4 mA VCC= 5.0 V 0.5 V -8 mA Maximum low level

16、output current (IOL): VCC= 2.0 V +50 A VCC= 3.0 V 0.3 V +4 mA VCC= 5.0 V 0.5 V +8 mA Maximum input rise or fall rate (t/V): VCC= 3.3 V 0.3 V 100 ns/V VCC= 5.0 V 0.5 V 20 ns/V Case operating temperature range (TC). -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage

17、 to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits of the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to

18、+125C. Unused inputs must be held high or low. 4/ The input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. 5/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking

19、permitted without license from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification

20、, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specificat

21、ion for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copi

22、es of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent s

23、pecified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JESD 7A - Standard for Description of 54/74HCXXXX and 54/74HCTXXXX High-Speed CMOS Devices. (Copies of these documents are available online

24、 at http:/www.eia.org/ or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this docume

25、nt, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device man

26、ufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herei

27、n. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordan

28、ce with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or Logic diagram. The block or logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load cir

29、cuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

30、ense from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electri

31、cal performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for

32、each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of n

33、ot marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compl

34、iance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance s

35、hall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 here

36、in). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-385

37、35, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change fo

38、r device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquirin

39、g activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall b

40、e in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 6 DSC

41、C FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit 2.0 V 1.9 3.0 V 2.9 IOH= -50 A 4.5 V 1, 2, 3 4.4 1 2.58 IOH= -4 mA

42、3.0 V 2, 3 2.48 1 3.94 High level output voltage 3006 VOHFor all inputs affecting output under test VIN= VIHMin or VILMax For all other inputs VIN= VCCor GND IOH= -8 mA 4.5 V 2, 3 3.8 V 2.0 V 0.1 3.0 V 0.1 IOL= +50 A 4.5 V 1, 2, 3 0.1 1 0.36 IOL= +4 mA 3.0 V 2, 3 0.50 1 0.36 Low level output voltage

43、 3007 VOLFor all inputs affecting output under test, VIN= VIHMin or VILMax For all other inputs VIN= VCCor GND IOL= +8 mA 4.5 V 2, 3 0.50 V 1 +0.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 2, 3 +1.0 A 1 -0.1 Input current low 3009 IILFor inpu

44、t under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 2.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 20.0 A Input capacitance 3012 CINTC= +25C, VIN= VCCor GND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD4/ CL= 50 p

45、F minimum f = 1 MHz See 4.4.1c 5.0 V 4 35.0 pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96860 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A

46、SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit VOLP5/ 5.0 V 4 750 Low level ground bounce n

47、oise VOLV5/ 5.0 V 4 -750 mV VOHP5/ 5.0 V 4 250 High level VCCbounce noise VOHV5/ CL= 50 pF minimum VIN= 0.0 V or VCCTA= +25C See 4.4.1d See figure 4 5.0 V 4 -400 mV 2.0 V 3.0 V Functional test 3014 6/ VIN= VIHMin. r VILMax. Verify output VOUTSee 4.4.1b 5.5 V 7, 8 L H 9 6.0 3.0 V and 3.6 V 10, 11 7.0

48、 9 5.0 _ mPRE or _ mCLR low 4.5 V and 5.5 V 10, 11 5.0 ns 9 6.0 3.0 V and 3.6 V 10, 11 7.0 9 5.0 Pulse duration twCL= 50 pF min. See figure 5 mCLK high or low 4.5 V and 5.5 V 10, 11 5.0 ns 9 6.0 3.0 V and 3.6 V 10, 11 7.0 9 5.0 Data 4.5 V and 5.5 V 10, 11 5.0 ns 9 5.0 3.0 V and 3.6 V 10, 11 5.0 9 3.0 Setup time before mCLK tsuCL= 50 pF min. See figure 5 _ mPRE or _ mCLR inactive 4.5 V and 5.5 V 10, 11 3.0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproducti