DLA SMD-5962-89950 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS DUAL NEGATIVE EDGE TRIGGERED JK FLIPFLOP WITH ASYNCHRONOUS SET AND CLEAR TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-89950 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS DUAL NEGATIVE EDGE TRIGGERED JK FLIPFLOP WITH ASYNCHRONOUS SET AND CLEAR TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89950 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS DUAL NEGATIVE EDGE TRIGGERED JK FLIPFLOP WITH ASYNCHRONOUS SET AND CLEAR TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(21页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Correct the drawing title to accurately describe the device function. Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-07-19 Thomas M. Hess B Update boilerplate paragraphs to the c
2、urrent MIL-PRF-38535 requirements. - LTG 12-12-19 Thomas M. Hess REV SHEET REV B B B B B B SHEET 15 16 17 18 19 20 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/ww
3、w.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, , ADVANCED CMOS, DUAL NEGATIVE EDGE TRIGGERED JK FLIP-FL
4、OP WITH ASYNCHRONOUS SET AND CLEAR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-01-19 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89950 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E066-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
5、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89950 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes M, Q, and B) and space ap
6、plication (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following exampl
7、e: 5962 - 89950 01 M E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q, and V RHA marked devices meet the MIL-PRF-3
8、8535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s)
9、identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT112 Dual negative edge triggered JK flip-flop with asynchronous set and clear, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product ass
10、urance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case
11、 outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 or CQCC2-N20 20 Square leadless chip carrier 1.2.5 Lead finish.
12、The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89950 DLA LAND AND MARITIME C
13、OLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) . -0.5 V dc to +6.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input diode current
14、(IIK) (0.0 V VIN, VIN VCC) 20 mA DC output diode current (IOK) (0.0 V VOUT, VOUT VCC) . 20 mA DC output current (IOUT) (per output pin) . 50 mA DC VCCor GND current (ICC, IGND) (per pin) 200 mA 3/ Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature
15、 (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C Case operating temperature range (TC) -55C to +125C 1.4 Recommended operating conditions. 1/ 2/ 4/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VI
16、N) . 0.0 V to VCC Output voltage range (VOUT) 0.0 V to VCCMaximum low level input voltage (VIL): VCC= 4.5 V and VCC= 5.5V 0.8 V Minimum high level input voltage (VIH): VCC= 4.5 V and VCC= 5.5V 2.0 V Case operating temperature range (TC) -55C to +125C Input rise or fall rate (tr, tf) maximum: (from V
17、IN= 0.8 V to 2.0 V, 2.0 V to 0.8 V) 125 mV/ns Maximum high level output current (IOH) . -24 mA Maximum low level output current (IOL) . 24 mA 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw
18、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88
19、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https
20、:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device, Extended operation at the maximum levels may degrade performance and a
21、ffect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ For packages with multiple VCCand GND pins, this value repres
22、ents the maximum total current flowing into or out of all VCCor GND pins. 4/ Unless otherwise specified the values listed above shall apply over the full VCCand TCrecommended operating range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M
23、ICROCIRCUIT DRAWING SIZE A 5962-89950 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these
24、 documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. JESD78 - IC Latch-Up Test. (Copies of these documents are available online at http:/www.jedec.org o
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